Module and electronic component

Patent metadata

Field	Value
Publication number	US-2023209789-A1
Application number	US-202318178588-A
Country	US
Kind code	A1
Filing date	Mar 6, 2023
Priority date	Sep 8, 2020
Publication date	Jun 29, 2023
Grant date	—

Abstract

A module includes a substrate having main surfaces; components mounted on at least one main surface of the substrate; a sealing resin on a surface of the substrate to embed the components; and a shielding film containing Cu as a main component and covering a top surface and at least one side surface of the sealing resin, wherein a surface of the shielding film is directly covered by a first Ni layer containing Ni—B or Ni—N as a main component, and a surface of the first Ni layer is covered by a second Ni layer containing Ni—P as a main component.

First claim

1 . A module comprising:
a substrate having main surfaces; a component mounted on at least one of the main surfaces of the substrate; a sealing resin on a surface of the substrate to embed the component; and a shielding film containing Cu as a main component and covering a top surface and at least one side surface of the sealing resin, wherein a surface of the shielding film is directly covered by a first Ni layer containing Ni—B or Ni—N as a main component, and a surface of the first Ni layer is covered by a second Ni layer containing Ni—P as a main component.

2 . The module according to claim 1 ,
wherein a surface of an edge where the top surface and the side surface of the sealing resin are connected to each other is covered by the shielding film, and a surface of the shielding film covering the surface of the edge is directly covered by the first Ni layer.

3 . The module according to claim 1 ,
wherein a thickness of the second Ni layer is equal to or greater than a thickness of the first Ni layer.

4 . A module comprising:
a substrate having main surfaces; a component mounted on at least one of the main surfaces of the substrate; a sealing resin on a surface of the substrate to embed the component; and a shielding film containing Cu as a main component and covering a top surface and at least one side surface of the sealing resin, wherein a surface of the shielding film is directly covered by a first Co layer containing Co—B or Co—N as a main component, and a surface of the first Co layer is covered by a second Co layer containing Co—P as a main component.

5 . The module according to claim 4 ,
wherein a surface of an edge where the top surface and the side surface of the sealing resin are connected to each other is covered by the shielding film, and a surface of the shielding film covering the surface of the edge is directly covered by the first Co layer.

6 . The module according to claim 4 ,
wherein a thickness of the second Co layer is equal to or greater than a thickness of the first Co layer.

7 . An electronic component comprising:
a ceramic body; and a shielding film containing Cu as a main component and covering a top surface and at least one side surface of the ceramic body, wherein a surface of the shielding film is directly covered by a first Ni layer containing Ni—B or Ni—N as a main component, and a surface of the first Ni layer is covered by a second Ni layer containing Ni—P as a main component.

8 . The electronic component according to claim 7 ,
wherein a surface of an edge where a top surface and a side surface of the ceramic body are connected to each other is covered by the shielding film, and a surface of the shielding film covering the surface of the edge is directly covered by the first Ni layer.

9 . The electronic component according to claim 7 ,
wherein a thickness of the second Ni layer is equal to or greater than a thickness of the first Ni layer.

10 . An electronic component comprising:
a ceramic body; and a shielding film containing Cu as a main component and covering a top surface and at least one side surface of the ceramic body, wherein a surface of the shielding film is directly covered by a first Co layer containing Co—B or Co—N as a main component, and a surface of the first Co layer is covered by a second Co layer containing Co—P as a main component.

11 . The electronic component according to claim 10 ,
wherein a surface of an edge where a top surface and to a side surface of the ceramic body are connected to each other is covered by the shielding film, and a surface of the shielding film covering the surface of the edge is directly covered by the first Co layer.

12 . The electronic component according to claim 10 ,
wherein a thickness of the second Co layer is equal to or greater than a thickness of the first Co layer.

13 . The electronic component according to claim 7 ,
wherein the electronic component is used as an LC filter.

14 . The module according to claim 2 ,
wherein a thickness of the second Ni layer is equal to or greater than a thickness of the first Ni layer.

15 . The module according to claim 5 ,
wherein a thickness of the second Co layer is equal to or greater than a thickness of the first Co layer.

16 . The electronic component according to claim 8 ,
wherein a thickness of the second Ni layer is equal to or greater than a thickness of the first Ni layer.

17 . The electronic component according to claim 11 ,
wherein a thickness of the second Co layer is equal to or greater than a thickness of the first Co layer.

18 . The electronic component according to claim 8 ,
wherein the electronic component is used as an LC filter.

19 . The electronic component according to claim 9 ,
wherein the electronic component is used as an LC filter.

20 . The electronic component according to claim 10 ,
wherein the electronic component is used as an LC filter.

Assignees

• Murata Manufacturing Co

Inventors

• Saito Junichi
• Mizushiro Masaaki

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title