Substrate treating apparatus

Patent metadata

Field	Value
Publication number	US-2023064390-A1
Application number	US-202217895540-A
Country	US
Kind code	A1
Filing date	Aug 25, 2022
Priority date	Aug 26, 2021
Publication date	Mar 2, 2023
Grant date	—

Abstract

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space therein; a support unit positioned within the treating space and configured to support a substrate; and a plasma generation unit configured to generate a plasma from a process gas supplied to the treating space, and wherein the plasma generation unit includes: a bottom electrode member; and a top electrode member opposite the bottom electrode, and wherein the top electrode member includes: a first plate; and an electrode layer on the first plate and including an electrode.

First claim

What is claimed is:

1 . A substrate treating apparatus comprising:
a chamber having a treating space therein; a support unit positioned within the treating space and configured to support a substrate; and a plasma generation unit configured to generate a plasma from a process gas supplied to the treating space, and wherein the plasma generation unit comprises: a bottom electrode member; and a top electrode member opposite the bottom electrode, and wherein the top electrode member comprises: a first plate; and an electrode layer on the first plate and including an electrode.

2 . The substrate treating apparatus of claim 1 , wherein the electrode layer is made of and/or comprises a transparent material.

3 . The substrate treating apparatus of claim 1 , wherein the electrode layer comprises an ITO, an MnSnO, a CNT, a ZnO, an IZO, an ATO, an SnO 2 , IrO 2 , RuO 2 , a graphene, a carbon nanotube (CNT), an AZO, an FTO, a GZO, an In 2 O 3 , an MgO, a conductive polymer, a metal nanowire, mixtures thereof, or multiple layers thereof.

4 . The substrate treating apparatus of claim 1 , wherein the electrode comprises a plurality of ring-shaped concentric electrode segments.

5 . The substrate treating apparatus of claim 4 , wherein the plurality of ring-shaped concentric electrode segments have the same spacing and different widths.

6 . The substrate treating apparatus of claim 4 , wherein the plurality of ring-shaped concentric electrode segments have the same width and different spacings.

7 . The substrate treating apparatus of claim 1 , wherein the electrode comprises a plurality of line electrode segments arranged side by side.

8 . The substrate treating apparatus of claim 1 , wherein the electrode comprises a plurality of first line electrode segments and a plurality of second line electrode segments, the first line electrode segments crossing and connected to the second line electrode segments.

9 . The substrate treating apparatus of claim 1 , wherein the electrode comprises a plurality of first electrode segments and a plurality of second electrode segments alternatively arranged, one ends of the first electrode segments being connected to each other and opposite ends of the second electrode segments being connected to each other.

10 . The substrate treating apparatus of claim 1 , wherein the electrode comprises a plurality of rectangular ring segments having the same center and different diameters.

11 . The substrate treating apparatus of claim 1 , wherein the electrode comprises a first rectangular helix segment and a second rectangular helix segment, the starting end of the first rectangular helix segment connected to the starting end of the second rectangular helix segment.

12 . The substrate treating apparatus of claim 1 , wherein the electrode comprises a plurality of ring-shaped concentric electrodes, each ring-shaped electrode segment having arc portions spaced part from each other, and respective arc portions of the plurality of ring-shaped concentric electrodes being connected to each other by respective connection portion.

13 . The substrate treating apparatus of claim 1 , wherein the bottom electrode member, the top electrode member or both the top and bottom electrode member is connected to a power source.

14 . The substrate treating apparatus of claim 1 , wherein one of the bottom electrode member and the top electrode member is applied with the power source, and the other is grounded.

15 . The substrate treating apparatus of claim 1 , wherein the first plate is made of and/or comprises a transparent material.

16 . The substrate treating apparatus of claim 1 , wherein the first plate is made of and/or comprises a dielectric substance.

17 . The substrate treating apparatus of claim 1 , wherein the first plate is made of and/or comprises a quartz material.

18 . The substrate treating apparatus of claim 1 , wherein a protective layer of an etching-resistant material is further provided at a surface of the first plate facing the treating space.

19 . The substrate treating apparatus of claim 1 further comprising a heating unit positioned above the top electrode member and irradiating an energy through the top electrode member to the substrate to heat the substrate.

20 . A substrate treating apparatus comprising:
a chamber having a treating space therein; a support unit positioned within the treating space and configured to support a substrate; a plasma generation unit configured to generate a plasma from a process gas supplied to the treating space and including a bottom electrode member and a top electrode member opposite the bottom electrode member; a power source applying a power to the bottom electrode member, the top electrode member or both the top and bottom electrodes; and a high-speed heating source positioned above the top electrode member and irradiating an energy through the top electrode member to the substrate for heating the substrate, and wherein the top electrode member comprises: a first plate made of and/or comprising a quartz material; an electrode layer on the first plate and including a transparent electrode; and a protective layer of an etching-resistant material provided at a side of the first plate facing the treating space.

Assignees

• Semes Co Ltd

Inventors

• Jeon Min Sung
• Kim Yun Sang
• Choi Sung Min
• Jang Dong Young
• Kim Ji Heon
• Jin Young Jo

Classifications

• H01J37/32091

  the radio frequency energy being capacitively coupled to the plasma · CPC title

• H01J37/32495 Primary

  Means for protecting the vessel against plasma · CPC title

• H01J37/32541

  Shape · CPC title

• H01J37/3255 Primary

  Material · CPC title

• H01J37/32724

  Temperature · CPC title