Sensor device

US2023112624A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023112624-A1
Application numberUS-202117907330-A
CountryUS
Kind codeA1
Filing dateMar 12, 2021
Priority dateMar 27, 2020
Publication dateApr 13, 2023
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An object of the present disclosure is to further improve waterproofness between an end portion of a wiring member and a resin molded portion. A sensor device includes: a sensor element; a wiring member connected to the sensor element; a resin molded portion that covers the sensor element and an end portion of the wiring member; and an annular elastic member that is interposed between an outer periphery of the wiring member and the resin molded portion.

First claim

Opening claim text (preview).

1 . A sensor device comprising: a sensor element; a wiring member connected to the sensor element; a resin molded portion that covers the sensor element and an end portion of the wiring member; and an annular elastic member that is interposed between an outer periphery of the wiring member and the resin molded portion. 2 . The sensor device according to claim 1 , wherein the annular elastic member is formed of a material that more easily elastically deforms than the resin molded portion. 3 . The sensor device according to claim 1 , wherein an inner peripheral surface of the annular elastic member is shaped to have a constant-diameter portion that is continuous along an axial direction of the annular elastic member. 4 . The sensor device according to claim 1 , wherein the annular elastic member is adhered to both the wiring member and the resin molded portion. 5 . The sensor device according to claim 1 , wherein a portion in an axial direction of the annular elastic member is embedded in the resin molded portion, and another portion of the annular elastic member extends from the resin molded portion. 6 . The sensor device according to claim 2 , wherein an inner peripheral surface of the annular elastic member is shaped to have a constant-diameter portion that is continuous along an axial direction of the annular elastic member. 7 . The sensor device according to claim 2 , wherein the annular elastic member is adhered to both the wiring member and the resin molded portion. 8 . The sensor device according to claim 3 , wherein the annular elastic member is adhered to both the wiring member and the resin molded portion. 9 . The sensor device according to claim 2 , wherein a portion in an axial direction of the annular elastic member is embedded in the resin molded portion, and another portion of the annular elastic member extends from the resin molded portion. 10 . The sensor device according to claim 3 , wherein a portion in an axial direction of the annular elastic member is embedded in the resin molded portion, and another portion of the annular elastic member extends from the resin molded portion. 11 . The sensor device according to claim 4 , wherein a portion in an axial direction of the annular elastic member is embedded in the resin molded portion, and another portion of the annular elastic member extends from the resin molded portion.

Assignees

Inventors

Classifications

  • Housings for sensors · CPC title

  • H05K5/0095Primary

    hermetically-sealed · CPC title

  • Arrangements for monitoring working conditions, e.g. wear, temperature · CPC title

  • G01P1/026Primary

    for speed measuring devices, e.g. pulse generator · CPC title

  • for measuring angular speed (G01P3/56 takes precedence) · CPC title

Patent family

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External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2023112624A1 cover?
An object of the present disclosure is to further improve waterproofness between an end portion of a wiring member and a resin molded portion. A sensor device includes: a sensor element; a wiring member connected to the sensor element; a resin molded portion that covers the sensor element and an end portion of the wiring member; and an annular elastic member that is interposed between an outer …
Who is the assignee on this patent?
Sumitomo Wiring Systems
What technology area does this patent fall under?
Primary CPC classification H05K5/0095. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Apr 13 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).