Micro led package and display module comprising same

Patent metadata

Field	Value
Publication number	US-2023207743-A1
Application number	US-202318115460-A
Country	US
Kind code	A1
Filing date	Feb 28, 2023
Priority date	Aug 28, 2020
Publication date	Jun 29, 2023
Grant date	—

Abstract

A light-emitting diode package includes a transparent layer; a plurality of light-emitting diodes disposed on a surface of the transparent layer, wherein each of the plurality of light-emitting diodes comprise a light-emitting surface that faces the transparent layer; a spacer disposed on the surface of the transparent layer; a protection member configured to cover the plurality of light-emitting diodes; and a plurality of light-emitting diode electrode pads comprising an electrode pad on each of the plurality of light-emitting diodes; wherein a first height from the surface of the transparent layer to an upper end of the spacer is larger than a second height from the surface of the transparent layer to the plurality of light-emitting diode electrode pads.

First claim

What is claimed is:

1 . A light-emitting diode package, comprising:
a transparent layer; a plurality of light-emitting diodes disposed on a surface of the transparent layer, wherein each of the plurality of light-emitting diodes comprise a light-emitting surface that faces the transparent layer; a spacer disposed on the surface of the transparent layer; a protection member configured to cover the plurality of light-emitting diodes; and a plurality of light-emitting diode electrode pads comprising an electrode pad on each of the plurality of light-emitting diodes; wherein a first height from the surface of the transparent layer to an upper end of the spacer is larger than a second height from the surface of the transparent layer to the plurality of light-emitting diode electrode pads.

2 . The light-emitting diode package of claim 1 , wherein the spacer comprises an organic matter.

3 . The light-emitting diode package of claim 1 , wherein the spacer comprises a closed loop shape that surrounds the plurality of light-emitting diodes.

4 . The light-emitting diode package of claim 3 , wherein the spacer is formed along an outer edge of the transparent layer.

5 . The light-emitting diode package of claim 3 , further comprising a plurality of package electrode pads disposed at the upper end of the spacer; and
wherein the plurality of package electrode pads are electrically connected with the plurality of light-emitting diode electrode pads through a plurality of wirings.

6 . The light-emitting diode package of claim 5 , wherein the plurality of wirings are disposed at a surface of the plurality of light-emitting diodes, at the surface of the transparent layer, and along a surface of the spacer.

7 . The light-emitting diode package of claim 1 , wherein the protection member comprises a film that covers the plurality of light-emitting diodes and wherein the protection member is spaced apart from an upper end of the plurality of light-emitting diodes.

8 . The light-emitting diode package of claim 7 , further comprising a plurality of package electrode pads disposed at the upper end of the spacer;
wherein the protection member comprises an anisotropic conductive film, and wherein the plurality of package electrode pads are covered by the protection member.

9 . The light-emitting diode package of claim 7 , further comprising a plurality of package electrode pads disposed at the upper end of the spacer;
wherein the protection member comprises a non-conductive film, and wherein the plurality of package electrode pads are not covered by the protection member.

10 . The light-emitting diode package of claim 1 , further comprising an insulating member;
wherein the insulating member is disposed in a space formed by the spacer and wherein the insulating member covers the plurality of light-emitting diodes.

11 . The light-emitting diode package of claim 1 , further comprising an adhesive layer formed on the surface of the transparent layer, and
wherein the adhesive layer attaches the plurality of light-emitting diodes to the transparent layer.

12 . The light-emitting diode package of claim 1 , wherein the plurality of light-emitting diodes comprise a flip chip structure in which the plurality of light-emitting diode electrode pads comprises a pair of electrode pads on each of the plurality of light-emitting diodes on a surface opposite of the light-emitting surface.

13 . The light-emitting diode package of claim 1 , wherein the spacer comprises a width which corresponds to a distance between a first side surface that corresponds to an outer edge of the transparent layer and a second side surface opposite the first side surface.

14 . The light-emitting diode package of claim 1 , wherein the spacer comprises a width which corresponds to a distance between a first side surface that corresponds to an outer edge of the transparent layer and a second side surface that is in contact with an adjacent light-emitting diode.

15 . The light-emitting diode package of claim 1 , wherein the spacer is configured to cover the plurality of light-emitting diodes.

16 . A light-emitting diode package, comprising:
a transparent layer; a plurality of light-emitting diodes disposed on a surface of the transparent layer, wherein each of the plurality of light-emitting diodes comprise a light-emitting surface that faces the transparent layer and an electrode pad on a surface opposite the light-emitting surface; a protection member configured to cover the plurality of light-emitting diodes; and a spacer disposed on the surface of the transparent layer and configured to space the protection member apart from the transparent layer, wherein the spacer surrounds the plurality of light-emitting diodes.

17 . The light-emitting diode package of claim 16 , further comprising an insulating member disposed in a space between the transparent layer and the protection member.

18 . The light-emitting diode package of claim 17 , wherein the spacer comprises an organic matter;
wherein the spacer is formed along an outer edge of the transparent layer, and wherein the spacer comprises a closed loop.

19 . A light-emitting diode package, comprising:
a transparent layer; a plurality of light-emitting diodes disposed on a surface of the transparent layer, wherein each of the plurality of light-emitting diodes comprise a light-emitting surface that faces the transparent layer and a plurality of electrode pads comprising an electrode pad on each of the plurality of light-emitting diodes on a surface opposite the light-emitting surface a protection member configured to cover the plurality of light-emitting diodes; and a spacer disposed the surface of the transparent layer and configured to space the protection member apart from the transparent layer, wherein the protection member is spaced apart from the plurality of electrode pads.

20 . The light-emitting diode package of claim 19 , wherein the spacer surrounds the plurality of light-emitting diodes; and
wherein the plurality of electrode pads comprise an electrode pad on each of the plurality of light-emitting diodes on the surface opposite the light-emitting surface.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Hyungjin
• Kang Jinhee

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10H20/85 Primary

  Packages · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/8506 Primary

  Containers · CPC title