System and method for high throughput printing of pressure sensitive adhesive

US2023081069A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023081069-A1
Application numberUS-202117475644-A
CountryUS
Kind codeA1
Filing dateSep 15, 2021
Priority dateSep 15, 2021
Publication dateMar 16, 2023
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A system for printing PSA on a substrate includes a rigid support structure. The system also includes a plurality of dispensing heads disposed within the rigid support structure and configured to deposit PSA solution on the substrate in response to applied pressure. Each dispensing head of the plurality of dispensing heads includes a support structure and a wicking structure disposed within the support structure and configured to hold the PSA solution, wherein the wicking structure is configured to deposit the PSA solution in a desired shape on the substrate upon contact with the substrate.

First claim

Opening claim text (preview).

1 . A system for printing pressure sensitive adhesive (PSA) on a substrate, comprising: a rigid support structure; and a plurality of dispensing heads disposed within the rigid support structure and configured to deposit PSA solution on the substrate in response to applied pressure, wherein each dispensing head of the plurality of dispensing heads comprises: a support structure; and a wicking structure disposed within the support structure and configured to hold the PSA solution, wherein the wicking structure is configured to deposit the PSA solution in a desired shape on the substrate upon contact with the substrate. 2 . The system of claim 1 , wherein each dispensing head of the plurality of dispensing heads comprises a cap configured to be disposed on a bottom of a respective dispensing head adjacent the wicking structure to keep the PSA solution from drying up. 3 . The system of claim 1 , comprising a handle coupled to the rigid support structure, wherein the handle is configured to enable movement of the rigid support structure to a desired position for depositing the PSA solution on the substrate. 4 . The system of claim 3 , comprising a robotic system coupled to the handle and configured to move the rigid support structure to the desired position for depositing the PSA solution on the substrate. 5 . The system of claim 1 , wherein each dispensing head of the plurality of dispensing heads comprises a feed conduit to receive the PSA solution. 6 . The system of claim 5 , comprising a closed feeding system coupled to a respective feed conduit of each dispensing head, wherein the closed feeding system is configured to provide the PSA solution to each dispensing head via the respective feed conduit. 7 . The system of claim 1 , comprising at least one pressure sensor disposed within the rigid support structure and a controller coupled to the at least one pressure sensor, wherein the controller is configured to control an amount of pressure applied by the rigid support structure on the substrate based on feedback from the at least one pressure sensor. 8 . The system of claim 1 , wherein the wicking structure of each dispensing head comprises a porous membrane or sponge. 9 . The system of claim 1 , wherein each dispensing head of the plurality of dispensing heads comprises a porous layer disposed over an end of the support structure adjacent to the wicking structure to hold the wicking structure in place. 10 . A method for printing pressure sensitive adhesive (PSA) on a substrate, comprising: flowing a PSA solution into a plurality of dispensing heads disposed within a rigid support structure, wherein each dispensing head of the plurality of dispensing heads is configured to deposit the PSA solution on the substrate in response to applied pressure and each dispensing head comprises a support structure and a wicking structure disposed within the support structure to hold the PSA solution; and positioning the rigid support structure on the substrate with sufficient pressure to cause the PSA solution to be deposited in a desired shape on the substrate from each dispensing head upon contact with the substrate. 11 . The method of claim 10 , comprising, when not utilizing each dispensing head, capping each dispensing head with a cap on a bottom of a respective dispensing head adjacent the wicking structure to keep the PSA solution from drying up. 12 . The method of claim 10 , wherein positioning the rigid support structure comprises utilizing a robotic system to move the rigid support structure via a handle on the rigid support structure into position to deposit the PSA solution on the substrate. 13 . The method of claim 10 , wherein flowing the PSA solution into the plurality of dispensing heads comprises flowing the PSA solution, via a closed feeding system, into a respective feed conduit on each dispensing head. 14 . The method of claim 10 , comprising regulating the applied pressure, via a controller, based on feedback received by the controller from at least one pressure sensor disposed within the rigid support structure. 15 . The method of claim 10 , wherein the wicking structure of each dispensing head comprises a porous membrane or sponge. 16 . The method of claim 10 , wherein each dispensing head of the plurality of dispensing heads comprises a porous layer disposed over an end of the support structure adjacent to the wicking structure to hold the wicking structure in place. 17 . A system for printing pressure sensitive adhesive (PSA) on a substrate, comprising: a rigid support structure having a handle; a robotic system coupled to the rigid support structure via the handle, wherein the robotic system is configured to move the rigid support structure to a desired position for depositing PSA solution on the substrate and to apply pressure to the rigid support structure for depositing the PSA solution; a plurality of dispensing heads disposed within the rigid support structure and configured to deposit the PSA solution on the substrate in response to applied pressure, wherein each dispensing head of the plurality of dispensing heads comprises a feed conduit; and a programmed feeding system coupled to a respective feed conduit of each dispensing head, wherein the programmed feeding system is configured to provide the PSA solution to each respective feed conduit for deposition of the PSA solution. 18 . The system of claim 17 , wherein each dispensing head of the plurality of dispensing heads comprises a support structure and a wicking structure disposed within the support structure and configured to hold the PSA solution. 19 . The system of claim 18 , wherein each dispensing head of the plurality of dispensing heads comprises a cap configured to be disposed on a bottom of a respective dispensing head adjacent the wicking structure to keep the PSA solution from drying up. 20 . The system of claim 18 , wherein the wicking structure of each dispensing head comprises a porous membrane or sponge.

Assignees

Inventors

Classifications

  • Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles · CPC title

  • B05C1/06Primary

    by rubbing contact, e.g. by brushes, by pads {(brushes in general A46B)} · CPC title

  • Stamping mechanisms controlled by feed of copy matter · CPC title

  • to obtain an adhesive surface · CPC title

  • Printing presses for particular purposes · CPC title

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What does patent US2023081069A1 cover?
A system for printing PSA on a substrate includes a rigid support structure. The system also includes a plurality of dispensing heads disposed within the rigid support structure and configured to deposit PSA solution on the substrate in response to applied pressure. Each dispensing head of the plurality of dispensing heads includes a support structure and a wicking structure disposed within the…
Who is the assignee on this patent?
Ge Prec Healthcare Llc
What technology area does this patent fall under?
Primary CPC classification B05C1/06. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Mar 16 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).