Weak Index Guiding of Interband Lasers Bonded to GaAs Substrates

Patent metadata

Field	Value
Publication number	US-2023261442-A1
Application number	US-202318165956-A
Country	US
Kind code	A1
Filing date	Feb 8, 2023
Priority date	Feb 11, 2022
Publication date	Aug 17, 2023
Grant date	—

Abstract

Semiconductor laser architectures that provide weak index guiding of interband cascade lasers (ICLs) processed on a native III-V substrate and of ICLs grown on GaAs or integrated on GaAs by heterogeneous bonding. Weak index guiding of a ridge waveguide semiconductor laser can enhance the stability of lasing in the fundamental lateral mode, so as to allow a wider ridge to maintain stable single-lateral-mode operation.

First claim

What is claimed is:

1 . A weakly index-guided interband cascade laser (ICL), comprising:
a GaAs substrate; a high-index n-type layer disposed on an upper surface of the substrate; an n+ bottom contact layer disposed on an upper surface of the high-index n-type layer; and an inner laser ridge disposed on an upper surface of the n+ bottom contact layer, the inner laser ridge comprising:
a plurality of active ICL stages formed on an upper surface of the n+ bottom contact layer;
an n-type top cladding layer formed on an upper surface of the active ICL stages; and
an n+ top contact layer;
wherein a refractive index of the n-type top cladding layer is lower than a refractive index of the high-index n-type layer; wherein the high-index n-type layer is sufficiently thick that a sufficient fraction of the fundamental lateral optical mode profile lies below the etch depth of the inner laser ridge to impose weak index guiding on at least one predetermined optical mode in the inner laser ridge; and wherein the inner laser ridge is not so wide that significant lasing occurs in higher-order lateral modes.

2 . The weakly index-guided interband cascade laser (ICL) according to claim 1 , further comprising:
an n-type bottom cladding layer disposed on the high-index n-type layer; and a high-index n-type separate confinement layer (SCL) disposed on the n-type bottom cladding layer; wherein a refractive index of the n-type top cladding layer is lower than a refractive index of the high-index n-type SCL; wherein a refractive index of the n-type bottom cladding layer is lower than a refractive index of the high-index n-type SCL; wherein the high-index n-type SCL is sufficiently thick that a sufficient fraction of the fundamental lateral optical mode profile lies below the etch depth of the inner laser ridge to impose weak index guiding on at least one predetermined optical mode in the laser waveguide; and wherein the inner laser ridge is not so wide that significant lasing occurs in higher-order lateral modes.

3 . The weakly index-guided ICL according to claim 1 , wherein the high-index layer comprises an n-type GaSb buffer layer.

4 . The weakly index-guided ICL according to claim 2 , wherein the n-type bottom cladding layer comprises n-type InAs—AlSb and the high-index n-type SCL comprises an n-type GaSb SCL.

5 . A weakly index-guided interband cascade laser (ICL) comprising:
a GaAs-based substrate comprising a GaAs layer and a high-index separate confinement layer (SCL) formed on top of the GaAs layer; a III-V gain region disposed on the GaAs-based substrate, the III-V gain region comprising a plurality of layers epitaxially grown on a GaSb or InAs substrate and then bonded to the GaAs substrate, the layers including:
a first n+ contact layer;
an n-type cladding layer adjacent the first n + contact layer;
a plurality of active ICL stages adjacent the n-type cladding layer on a first predefined portion of the n-type cladding layer; and
a second n+ contact layer adjacent the n-type cladding layer;
wherein a portion of the III-V gain region is removed to a depth near to a bottom or below a bottom of the active ICL stages to form an inner laser ridge; wherein the active ICL stages have a refractive index higher than a refractive index of the n-type cladding layer; wherein the high-index SCL has a refractive index higher than that of the n-type cladding layer of the III-V gain chip and of at least one underlying layer in the GaAs-based substrate; wherein the high-index SCL is sufficiently thick that a sufficient fraction of the fundamental lateral optical mode profile lies below the active ICL stages to impose weak index guiding on at least one predetermined optical mode in the laser waveguide; and wherein the inner laser ridge is not so wide that significant lasing occurs in higher-order lateral modes.

