Antenna device

Patent metadata

Field	Value
Publication number	US-2023187807-A1
Application number	US-202318108031-A
Country	US
Kind code	A1
Filing date	Feb 10, 2023
Priority date	Aug 14, 2020
Publication date	Jun 15, 2023
Grant date	—

Abstract

The present invention relates to an antenna device, comprising: a front housing including antenna arrangement units in which at least one radiation element is disposed on the front sides thereof, and heat dissipation units formed between adjacent antenna arrangement units and being exposed to outside air to transfer heat generated from the rear side to the front; and a rear housing coupled to the front housing and provided with a filter for filtering RF signals and a main board on which an RF element is mounted, wherein the heat generated from the filter is transferred to the front of the front housing through the contact with the back surface of the front housing by using the filter as a heat transfer medium.

First claim

1 . An antenna apparatus comprising:
one or more antenna placement units in which at least one radiation element is disposed on a front surface of the antenna placement unit; a front heat dissipation housing comprising a heat dissipation unit integrally formed between adjacent antenna placement units, among the one or more antenna placement units, exposed to an air, and configured to forward transfer heat that is generated from a back of the heat dissipation unit; and a rear heat dissipation housing coupled with the front heat dissipation housing and having a main board on which a filter for filtering an RF signal and an RF element are mounted provided within the rear heat dissipation housing, wherein heat that is generated from the filter is transferred to a front surface of the front heat dissipation housing through a contact with a back surface of the front heat dissipation housing by using the filter itself as a heat transfer medium.

2 . An antenna apparatus comprising:
multiple radiation elements configured to generate one polarized wave among dual polarized waves; a front heat dissipation housing, comprising multiple antenna placement units disposed to be spaced apart from each other so that the multiple radiation elements are disposed on front surfaces of the multiple antenna placement units, respectively, and a heat dissipation unit integrally formed between mutually adjacent antenna placement units, among the multiple antenna placement units, exposed to an air, and configured to forward transfer heat that is generated from a back of the heat dissipation unit; and a rear heat dissipation housing coupled with the front heat dissipation housing and having a main board on which a filter for filtering an RF signal and an RF element are mounted accommodated therein.

3 . The antenna apparatus according to claim 1 , wherein the radiation element comprises:
an antenna patch circuit unit printed and formed on a printed circuit board for a radiation element that is disposed in the antenna placement unit; and a director for radiation made of a conductive metal material and electrically connected to the antenna patch circuit unit.

4 . The antenna apparatus according to claim 3 , wherein the director for radiation induces a direction of a radiation beam in all directions and also transfers heat that is generated from a back of the printed circuit board for a radiation element forward through thermal conduction.

5 . The antenna apparatus according to claim 4 , further comprising a PSU unit stacked and disposed in an internal space of the rear heat dissipation housing at a height identical with a height of the main board and comprising a PSU board on which multiple electronic elements comprising a PSU element are mounted and disposed on any one of a front or back surface of the PSU board,
wherein heat that is generated from a back of the printed circuit board for a radiation element is heat that is generated from the filter and the multiple electronic elements.

6 . The antenna apparatus according to claim 3 , wherein the director for radiation is made of a thermal conductive material capable of the thermal conduction.

7 . The antenna apparatus according to claim 3 , wherein a power feed line for supplying a power feed signal to the antenna patch circuit unit is formed on an upper surface of the printed circuit board for a radiation element.

8 . The antenna apparatus according to claim 3 , wherein:
at least two antenna patch circuit units and the director for radiation form one antenna module, and the antenna module further comprises an antenna module cover for sealing the antenna patch circuit unit other than the director for radiation, which has been exposed to the air, so that the antenna patch circuit unit is protected.

9 . The antenna apparatus according to claim 8 , wherein:
a through hole is formed in one surface of the antenna module cover, and the director for radiation is coupled with a front surface of the antenna module cover in a way to be exposed to the air and electrically connected to the patch circuit unit through the through hole.

10 . The antenna apparatus according to claim 8 , wherein:
the antenna module cover is injected and molded, a director fixing unit a shape of which is matched with a back surface of the director for radiation is provided on one surface of the antenna module cover, wherein at least one director fixing protrusion part capable of being coupled with the director for radiation is formed in the director fixing unit in a way to protrude forward, and the director for radiation is pressed and fixed to at least one director fixing groove that is depressed and formed at a location corresponding to the at least one director fixing protrusion part on the back surface of the director for radiation.

11 . The antenna apparatus according to claim 8 , wherein:
the antenna module cover is injected and molded, and a filter fixing hole for coupling with the filter is formed in the antenna module cover through the antenna module cover.

12 . The antenna apparatus according to claim 8 , wherein:
the antenna module cover is injected and molded, and at least one board fixing hole for screw fastening by a fixing screw with the printed circuit board for a radiation element is formed in the antenna module cover through the antenna module cover.

13 . The antenna apparatus according to claim 12 , wherein
at least one fixing boss that is exposed to a back surface of the antenna module cover through the board fixing hole is formed on a back surface of the director for radiation, and the printed circuit board for a radiation element is fixed to the back surface of the antenna module cover through an operation of the fixing screw being fastened to the fixing boss.

14 . The antenna apparatus according to claim 13 , wherein the fixing screw is provided as a pan head screw a rear end surface of which is fastened to a front surface of the filter in a way to be matched with the front surface of the filter.

15 . The antenna apparatus according to claim 8 , wherein:
the antenna module cover is injected and molded, and at least one reinforcement rib is integrally formed on one surface of the antenna module cover.

16 . The antenna apparatus according to claim 8 , wherein:
at least four location setting holes are formed in the printed circuit board for a radiation element, at least two location setting protrusions formed on a back surface of the antenna module cover that has been provided to cover a front surface of the printed circuit board for a radiation element are pressed and inserted into two location setting holes, among the four location setting holes, and at least two location setting protrusions formed on the front surface of the front heat dissipation housing that has been provided so that a back surface of the printed circuit board for a radiation element is closely attached to the front heat dissipation housing are pressed and inserted into two location setting holes, among the four location setting holes.

17 . The antenna apparatus according to claim 3 , wherein a thermal pad is interposed between the filter and the back surface of the front heat dissipation housing.

18 . The antenna apparatus according to claim 3 , wherein:
a field programmable gate array (FPGA) is disposed on an upper surface of the main board, and heat that is generated from the FPGA is transferred to the heat dissipation unit in front of the front heat dissipation housing through the back surface of the front heat dissi

Assignees

• Kmw Inc

Inventors

• Kim Duk Yong
• Ji Kyo Sung
• Ryu Chi Back
• Kang Seong Man
• Choi Oh Seog
• Seo Yong Won
• Yang Hyoung Seok

Classifications

• H01Q1/02 Primary

  Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion} · CPC title

• H01Q1/246

  specially adapted for base stations · CPC title

• H01Q21/08

  the units being spaced along or adjacent to a rectilinear path {(waveguide fed H01Q21/0037)} · CPC title

• H01Q9/0435

  using two feed points · CPC title

• H01Q9/0414

  in a stacked or folded configuration · CPC title