Vibration sensor

Patent metadata

Field	Value
Publication number	US-2023199370-A1
Application number	US-202318168585-A
Country	US
Kind code	A1
Filing date	Feb 14, 2023
Priority date	Dec 28, 2020
Publication date	Jun 22, 2023
Grant date	—

Abstract

The present disclosure provides a vibration sensor. The vibration sensor may include a vibration receiver and an acoustic transducer. The vibration receiver may include a housing, a limiter and a vibration unit. The housing and the acoustic transducer may form an acoustic cavity. The vibration unit may be located in the acoustic cavity to separate the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The acoustic transducer may be acoustically connected to the first acoustic cavity. The housing may be configured to generate a vibration based on an external vibration signal. The vibration unit may change an acoustic pressure within the first acoustic cavity in response to the vibration of the housing, such that the acoustic transducer generates an electrical signal. The vibration unit may include a mass element and an elastic element. A first side of the elastic element may be connected around a side wall of the mass element. A second side of the elastic element may be connected with the limiter.

First claim

1 . A vibration sensor, comprising:
a vibration receiver and an acoustic transducer, wherein: the vibration receiver includes a housing, a limiter and a vibration unit, the housing and the acoustic transducer form an acoustic cavity, the vibration unit is located in the acoustic cavity to separate the acoustic cavity into a first acoustic cavity and a second acoustic cavity, the acoustic transducer is acoustically connected to the first acoustic cavity, the housing is configured to generate a vibration based on an external vibration signal, the vibration unit changes an acoustic pressure within the first acoustic cavity in response to the vibration of the housing, such that the acoustic transducer generates an electrical signal, the vibration unit includes a mass element and an elastic element, a first side of the elastic element is connected around a side wall of the mass element, and a second side of the elastic element is connected with the limiter.

2 . The vibration sensor of claim 1 , wherein:
the limiter is located between the housing and the acoustic transducer, and the housing, the limiter and the acoustic transducer form the acoustic cavity.

3 . The vibration sensor of claim 2 , wherein:
the acoustic transducer includes a substrate, the limiter is connected with the substrate, the limiter, the vibration unit, and the substrate form the first acoustic cavity, the elastic element is connected between the limiter and the mass element, and the elastic element and the substrate are spaced at a certain distance in a vibration direction of the vibration unit.

4 . (canceled)

5 . The vibration sensor of claim 2 , wherein:
a thickness of the limiter along a vibration direction of the vibration unit is greater than a thickness of the mass element along the vibration direction of the vibration unit, and a side of the limiter facing away from the acoustic transducer is flush with a side of the mass element facing away from the acoustic transducer.

6 . (canceled)

7 . The vibration sensor of claim 2 , wherein:
the limiter includes a first limiter and a second limiter, the first limiter and the second limiter are sequentially arranged along a vibration direction of the vibration unit, the first limiter is connected with the housing, and the second limiter is connected with the acoustic transducer.

8 . The vibration sensor of claim 7 , wherein the second side of the elastic element is connected with the first limiter.

9 . The vibration sensor of claim 7 , wherein a thickness of the first limiter along the vibration direction of the vibration unit is equal to a thickness of the mass element along the vibration direction of the vibration unit.

10 . The vibration sensor of claim 7 , wherein the width of the first limiter along a direction perpendicular to the vibration direction of the vibration unit is less than the width of the second limiter along the direction perpendicular to the vibration direction of the vibration unit.

11 . The vibration sensor of claim 10 , wherein a ratio of the width of the first limiter along the direction perpendicular to the vibration direction of the vibration unit to the width of the second limiter along the direction perpendicular to the vibration direction of the vibration unit is greater than 0.5.

12 . The vibration sensor of claim 7 , wherein a material of the first limiter is different from a material of the second limiter.

13 - 14 . (canceled)

15 . The vibration sensor of claim 7 , wherein:
the vibration unit includes a second elastic element, the second elastic element is located in the first acoustic cavity, and the second elastic element is connected with the second limiter and the acoustic transducer, respectively.

16 . The vibration sensor of claim 15 , wherein an area of a side of the second elastic element close to the acoustic transducer is larger than an area of a side of the second elastic element away from the acoustic transducer.

17 . The vibration sensor of claim 3 , wherein:
the elastic element extends to the substrate and is connected with the substrate, and the elastic element, the mass element, and the substrate form the first acoustic cavity.

18 . The vibration sensor of claim 17 , wherein:
a thickness of the limiter along the vibration direction of the vibration unit is equal to a thickness of the mass element along the vibration direction of the vibration unit, and an area of the first side of the elastic element is greater than an area of the second side of the elastic element.

19 . The vibration sensor of claim 17 , wherein:
a thickness of the limiter along the vibration direction of the vibration unit is equal to a thickness of the mass element along the vibration direction of the vibration unit, and a side of the mass element facing away from the substrate is more distant from the substrate than a side of the limiter facing away from the substrate.

20 - 21 . (canceled)

22 . The vibration sensor of claim 1 , wherein the limiter is located between the elastic element and the housing.

23 . The vibration sensor of claim 22 , wherein:
the elastic element extends to the acoustic transducer and is connected with the acoustic transducer, and the elastic element, the mass element, and the acoustic transducer form the first acoustic cavity.

24 . The vibration sensor of claim 22 , wherein a thickness of the limiter along a vibration direction of the vibration unit is in a range of 100 um-1000 um.

25 . A vibration sensor, comprising:
a vibration receiver and an acoustic transducer, wherein: the vibration receiver includes a housing and a vibration unit, the housing and the acoustic transducer form an acoustic cavity, the vibration unit is located in the acoustic cavity to separate the acoustic cavity into a first acoustic cavity and a second acoustic cavity, the acoustic transducer is acoustically connected to the first acoustic cavity, the housing is configured to generate a vibration based on an external vibration signal, the vibration unit changes an acoustic pressure within the first acoustic cavity in response to the vibration of the housing, such that the acoustic transducer generates an electrical signal, the vibration unit includes a mass element and an elastic element, and the elastic element is connected around a side wall of the mass element and extends to the housing.

26 . The vibration sensor of claim 25 , wherein a thickness of the elastic element along a vibration direction of the vibration unit is greater than a thickness of the mass element along the vibration direction of the vibration unit.

Assignees

• Shenzhen Shokz Co Ltd

Inventors

• Deng Wenjun
• Yuan Yongshuai
• Huang Yujia
• Zhou Wenbing
• Liao Fengyun
• Qi Xin

Classifications

• H04R1/04

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title

• H04R1/2807 Primary

  Enclosures comprising vibrating or resonating arrangements (for the reduction of undesired resonances or vibrations H04R1/2869) · CPC title

• H04R1/08

  Mouthpieces; {Microphones;} Attachments therefor · CPC title

• H04R23/00

  Transducers other than those covered by groups H04R9/00 - H04R21/00 {(diaphragms for transducers of the distributed-mode type H04R7/045)} · CPC title

• H04R9/08

  Microphones · CPC title