Pattern forming apparatus for base material, pattern forming method, base material, and container

US2023219162A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023219162-A1
Application numberUS-202318115781-A
CountryUS
Kind codeA1
Filing dateMar 1, 2023
Priority dateSep 30, 2020
Publication dateJul 13, 2023
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A pattern forming apparatus for a base material includes a holding unit and a pattern forming unit. The holding unit is configured to hold a base material on which one of a protrusion shape portion and a recess shape portion is formed. The pattern forming unit is configured to form a pattern on the base material. The pattern is formed on at least one of the protrusion shape portion, the recess shape portion, a periphery of the recess shape portion, a periphery of the protrusion shape portion, a portion along the protrusion shape portion, and a portion along the recess shape portion.

First claim

Opening claim text (preview).

What is claimed is: 1 . A pattern forming apparatus for a base material, comprising: a holding unit configured to hold a base material on which one of a protrusion shape portion and a recess shape portion is formed; and a pattern forming unit configured to form a pattern on the base material, wherein the pattern is formed on at least one of the protrusion shape portion, the recess shape portion, a periphery of the recess shape portion, a periphery of the protrusion shape portion, a portion along the protrusion shape portion, and a portion along the recess shape portion. 2 . The pattern forming apparatus according to claim 1 , wherein the pattern forming unit is configured to form the pattern across two or more of a top portion of the protrusion shape portion, a side portion of the protrusion shape portion, a bottom portion of the recess shape portion, a side portion of the recess shape portion, the periphery of the protrusion shape portion, and the periphery of the recess shape portion. 3 . The pattern forming apparatus according to claim 1 , wherein the pattern forming unit is configured to form the pattern by laser irradiation. 4 . The pattern forming apparatus according to claim 2 , wherein the pattern comprises an aggregation of dots, and the pattern forming unit is configured to form the dots by laser irradiation. 5 . The pattern forming apparatus according to claim 3 , wherein the pattern forming unit is configured to change a focal position of laser. 6 . The pattern forming apparatus according to claim 5 , wherein the pattern forming unit is configured to change intensity of laser. 7 . The pattern forming apparatus according to claim 3 , wherein the pattern forming unit is configured to change a laser irradiation direction. 8 . The pattern forming apparatus according to claim 3 , further comprising a position detection unit configured to detect a position of the one of the protrusion shape portion and the recess shape portion. 9 . The pattern forming apparatus according to claim 8 , further comprising a distance detection unit configured to detect a distance to the one of the protrusion shape portion and the recess shape portion. 10 . A pattern forming method for a base material, comprising: preparing a base material on which one of a protrusion shape portion and a recess shape portion is formed; and forming a pattern on one of the protrusion shape portion, the recess shape portion, a periphery of the protrusion shape portion, a periphery of the recess shape portion, a portion along the protrusion shape portion, and a portion along the recess shape portion. 11 . A base material on which one of a protrusion shape portion and a recess shape portion is formed, wherein a pattern is formed on at least one of the protrusion shape portion, the recess shape portion, a periphery of the protrusion shape portion, a periphery of the recess shape portion, a portion along the protrusion shape portion, and a portion along the recess shape portion. 12 . The base material according to claim 11 , wherein the pattern is formed on one of a top portion of the protrusion shape portion, a side portion of the protrusion shape portion, a bottom portion of the recess shape portion, a side portion of the recess shape portion, the periphery of the protrusion shape portion, and the periphery of the recess shape portion. 13 . The base material according to claim 12 , wherein the pattern is formed across two or more of the top portion of the protrusion shape portion, the side portion of the protrusion shape portion, the bottom portion of the recess shape portion, the side portion of the recess shape portion, the periphery of the protrusion shape portion, and the periphery of the recess shape portion. 14 . The base material according to claim 11 , wherein the protrusion shape portion and the recess shape portion are formed by embossing. 15 . A container comprising the base material according to claim 11 .

Assignees

Inventors

Classifications

  • using lasers · CPC title

  • for heating selectively {by radiation or ultrasonic waves} · CPC title

  • B23K26/032Primary

    using optical means · CPC title

  • taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence) · CPC title

  • for perforating, scoring {, slitting,} or applying code or date marks on material prior to packaging {(scoring ampoules B65B3/006)} · CPC title

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What does patent US2023219162A1 cover?
A pattern forming apparatus for a base material includes a holding unit and a pattern forming unit. The holding unit is configured to hold a base material on which one of a protrusion shape portion and a recess shape portion is formed. The pattern forming unit is configured to form a pattern on the base material. The pattern is formed on at least one of the protrusion shape portion, the recess …
Who is the assignee on this patent?
Akatsu Kazuhiro, Hirayama Rie, Fujita Kazuhiro, and 1 more
What technology area does this patent fall under?
Primary CPC classification B23K26/032. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Jul 13 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).