Module

Patent metadata

Field	Value
Publication number	US-2023187388-A1
Application number	US-202318166563-A
Country	US
Kind code	A1
Filing date	Feb 9, 2023
Priority date	Aug 13, 2020
Publication date	Jun 15, 2023
Grant date	—

Abstract

A substrate has an upper main surface and a lower main surface arranged in an up-down direction. The metal member is provided on the upper main surface of the substrate. The metal member includes a plate-shaped portion and one or more foot portions. The plate-shaped portion has a front main surface and a back main surface arranged in a front-back direction when viewed in the up-down direction. The one or more foot portions extend backward from the lower side by bending the metal member at the lower side of the plate-shaped portion. A line extending in a predetermined direction is provided on the front main surface, the back main surface, the outer surface of the portion where the metal member is bent, and the inner surface of the portion where the metal member is bent.

First claim

1 . A module comprising:
a substrate having an upper main surface and a lower main surface arranged in an up-down direction; a metal member provided on the upper main surface of the substrate; a first electronic component and a second electronic component mounted on the upper main surface of the substrate; and a sealing resin layer provided on the upper main surface of the substrate and covering the metal member, the first electronic component, and the second electronic component, wherein the metal member includes a plate-shaped portion and one or more foot portions, the plate-shaped portion has a front main surface and a back main surface arranged in a front-back direction when viewed in the up-down direction, the first electronic component is disposed in front of the metal member, the second electronic component is disposed behind the metal member, when viewed in the front-back direction, a line connecting a lower end of the plate-shaped portion in a left-right direction is defined as a lower side, the one or more foot portions extend forward or backward from the lower side by bending the metal member at the lower side of the plate-shaped portion, and a line extending in a predetermined direction is provided on the front main surface, the back main surface, an outer surface of a portion where the metal member is bent, and an inner surface of the portion where the metal member is bent.

2 . The module according to claim 1 , wherein
the outer surface of the portion where the metal member is bent is connected to the front main surface, and surface roughness of the outer surface of the portion where the metal member is bent is smaller than surface roughness of the front main surface.

3 . The module according to claim 1 , wherein
the outer surface of the portion where the metal member is bent is connected to the back main surface, and surface roughness of the outer surface of the portion where the metal member is bent is smaller than surface roughness of the back main surface.

4 . The module according to claim 1 , wherein
a crack is formed on the outer surface of the portion where the metal member is bent.

5 . The module according to claim 1 , wherein
the predetermined direction is the left-right direction.

6 . The module according to claim 1 , wherein
the predetermined direction is the up-down direction.

7 . The module according to claim 1 , wherein
the one or more foot portions include a plurality of foot portions, and all of the plurality of foot portions extend forward from the lower side, or all of the plurality of foot portions extend backward from the lower side.

8 . The module according to claim 1 , wherein
the metal member is a rolled material, and a plurality of lines are rolling flaws.

9 . The module according to claim 1 , wherein
the one or more foot portions include a plurality of foot portions, the substrate includes a mounting electrode being a part of the upper main surface of the substrate, and the plurality of foot portions are fixed to the mounting electrode by a conductive member.

10 . The module according to claim 9 , wherein
the mounting electrode includes a plurality of small electrodes, and each of the plurality of foot portions is fixed to the plurality of small electrodes by a conductive member.

11 . The module according to claim 9 , wherein
the mounting electrode is one electrode, and the plurality of foot portions are fixed to the mounting electrode which is one electrode by an integrated conductive member.

12 . The module according to claim 1 , wherein
a left end of the plate-shaped portion is located on a left surface of the sealing resin layer, a right end of the plate-shaped portion is located on a right surface of the sealing resin layer, and an upper end of the plate-shaped portion is located on an upper surface of the sealing resin layer.

13 . The module according to claim 2 , wherein
a crack is formed on the outer surface of the portion where the metal member is bent.

14 . The module according to claim 3 , wherein
a crack is formed on the outer surface of the portion where the metal member is bent.

15 . The module according to claim 2 , wherein
the predetermined direction is the left-right direction.

16 . The module according to claim 3 , wherein
the predetermined direction is the left-right direction.

17 . The module according to claim 4 , wherein
the predetermined direction is the left-right direction.

18 . The module according to claim 2 , wherein
the predetermined direction is the up-down direction.

19 . The module according to claim 3 , wherein
the predetermined direction is the up-down direction.

20 . The module according to claim 4 , wherein
the predetermined direction is the up-down direction.

Assignees

• Murata Manufacturing Co

Inventors

• Hayashi Shota
• Ogawa Nobuaki
• Asano Yuki
• Uejima Takanori
• Kitajima Hiromichi
• Eguchi Takahiro

Classifications

• H10W44/241

  for passive devices or passive elements · CPC title

• H10W42/273

  the arrangements being between laterally adjacent chips, e.g. walls between chips · CPC title

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W44/20 Primary

  at high-frequency [HF] or radio frequency [RF] · CPC title