Singulation of optical devices from optical device substrates via laser ablation

Patent metadata

Field	Value
Publication number	US-2023123795-A1
Application number	US-202217945861-A
Country	US
Kind code	A1
Filing date	Sep 15, 2022
Priority date	Oct 15, 2021
Publication date	Apr 20, 2023
Grant date	—

Abstract

A method and apparatus for dicing optical devices from a substrate are described herein. The method includes the formation of a plurality of trenches using radiation pulses delivered to the substrate. The radiation pulses are delivered in a pattern to form trenches with varying depth as the trenches extend outward from a top surface of the optical device. The varying depth of the trenches provides edges of each of the optical devices which are slanted. The radiation pulses are UV radiation pulses and are delivered in bursts around the silhouette of the optical devices.

First claim

1 . A method of dicing an optical device from a substrate comprising:
forming a first trench by exposing the substrate to one or more first radiation pulses around a circumference of the optical device, the first trench having a first depth; forming a second trench by exposing the substrate to one or more second radiation pulses around the circumference of the optical device, the second trench having a second depth greater than the first depth and the second trench being concentric about the first trench; and forming one or more additional trenches by exposing the substrate to one or more additional radiation pulses around the circumference of the optical device, each additional trench of the one or more additional trenches having a depth greater than a previous depth of a previously formed trench, each subsequently formed additional trench concentric about a previously formed additional trench.

2 . The method of claim 1 , wherein each of the one or more first radiation pulses has a pulse width of less than about 30 picoseconds.

3 . The method of claim 1 , wherein the one or more second radiation pulses are delivered outward of the one or more first radiation pulses by a radial distance of about 0.01 mm to about 0.05 mm.

4 . The method of claim 1 , wherein the first trench and the second trench a tapered edge of the optical device, the tapered edge having a taper angle of about 1 degree to about 45 degrees with respect to a plane normal to a top substrate surface.

5 . The method of claim 1 , wherein the substrate comprises one or a combination of silicon, silicon carbide, silicon oxide, or aluminum nitride.

6 . The method of claim 1 , wherein the one or more first radiation pulses and the one or more second radiation pulses have a wavelength of less than about 500 nm.

7 . The method of claim 1 , wherein each of the one or more first radiation pulses and the one or more second radiation pulses are delivered to one or more concentric silhouettes around the optical device.

8 . The method of claim 1 , wherein each of the first radiation pulses and each of the second radiation pulses have a pulse energy of less than about 50 μJ.

9 . A method of dicing one or more optical devices within a substrate comprising:
forming a first tapered edge around a first optical device by forming a plurality of trenches around the first optical device using one or more bursts of radiation pulses, the plurality of trenches varying in depth from a top surface of the substrate; forming a second tapered edge around a second optical device by forming a plurality of trenches around the second optical device using one or more bursts of radiation pulses, the plurality of trenches varying in depth from the top surface of the substrate; and removing the first optical device and the second optical device from the substrate after forming the first tapered edge and the second tapered edge.

10 . The method of claim 9 , wherein the first tapered edge and the second tapered edge are disposed at an angle of about 1 degree and about 45 degrees, the angle defined between a plane normal to the top surface of the substrate and a taper line of each of the first optical device and the second optical device, wherein the taper line of each of the first optical device and the second optical device intersects a discreet point on each of the plurality of trenches.

11 . The method of claim 10 , wherein the one or more bursts of radiation pulses comprise:
a pulse width of less than about 15 picoseconds; a pulse frequency of greater than 50 kHz; and a pulse energy of less than 200 nJ.

12 . A non-transitory computer-readable medium storing instructions that, when executed by a processor, cause a computer system to perform the steps of:
forming a tapered edge around a first optical device by: instructing a laser source to deliver one or more first radiation pulses to a substrate around a circumference of the first optical device to form a first trench, the first trench having a first depth and the substrate disposed on a stage, one or both of the stage and the laser source being instructed to move during delivery of the first radiation pulses; instructing the laser source to deliver one or more second radiation pulses to the substrate around the circumference of the first optical device to form a second trench, the second trench having a second depth greater than the first depth and the second trench radially outward of the first trench, and one or both of the stage and the laser source being instructed to move during delivery of the first radiation pulses; and instructing the laser source to deliver one or more additional radiation pulses to the substrate around the circumference of the first optical device to form one or more additional trenches, each additional trench of the one or more additional trenches having a depth greater than a previous depth of a previously formed trench, each subsequently formed additional trench concentric about a previously formed additional trench, and one or both of the stage and the laser source being instructed to move during delivery of the one or more additional radiation pulses.

13 . The non-transitory computer-readable medium of claim 12 , wherein the tapered edge is disposed at an angle other than 0 degrees with respect to a vertical plane normal to a top substrate surface.

14 . The non-transitory computer-readable medium of claim 13 , wherein the angle of the tapered edge is about 1 degree to about 45 degrees.

15 . The non-transitory computer-readable medium of claim 12 , wherein each of the first radiation pulses and each of the second radiation pulses have a pulse width of less than about 15 picoseconds.

16 . The non-transitory computer-readable medium of claim 15 , wherein each of the first radiation pulses and each of the second radiation pulses have a pulse frequency of greater than 50 kHz.

17 . The non-transitory computer-readable medium of claim 16 , wherein each of the first radiation pulses and each of the second radiation pulses have a pulse energy of less than 200 nJ.

18 . The non-transitory computer-readable medium of claim 17 , wherein each the first radiation pulses are delivered in a first burst and the second radiation pulses are delivered in a second burst, each of the first burst and the second burst having a burst energy of less than about 40 μJ.

19 . The non-transitory computer-readable medium of claim 12 , wherein the first trench is formed along a first silhouette and the second trench is formed along a second silhouette, the first silhouette separated from the second silhouette by a radial distance of about 0.01 mm to about 0.05 mm.

20 . The non-transitory computer-readable medium of claim 12 , wherein a change in depth between the first trench and the second trench is about 1 μm to about 7.5 μm.

Assignees

• Applied Materials Inc

Inventors

• Lei Wei-Sheng
• Yao Zhengping
• Chidambaram Mahendran
• Wang Kangkang
• Lin Zhihong John
• Godet Ludovic
• Sivaramakrishnan Visweswaren

Classifications

• B23K26/364 Primary

  for making a groove or trench, e.g. for scribing a break initiation groove · CPC title

• B23K26/402

  involving non-metallic material, e.g. isolators · CPC title

• B23K26/0624 Primary

  using ultrashort pulses, i.e. pulses of 1 ns or less · CPC title

• B23K26/082

  Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head · CPC title

• B23K2103/50

  Inorganic materials other than metals or composite materials · CPC title