Liquid crystal panel and display device
US-12135478-B2 · Nov 5, 2024 · US
US2023085463A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2023085463-A1 |
| Application number | US-202218047041-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 17, 2022 |
| Priority date | Aug 31, 2020 |
| Publication date | Mar 16, 2023 |
| Grant date | — |
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A light-emitting device includes a wiring board, a plurality of light-emitting elements disposed on the wiring board, a light-reflecting member covering a lateral surface of each of the plurality of light-emitting elements, a plurality of light-transmitting layers each located above an emission surface of a corresponding one of the plurality of light-emitting elements, a plurality of light-reflecting layers disposed on the plurality of light-transmitting layers, respectively, a light-diffusing layer disposed above the plurality of light-reflecting layers and the light-reflecting member, and a low-refractive-index layer located between the light-reflecting member and the light-diffusing layer, around each pair of one of the plurality of light-transmitting layers and one of the light-reflecting layers, and having a refractive index lower than that of the plurality of light-transmitting layers. Each of the plurality of light-reflecting layer has a width in a cross-sectional view thereof which is equal to or greater than that of a corresponding one of the plurality of light-transmitting layers.
Opening claim text (preview).
What is claimed is: 1 . A method of producing a light-emitting device, comprising: mounting a plurality of light-emitting elements onto a wiring board comprising an interconnect layer such that the light-emitting elements are electrically coupled to the interconnect layer; forming a light-reflecting member on the wiring board, the light-reflecting member covering at least a portion of lateral surfaces of each light-emitting element; disposing, onto respective upper surfaces of the light-emitting elements, multilayer structures each comprising a light-transmitting layer and a light-reflecting layer on the light-transmitting layer; providing a low-refractive-index layer; and disposing a light-diffusing layer over the low-refractive-index layer, the low-refractive-index layer having a refractive index lower than that of the light-transmitting layers. 2 . The method of claim 1 , wherein: the step of providing the low-refractive-index layer comprises applying a light transmitting first resin material to an upper surface of the light-reflecting member and curing the first resin material. 3 . The method of claim 1 , wherein: the step of providing the low-refractive-index layer comprises leaving the low-refractive-index layer as an air layer. 4 . The method of claim 1 , wherein: the step of disposing multilayer structures comprises: disposing the light-transmitting layer onto respective upper surfaces of the light-emitting elements; and after disposing the light-transmitting layer, providing the light-reflecting layer onto a corresponding one of the light-transmitting layers. 5 . The method of claim 4 , wherein: in a cross-sectional view, each of the light-reflecting layers has a width which is equal to or greater than that of a corresponding one of the light-transmitting layers. 6 . The method of claim 1 , wherein: the step of disposing multilayer structures comprises: providing a sheet-shaped layered structure comprising a light-transmitting sheet and a light-reflecting sheet on the light-transmitting sheet; cutting the sheet-shaped layered structure into a plurality of pieces; and attaching each of the plurality of pieces of the sheet-shaped layered structure onto the upper surface of a corresponding one of the light-emitting elements. 7 . The method of claim 1 , wherein: the light-reflecting member has one or more protrusions on an upper surface thereof. 8 . The method of claim 7 , wherein: the one or more protrusions include a plurality of protrusions surrounding each light-emitting element in a plan view. 9 . The method of claim 1 , wherein: the step of forming a light-reflecting member comprises: providing a resin sheet having a plurality of through-holes provided at positions corresponding to the plurality of light-emitting elements on the wiring board; and attaching the resin sheet onto the wiring board. 10 . The method of claim 9 , wherein: the step of forming a light-reflecting member further comprises: after attaching the resin sheet onto the wiring board, filling the through-holes with a second resin material. 11 . The method of claim 1 , wherein: in a top plan view, each of the light-reflecting layers overlaps a corresponding one of the plurality of light-transmitting layers; and each light-transmitting layer encloses, within an outer periphery thereof, an emission surface of the corresponding light-emitting element in a top plan view. 12 . The method of claim 1 , wherein: in a top plan view, each of the light-reflecting layers has a dotted pattern having a dot density that becomes higher toward a center of each of the light-reflecting layers from an outside thereof. 13 . The method of claim 1 , further comprising providing the plurality of light-emitting elements and the wiring board comprising the interconnect layer before the step of mounting the plurality of light-emitting elements onto the wiring board. 14 . The method of claim 1 , wherein: the interconnect layer comprises a first interconnect layer on the side of an upper surface of the wiring board and a second interconnect layer on the side of a lower surface of the wiring board, the first interconnect layer being electrically coupled to the plurality of light-emitting elements, the second interconnect layer being electrically coupled to a connector for coupling to an external control circuit.
Package configurations · CPC title
with LEDs · CPC title
including a specially adapted diffusing, scattering or light controlling members · CPC title
including specially adapted reflectors · CPC title
Electrical details · CPC title
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