Methods to create structures with engineered internal features, pores, and/or connected channels utilizing cold spray particle deposition

US2023073429A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023073429-A1
Application numberUS-202117795383-A
CountryUS
Kind codeA1
Filing dateFeb 26, 2021
Priority dateFeb 28, 2020
Publication dateMar 9, 2023
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention relates to a device and method for preparing a structure or object using an additive manufacturing process referred to as sequential cold spray laser sintering. The method includes depositing by cold spraying a plurality of sequential layers of material onto a substrate/build plate or particles of materials onto a compacted powder bed of material and employing an energy source to sinter or melt each of the plurality of sequential layers or powders to produce sequential sintered layers, wherein the number of additional layers is determined based on those needed to produce the final structure.

First claim

Opening claim text (preview).

1 . A method of preparing a multi-layer structure, comprising: a) cold spraying a layer of feedstock material onto a substrate/build plate to create a cold sprayed coating; b) employing an energy source to sinter or melt the cold sprayed coating, comprising: directing the energy source to conduct localized sintering or melting of specific particles or regions of the cold sprayed coating that correspond to a preselected multi-layer structure; and forming a sintered or melted layer; and c) sequentially repeating the steps of a) and b) forming one or more additional material layers on the first material layer, wherein the number of additional layers is determined based on a total number of layers needed to produce the preselected multi-layer structure. 2 . (canceled) 3 . (canceled) 4 . The method of claim 1 , wherein the feedstock material is in a dry form selected from the group consisting of particles, particulates, or granules. 5 . The method of claim 1 , wherein the sintering or melting process results in a fragmented oxide dispersed within the sintered or melted material and the preselected multi-layer structure. 6 . (canceled) 7 . The method of claim 1 , wherein adding a second material layer to the first material layer is effective to control or eliminate porosity in the first material layer. 8 . (canceled) 9 . The method of claim 1 , wherein following completion of the first material layer and a subsequent second material layer, power of the energy source is increased and used in trimming and shaping an outline of the preselected structure being prepared. 10 . (canceled) 11 . The method of claim 1 , wherein each of the feedstock materials comprises a material selected from the group consisting of metal, metal alloy, polymer, ceramic, semiconductor, and mixtures and combinations thereof. 12 . (canceled) 13 . The method of claim 1 , further comprising employing a CAD model corresponding to the preselected structure for directing and controlling the energy source in step b). 14 . The method of claim 1 , wherein step b) forms pores and/or pathways in the preselected multi-layer structure. 15 . The method of claim 1 , further comprising following step b) subjecting the sintered or melted layer to subtractive machining, comprising: smoothing the surface of the sintered or melted layer; and forming a first material layer of the preselected multi-layer structure. 16 . (canceled) 17 . An additive manufacture device, comprising: a cold spray apparatus to deposit a coating of feedstock material on a substrate/build plate; an energy source to sinter or melt the coating of feedstock material to form a sintered or melted layer; and a CAD model to direct the energy source to sinter specific particles or regions of the coating of the feedstock material that correspond to a preselected multi-layer structure, wherein one or more additional layers of feedstock material are sequentially deposited on the first material layer to produce one or more additional material layers, and wherein the number of additional material layers is determined based on those needed to produce the preselected multi-layer structure. 18 . An additive manufacture device, comprising: a cold spray apparatus to deposit compact powder of feedstock material on a powder bed generating a compact powder bed; an energy source to sinter or melt the compact powder bed of feedstock material to form a sintered or melted layer; and a CAD model to direct the energy source to sinter specific particles or regions of the compact powder layer of the feedstock material that correspond to a preselected multi-layer structure, wherein one or more additional layers of feedstock material are sequentially deposited on the first material layer to produce one or more additional material layers, and wherein the number of additional material layers is determined based on those needed to produce the preselected multi-layer structure. 19 . The device of claim 17 , wherein the feedstock material comprises a material selected from the group consisting of metal, metal alloy, polymer, ceramic, semiconductor, and mixtures and combinations thereof. 20 . (canceled) 21 . The device of claim 17 , wherein the multi-layer structure is a medical implant device. 22 . The device of claim 18 , wherein the feedstock material comprises a material selected from the group consisting of metal, metal alloy, polymer, ceramic, semiconductor and mixtures and combinations thereof. 23 . (canceled) 24 . The device of claim 18 , wherein the multi-layer structure is a medical implant device. 25 . (canceled) 26 . (canceled) 27 . (canceled) 28 . The device of claim 17 , wherein the one or more of the additional material layers of the multi-layer structure is/are composed of a different feedstock material as compared to the other material layers. 29 . (canceled) 30 . (canceled) 31 . The device of claim 17 , further comprising a subtractive machining apparatus to smooth the surface of the sintered or melted layer and form a first material layer of the preselected multi-layer structure. 32 . (canceled) 33 . The device of claim 18 , wherein the one or more of the additional material layers of the multi-layer structure is/are composed of a different feedstock material as compared to the other material layers. 34 . (canceled) 35 . The device of claim 18 , wherein the feedstock material is selected such that alternating material layers are composed of the same feedstock material or a pattern of material layers are composed of the same feedstock material. 36 . The device of claim 18 , further comprising a subtractive machining apparatus to smooth the surface of the sintered or melted layer and form a first material layer of the preselected multi-layer structure.

Assignees

Inventors

Classifications

  • using layers of powder being selectively joined, e.g. by selective laser sintering or melting · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Porous materials, {e.g. foams or sponges} · CPC title

  • Processes of additive manufacturing · CPC title

  • to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures · CPC title

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What does patent US2023073429A1 cover?
The invention relates to a device and method for preparing a structure or object using an additive manufacturing process referred to as sequential cold spray laser sintering. The method includes depositing by cold spraying a plurality of sequential layers of material onto a substrate/build plate or particles of materials onto a compacted powder bed of material and employing an energy source to …
Who is the assignee on this patent?
Univ Pittsburgh Commonwealth Sys Higher Education, Concurrent Tech Corporation
What technology area does this patent fall under?
Primary CPC classification B22F10/25. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Mar 09 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).