Cleaning composition

Patent metadata

Field	Value
Publication number	US-2023109597-A1
Application number	US-202217951934-A
Country	US
Kind code	A1
Filing date	Sep 23, 2022
Priority date	Sep 24, 2021
Publication date	Apr 6, 2023
Grant date	—

Abstract

Polishing compositions are disclosed for simultaneously removing particles from a surface that has been polished using a CMP slurry comprising a polishing rate accelerator and removing a pad stain from a polishing pad that has been contacted with a CMP slurry comprising a polishing rate accelerator.Cleaning compositions for post-CMP cleaning of semiconductor surfaces, comprise one or more reducing agents, a particle removal agent, a surfactant, and a base. When one or more reducing agents yields a standard reduction potential of less than 1.224 V, the cleaning composition of the present disclosure is able to remove a MnO2 pad stain from a polishing pad and reduce defects on a polished surface (by removing particles).

First claim

What is claimed is:

1 . A cleaning composition for post-CMP cleaning of semiconductor surfaces, comprising: a reducing agent; a particle removal agent; a surfactant; and a base.

2 . The cleaning composition of claim 1 , wherein the reducing agent comprises at least one selected from sulfites, dithionates, thiosulfates, iodides, phosphites, hypophosphites, formic acid, phosphorous acid, ascorbic acid, hydrogen peroxide, hydroxylamine, oxalic acid, sodium sulfite, alkali salts thereof, or any combination thereof.

3 . The cleaning composition of claim 1 , wherein the reducing agent comprises at least one selected from ascorbic acid and hydrogen peroxide.

4 . The cleaning composition of claim 1 , wherein the particle removal agent comprises glycine, N-(phosphonomethyl) iminodiacetic acid hydrate, hydroxyphosphonoacetic acid, citric acid, hydroxyethane-1,1-diphosphonic acid and 2-phosphonobutane-1,2,4-tricarboxylic acid, or 1-hydroxyethylidene-1,1-diphosphonic acid (HEDP).

5 . The cleaning composition of claim 1 , wherein the particle removal agent comprises a compound represented by N(R 1 )(R 2 )(R 3 ) or a salt thereof, or a compound represented by C(R 1 )(R 2 )(R 3 )(R 4 ) or a salt thereof, wherein R 1 to R 3 and R 1 to R 4 each independently represent a hydrogen atom, a carboxyl group, a hydroxyl group, a phosphonic acid group or a salt group thereof, or a substituted or unsubstituted linear or branched alkyl group having 1 or more and 5 or less carbon atoms, where one or more of R 1 to R 3 are each a phosphonic acid group or a salt group thereof, or an alkyl group substituted with a phosphonic acid group or a salt group thereof, and one or more of R 1 to R 4 are each a phosphonic acid group or a salt group thereof, or an alkyl group substituted with a phosphonic acid group or a salt group thereof.

6 . The cleaning composition of claim 1 , wherein the particle removal agent comprises 1-hydroxyethylidene-1,1-diphosphonic acid.

7 . The cleaning composition of claim 1 , wherein the base comprises 2-(diethylamino)ethanethiol, captamine, diethylethanolamine, methylcysteamine, 2-(tert-butylamino)ethanethiol, 2,2′-dimethoxy-1,1-dimethyl-dimethylamine, 3-amino-4-octanol, 3-butoxypropylamine, N-acetylcysteamine, homocysteamine, N,N-dimethylhydroxylamine, 2-(isopropylamino)ethanol, 2-(methylthioethyl)amine, 1-aminopropane-2-thiol, leucinol, cysteamine, and/or N,O-dimethylhydroxylamine.

8 . The cleaning composition of claim 1 , wherein the base comprises an alkylated amine.

9 . The cleaning composition of claim 1 , wherein the base comprises 3-amino-4-octanol.

10 . The cleaning composition of claim 1 , wherein the surfactant is represented by Formula (I):
C m H 2m+1 —(OCH 2 CH 2 ) n -L-COOH   (I),
where 6≤m≤20, n≥5, L is a bond, —O—, —S—, —R 1 —, —S—R 1 —, or —O—R 1 —, where R 1 is a C 1-4 alkylene.

11 . The cleaning composition of claim 1 , wherein the surfactant comprises capryleth carboxylic acid.

12 . The cleaning composition of claim 1 ,
wherein the reducing agent yields a standard reduction potential (E o ) of less than 1.224 V or comprises at least hydrogen peroxide; wherein the particle removal agent comprises a compound represented by N(R 1 )(R 2 )(R 3 ) or a salt thereof, or a compound represented by C(R 1 )(R 2 )(R 3 )(R 4 ) or a salt thereof, wherein R 1 to R 3 and R 1 to R 4 each independently represent a hydrogen atom, a carboxyl group, a hydroxyl group, a phosphonic acid group or a salt group thereof, or a substituted or unsubstituted linear or branched alkyl group having 1 or more and 5 or less carbon atoms, where one or more of R 1 to R 3 are each a phosphonic acid group or a salt group thereof, or an alkyl group substituted with a phosphonic acid group or a salt group thereof, and one or more of R 1 to R 4 are each a phosphonic acid group or a salt group thereof, or an alkyl group substituted with a phosphonic acid group or a salt group thereof; wherein the surfactant is represented by Formula (I):
C m H 2m+1 —(OCH 2 CH 2 ) n -L-COOH   (I),

where 6≤m≤20,
n≥5,
L is a bond, —O—, —S—, —R 1 —, —S—R 1 —, or —O—R 1 —, where R 1 is a C 1-4 alkylene; and
wherein the base comprises an alkylated amine including a hydroxy group.

13 . A cleaning composition for post-CMP cleaning of semiconductor surfaces, comprising: hydrogen peroxide; a particle removal agent; a surfactant; and a base.

14 . The cleaning composition of claim 13 , comprising: hydrogen peroxide; hydroxyethane-1,1-diphosphonic acid; capryleth-9-carboxylic acid; and 3-amino-4-octanol.

15 . A method for simultaneously removing a pad stain from a polishing pad and removing particles from a semiconductor surface after polishing, comprising: supplying a cleaning composition according to claim 1 to the semiconductor surface; and contacting the semiconductor surface with the polishing pad in the presence of the cleaning composition to produce a polished semiconductor surface having a reduced defect count.

16 . The method of claim 15 , wherein the pad stain comprises MnO 2 .

17 . A method for producing a polished semiconductor surface, comprising: polishing a semiconductor surface with a polishing composition comprising a removal rate enhancer; and
simultaneously removing a pad stain from a polishing pad and removing particles from the semiconductor surface by the method according to claim 15 .

18 . The method of claim 17 , wherein the removal rate enhancer comprises KMnO 4 .

19 . A method for simultaneously removing a pad stain from a polishing pad and removing particles from a semiconductor surface after polishing, comprising: supplying a cleaning composition according to claim 13 to the semiconductor surface; and contacting the semiconductor surface with the polishing pad in the presence of the cleaning composition to produce a polished semiconductor surface having a reduced defect count.

20 . The method of claim 19 , wherein the pad stain comprises MnO 2 .

Assignees

• Fujimi Inc

Inventors

• Crockett Brandon

Classifications

• C11D3/0042 Primary

  Reducing agents · CPC title

• C11D3/2082

  Polycarboxylic acids-salts thereof · CPC title

• C11D1/06

  Ether- or thioether carboxylic acids · CPC title

• C11D3/361

  Phosphonates, phosphinates or phosphonites · CPC title

• C11D3/2096

  Heterocyclic compounds · CPC title