Apparatus for treating substrate and method for treating substrate

Patent metadata

Field	Value
Publication number	US-2023201883-A1
Application number	US-202218068869-A
Country	US
Kind code	A1
Filing date	Dec 20, 2022
Priority date	Dec 24, 2021
Publication date	Jun 29, 2023
Grant date	—

Abstract

Disclosed is an apparatus for treating a substrate. The apparatus for treating the substrate includes a liquid treating chamber for liquid-treating the substrate by supplying a treatment liquid to the substrate, a drying chamber for drying the substrate by supplying a process fluid to the substrate, a transfer unit for transferring the substrate between the liquid treating chamber and the drying chamber, and a rear surface cleaning unit for cleaning a rear surface of the substrate, in which the rear surface cleaning unit may clean the rear surface of the substrate while transferring the substrate from the liquid treating chamber to the drying chamber.

First claim

1 . An apparatus for treating a substrate, comprising:
a liquid treating chamber for liquid-treating the substrate by supplying a treatment liquid to the substrate; a drying chamber for drying the substrate by supplying a process fluid to the substrate; a transfer unit for transferring the substrate between the liquid treating chamber and the drying chamber; and a rear surface cleaning unit for cleaning a rear surface of the substrate, wherein the rear surface cleaning unit cleans the rear surface of the substrate while transferring the substrate from the liquid treating chamber to the drying chamber.

2 . The apparatus for treating the substrate of claim 1 , wherein the transfer unit comprises a transfer robot that moves inside a transfer frame for providing a transfer space and has a transfer hand on which the substrate is seated.

3 . The apparatus for treating the substrate of claim 2 , wherein the rear surface cleaning unit includes a contact member that comes into contact with the rear surface of the substrate to remove the treatment liquid remaining on the rear surface of the substrate.

4 . The apparatus for treating the substrate of claim 3 , wherein the contact member is provided on the transfer robot.

5 . The apparatus for treating the substrate of claim 4 , wherein the contact member is located below the hand and comes into contact with the rear surface of the substrate by vertical movement of the hand on which the substrate is placed.

6 . The apparatus for treating the substrate of claim 5 , wherein a plurality of holes penetrating through upper and lower ends of the contact member are formed in the contact member, and
the holes are spaced apart from each other along the longitudinal direction of the contact member.

7 . The apparatus for treating the substrate of claim 3 , wherein a rear surface cleaning frame having a slot on which the substrate is seated is provided inside the transfer frame,
the rear surface cleaning frame is located between the liquid treating chamber and the transfer frame, and the contact member is provided inside the rear surface cleaning frame.

8 . The apparatus for treating the substrate of claim 7 , wherein the contact member is provided at a position in contact with the rear surface of the substrate in the process of transferring the substrate seated on the hand into the rear surface cleaning frame.

9 . The apparatus for treating the substrate of claim 2 , wherein the rear surface cleaning unit comprises a non-contact member that is spaced apart from the rear surface of the substrate to remove the treatment liquid remaining on the rear surface of the substrate in a non-contact manner

10 . The apparatus for treating the substrate of claim 9 , wherein the non-contact member supplies a decontamination source for removing the treatment liquid toward the rear surface of the substrate, and
the decontamination source is provided by heat or airflow.

11 . The apparatus for treating the substrate of claim 10 , wherein the non-contact member is provided on the transfer robot.

12 . The apparatus for treating the substrate of claim 10 , wherein a rear surface cleaning frame having slots on which the substrate is seated is provided inside the transfer frame,
the rear surface cleaning frame is located between the liquid treating chamber and the transfer frame, and the non-contact member is provided inside the rear surface cleaning frame.

13 . The apparatus for treating the substrate of claim 1 , wherein the drying chamber comprises a support for supporting the substrate, and
the support supports an edge region of the rear surface of the substrate which has been liquid-treated.

14 .- 19 . (canceled)

20 . An apparatus of treating a substrate comprising:
a liquid treating chamber for liquid-treating a substrate by supplying a treatment liquid to an upper surface of the substrate; a drying chamber for drying the substrate by supplying a supercritical fluid to the substrate; a transfer unit for transferring the substrate between the liquid treating chamber and the drying chamber; and a rear surface cleaning unit for cleaning the rear surface of the substrate, wherein the drying chamber comprises a housing having an inner space; and a support unit for supporting an edge region of the rear surface of the substrate which has been liquid-treated in the inner space, wherein the rear surface cleaning unit removes the treatment liquid remaining on the rear surface of the substrate by cleaning the rear surface of the substrate in a contact method and/or a non-contact method while the substrate is transferred from the liquid treating chamber to the drying chamber.

Assignees

• Semes Co Ltd

Inventors

• Choi Yong Hyun
• Lee Young Hun
• Im Yong Joon
• Oh Seung Hoon
• Choi Tae Jong
• Ko Yong Sun
• Lee Sang Min
• Jung Jin Woo

Classifications

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/0456 Primary

  in-line arrangement · CPC title

• B25J11/0095

  Manipulators transporting wafers · CPC title