Housings for electronic devices

Patent metadata

Field	Value
Publication number	US-2023259179-A1
Application number	US-202018011493-A
Country	US
Kind code	A1
Filing date	Jul 27, 2020
Priority date	Jul 27, 2020
Publication date	Aug 17, 2023
Grant date	—

Abstract

The present disclosure is drawn to housings for electronic devices. In one example, a housing for an electronic device can include a rigid substrate having an exterior surface including a recessed region positioned at an opening extending through the rigid substrate connecting the recessed region to an interior surface of the rigid substrate. A conductive metal antenna is conformally carried by the recessed region and positioned at the opening.

First claim

What is claimed is:

1 . A housing for an electronic device comprising:
a rigid substrate having an exterior surface including a recessed region positioned at an opening extending through the rigid substrate connecting the recessed region to an interior surface of the rigid substrate; and a conductive metal antenna conformally carried by the recessed region to and positioned at the opening.

2 . The housing for an electronic device of claim 1 , wherein the rigid substrate comprises metal, plastic, carbon fiber, a composite, or a combination thereof.

3 . The housing for an electronic device of claim 1 , wherein the rigid substrate includes the metal and wherein the housing further comprises an insulating layer electrically separating the conductive metal antenna from the metal of the rigid substrate.

4 . The housing for an electronic device of claim 1 , further comprising a solid filler layer on the conductive metal antenna over the recessed region, wherein the solid filler layer has a surface flush with a region of the exterior surface adjacent to the recessed region.

5 . The housing for an electronic device of claim 1 , further comprising a primer coat, a base coat, or both, over the conductive metal antenna and the exterior surface of the rigid substrate, wherein the primer includes a polymer and wherein the base coat includes a polymer and a pigment.

6 . The housing for an electronic device of claim 5 , further comprising a top coat over the primer coat, base coat, or both, wherein the top coat comprises a thermal curing resin or an ultraviolet-curing resin.

7 . The housing of claim 1 , wherein the conductive metal antenna extends from the recessed region into the opening.

8 . An electronic device comprising:
an electronic component; and a housing enclosing the electronic component, wherein the housing comprises:
a rigid substrate having an exterior surface including a recessed region positioned at an opening extending through the rigid substrate connecting the recessed region to an interior surface of the rigid substrate, and
a conductive metal antenna conformally carried by the recessed region and positioned at the opening.

9 . The electronic device of claim 8 , wherein the electronic device is a laptop computer, a desktop computer, a tablet computer, a smartphone, a television, or a printer.

10 . The electronic device of claim 8 , wherein the conductive metal antenna is a WiFi antenna, a Bluetooth® antenna, a cellular antenna, or a combination thereof.

11 . The electronic device of claim 8 , wherein the electronic component is electrically coupled with the conductive metal antenna through the opening.

12 . A method of making a housing for an electronic device comprising:
forming a recessed region in an exterior surface of a rigid substrate; forming an opening through the rigid substrate connecting the exterior surface to an interior surface thereof, wherein the recessed region is positioned at the opening; and conformally depositing a conductive metal in the recessed region to form a conductive metal antenna positioned at the opening and within the recessed region.

13 . The method of claim 12 , wherein conformally depositing the conductive metal includes lithographically patterning the layer of conductive metal to form the conductive metal antenna.

14 . The method of claim 12 , wherein conformally depositing the layer of conductive metal includes electrolessly plating the conductive metal and thickening the conductive metal by electroplating to form the conductive metal antenna.

15 . The method of claim 12 , further comprising applying a primer coat, a base coat, or both, over the conductive metal antenna, and applying a top coat over the primer coat, base coat, or both, wherein the primer includes a polymer, wherein the base coat includes a polymer and a pigment, and wherein the top coat comprises a thermal curing resin or an ultraviolet-curing resin.

Assignees

• Hewlett Packard Development Co

Inventors

• Chang Chi Hao
• Huang Hendry
• Wu Kuan-Ting

Classifications

• G06F1/1698 Primary

  the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone (details of antennas disposed inside a computer H01Q1/2266) · CPC title

• G06F1/1656 Primary

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• H01Q1/22

  by structural association with other equipment or articles · CPC title

• H01Q1/40

  Radiating elements coated with or embedded in protective material · CPC title

• H04M1/026

  Details of the structure or mounting of specific components · CPC title