6 . The weakly-index-guided ICL according to claim 5 , wherein one or more layers in the GaAs-based substrate is pre-patterned with a distributed feedback (DFB), distributed Bragg reflector (DBR), discrete mode (DM), photonic crystal, or other grating before the III-V gain chip is disposed thereon.

7 . The weakly-index-guided ICL according to claim 6 , wherein:
the SCL is pre-patterned with a DFB grating that is pre-patterned in portions of the outer ridge and laterally on each side of the inner ridge.

8 . The weakly-index-guided ICL according to claim 5 , wherein an upper surface of the GaAs-based substrate is patterned to incorporate at least one taper to a narrower GaAs-based passive waveguide.

9 . The weakly-index-guided ICL according to claim 5 , wherein a grating etched into one or more layers of the GaAs-based substrate provides sufficient internal feedback to enable lasing from the laser ridge without the presence of end facets in the laser cavity.

10 . The weakly-index-guided ICL according to claim 5 , wherein a grating etched into one or more layers of the GaAs-based substrate is a 2 nd -order DFB grating that provides surface emission from the laser cavity.

11 . The weakly-index-guided ICL according to claim 9 , wherein:
the high-index SCL comprises single-crystal Ge; the first n + contact layer comprises n+ InAsSb; the n-type cladding layer comprises an n-type InAs—AlSb superlattice; and the second n+ contact layer comprises n+ InAs(Sb).

12 . A weakly index-guided interband cascade laser (ICL) comprising:
a GaAs-based substrate; a III-V gain region disposed on top of the GaAs-based substrate, the III-V gain region comprising a plurality of layers epitaxially grown on a GaSb or InAs substrate, the layers including:
a first n+ contact layer;
an n-type cladding layer adjacent the first n + contact layer;
a plurality of active ICL stages adjacent the n-type cladding layer; and
a second n+ contact layer; and
a high-index SCL adjacent the active ICL stages;
wherein a portion of said III-V gain region is removed to a depth near to or below a bottom of the active ICL stages to form an inner laser ridge; wherein the active ICL stages have a refractive index higher than a refractive index of the n-type cladding layer; wherein the high-index SCL has a refractive index higher than that of the n-type cladding layer of the III-V gain region and of at least one underlying layer in the GaAs-based substrate; wherein the high-index SCL is sufficiently thick that a sufficient fraction of the fundamental lateral optical mode profile lies below the active ICL stages to impose weak index guiding on at least one predetermined optical in the laser waveguide; and wherein the inner laser ridge is not so wide that significant lasing occurs in higher-order lateral modes.

13 . The weakly-index-guided ICL according to claim 12 , wherein:
the first n + contact layer comprises n+ InAsSb; the n-type cladding layer comprises an n-type InAs—AlSb superlattice; the second n+ contact layer comprises n+ InAs(Sb); and the high-index SCL comprises GaSb.

Assignees

• Us Gov Sec Navy

Inventors

• Meyer Jerry R
• Spott Alexander
• Jayaraman Vijaysekhar
• Kim Chul Soo
• Kim Mijin
• Canedy Chadwick L
• Merritt Charles D
• Bewley William W
• Vurgaftman Igor

Classifications

• H01S5/3401 Primary

  having no PN junction, e.g. unipolar lasers, intersubband lasers, quantum cascade lasers · CPC title

• H01S5/22

  having a ridge or stripe structure · CPC title

• H01S2301/173

  The laser chip comprising special buffer layers, e.g. dislocation prevention or reduction · CPC title

• H01S5/0208

  Semi-insulating substrates · CPC title

• H01S5/02469

  Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title