Air baffle structure

US2023103177A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023103177-A1
Application numberUS-202117521569-A
CountryUS
Kind codeA1
Filing dateNov 8, 2021
Priority dateSep 29, 2021
Publication dateMar 30, 2023
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An air baffle structure is provided for installing a motherboard and inside a case. The case includes an opening. The air baffle structure includes a pair of brackets and an air baffle cover. The pair of brackets are fixed on the case and disposed on two sides of the opening, and the motherboard is pluggably disposed between the pair of brackets. The air baffle cover is connected to tops of the pair of brackets and straddles the pair of brackets. Therefore, the air baffle cover may effectively guide the air to pass through the motherboard to dissipate heat of the motherboard, and the quantity of fans in the case is reduced.

First claim

Opening claim text (preview).

What is claimed is: 1 . An air baffle structure, configured for installing a motherboard and inside a case, the case comprising an opening, and the air baffle structure comprising: a pair of brackets, fixed on the case and disposed on two sides of the opening, and the motherboard pluggably arranged between the pair of brackets; and an air baffle cover, connected to tops of the pair of brackets and straddling the pair of brackets. 2 . The air baffle structure according to claim 1 , wherein the air baffle cover comprises a top plate and a pair of side plates connected to two sides of the top plates, and the pair of the side plates are detachably fixed to the tops of the pair of brackets. 3 . The air baffle structure according to claim 2 , wherein the air baffle cover comprises a first air opening disposed adjacent to the opening and a second air opening disposed away from the opening on two ends thereof, and a height of the top plate is gradually decreased from the first air opening toward the second air opening. 4 . The air baffle structure according to claim 2 , further comprising a pair of detachable components, wherein each of the detachable components comprises a plurality of posts and a plurality of sockets, and each of the posts is protruded from either the top of each of the brackets or a bottom of each of the side plates; each of the sockets is recessed on another one between the top of each of the brackets and the bottom of each of the side plates; and each of the posts is inserted in each of the sockets. 5 . The air baffle structure according to claim 2 , further comprising a pair of detachable components, wherein each of the detachable components comprises a strip and a groove; the strip is extended along an axial direction of either each of the brackets or each of the side plates, and the groove is disposed along the axial direction of another one between each of the brackets and each of the side plates; and the strip is engaged in the groove. 6 . The air baffle structure according to claim 2 , further comprising a pair of detachable components, wherein each of the detachable components comprises a shaft, a pivot hole, two tenons and two slots; the shaft is protruded from either the top of each of the brackets or the bottom of each of the side plates; the pivot hole is recessed on another one between the top of each of the brackets and the bottom of each of the side plates; the shaft is connected pivotally to the pivot hole; each of the two tenons is extended from an inner side and an outer side of either each of the brackets or the side plates to be disposed on two sides of the shaft; each of the two slots is recessed on the inner side and the outer side of another one between each of the brackets and each of the side plates to be disposed on two sides of the shaft; and each of the tenons is engaged in each of the slots. 7 . The air baffle structure according to claim 2 , wherein one of the pair of side plates is extended with an extension piece laminated with the top plate; a zigzag groove is disposed on either the top plate or the extension piece, and a bump is extended on another one between the top plate and the extension piece; and a plurality of recesses is disposed parallelly on an inner peripheral wall of the zigzag groove; and the bump is embedded in the zigzag groove and selectively engaged with one of the recesses. 8 . The air baffle structure according to claim 2 , wherein a zigzag groove is disposed on either each of the brackets or each of the side plates, and a bump is disposed on another one between each of the brackets and each of the side plates; a plurality of recesses is disposed parallelly on an inner peripheral wall of the zigzag groove; and the bump is embedded in one of the zigzag grooves and selectively engaged with one of the recesses. 9 . The air baffle structure according to claim 2 , further comprising a plurality of fastening components, wherein the top plate comprises a plurality of first fastening holes, and each of the side plates comprises a plurality of second fastening holes; and each of the fastening components is inserted and fixed in one of the first fastening holes and one of the second fastening holes. 10 . The air baffle structure according to claim 1 , wherein two rail guiding grooves are disposed on inner sides of the pair of brackets, and two sides of the motherboard are pluggably embedded in the rail guiding grooves; and each of the rail guiding grooves comprises an inner side wall, an inner top wall and an inner bottom wall, and a plurality of elastic arms are protruded from the inner side wall; each of the brackets comprises a plurality of hollow grooves disposed on an upper side and a lower side of the rail guiding groove; and a plurality of elastic bulges is disposed on the inner top wall and the inner bottom wall corresponding to the plurality of hollow grooves. 11 . The air baffle structure according to claim 10 , wherein each of the rail guiding grooves comprises a flaring section adjacent to the opening, and an inner periphery size of the flaring section is gradually increased in a direction toward the opening. 12 . The air baffle structure according to claim 1 , wherein each of the brackets comprises a front section and a rear section, and the front section is disposed adjacent to the opening with respect to the rear section; and the air baffle cover straddles between the front sections of the pair of brackets. 13 . The air baffle structure according to claim 12 , further comprising an auxiliary air baffle cover, wherein the auxiliary air baffle cover is connected to the tops of the pair of brackets and one end of the air baffle cover, and the auxiliary air baffle cover straddles between the rear sections of the pair of brackets.

Assignees

Inventors

Classifications

  • G06F1/20Primary

    Cooling means · CPC title

  • within server blades for removing heat from heat source · CPC title

  • Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title

  • Mounting of motherboards · CPC title

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Frequently asked questions

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What does patent US2023103177A1 cover?
An air baffle structure is provided for installing a motherboard and inside a case. The case includes an opening. The air baffle structure includes a pair of brackets and an air baffle cover. The pair of brackets are fixed on the case and disposed on two sides of the opening, and the motherboard is pluggably disposed between the pair of brackets. The air baffle cover is connected to tops of the…
Who is the assignee on this patent?
Kinpo Elect Inc
What technology area does this patent fall under?
Primary CPC classification G06F1/20. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Mar 30 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).