Electronic package

Patent metadata

Field	Value
Publication number	US-2023064355-A1
Application number	US-202217899842-A
Country	US
Kind code	A1
Filing date	Aug 31, 2022
Priority date	Sep 1, 2021
Publication date	Mar 2, 2023
Grant date	—

Abstract

An electronic package is provided and includes an electronic element connected to a plurality of inductor circuits embedded in an insulator of a package substrate by fan-out conductive copper pillars, and at least one shielding layer non-electrically connected to the inductor circuits, where the shielding layer includes a plurality of line segments not connected to each other, such that the shielding layer shields the inductor circuits, thereby achieving the electrical requirements of high-current products while improving the inductance value and quality factor.

First claim

What is claimed is:

1 . An electronic package, comprising:
an insulator having a first side and a second side opposing the first side; a plurality of layers of spiral inductor circuits embedded in the insulator in a form of layered interval stacking; at least one conductor embedded in the insulator and connected to any two of the adjacent spiral inductor circuits stacked at interval; a plurality of shielding layers oppositely embedded in the first side and the second side of the insulator to shield the spiral inductor circuits without being electrically connected to the spiral inductor circuits, wherein the plurality of shielding layers comprise a plurality of line segments without connecting to each other; a build-up circuit structure having a third side and a fourth side opposing the third side and stacked on the first side of the insulator via the fourth side thereof, wherein the build-up circuit structure is electrically connected to the spiral inductor circuits; and at least one electronic element embedded and packaged in the build-up circuit structure and electrically connected to the build-up circuit structure via fan-out conductive copper pillars.

2 . The electronic package of claim 1 , wherein a material for forming the insulator comprises Ajinomoto build-up film, polyimide, or molded epoxy resin.

3 . The electronic package of claim 1 , further comprising at least one copper pillar embedded in the insulator and electrically connected to at least one end of the spiral inductor circuits, at least one electrical connecting pad formed on the first side or the second side of the insulator and electrically connected to the copper pillar, wherein the electrical connecting pad is exposed from the insulator, and a cross-sectional shape and an area of the copper pillar are correspondingly similar to those of the electrical connecting pad.

4 . The electronic package of claim 1 , wherein the conductor corresponds to a shape of each of the spiral inductor circuits to form an arc-shaped sheet body or an arc-shaped wall body.

5 . The electronic package of claim 1 , wherein the plurality of line segments without connecting to each other of the shielding layers are arranged in a pattern of a circular outline or a polygonal outline to present in a radial shape, a polycyclic shape, or a straight-parallel shape.

6 . The electronic package of claim 1 , wherein a composition of the shielding layers comprises a magnetic material or a non-magnetic metal, and the magnetic material is at least one of iron (Fe), nickel (Ni), cobalt (Co), manganese (Mn), zinc (Zn), or a combination thereof.

7 . The electronic package of claim 1 , wherein partial surfaces of the shielding layers are provided with a magnetic layer comprising a magnetic material, and the shielding layers are composed of a non-magnetic metal, and the magnetic material is at least one of iron (Fe), nickel (Ni), cobalt (Co), manganese (Mn), zinc (Zn), or a combination thereof.

8 . The electronic package of claim 1 , further comprising a core body embedded in the insulator and the core body comprising at least one annular conductive pillar or at least one solid conductive pillar, wherein the spiral inductor circuits surround the core body, and a composition of the core body comprises a magnetic material or a non-magnetic metal.

9 . The electronic package of claim 8 , wherein a partial surface of the core body is provided with a magnetic layer comprising a magnetic material, and the core body is composed of a non-magnetic metal.

10 . The electronic package of claim 1 , further comprising a shielding member embedded in the insulator and surrounding the spiral inductor circuits, wherein the shielding member is an arc-segment-shaped plate body or an arc-segment-shaped wall body arranged in a ring shape, and a composition of the shielding member comprises a magnetic material or a non-magnetic metal.

11 . The electronic package of claim 10 , wherein a partial surface of the shielding member is provided with a magnetic layer comprising a magnetic material, and the shielding member is composed of a non-magnetic metal.

12 . An electronic package, comprising:
a build-up circuit structure having a third side and a fourth side opposing the third side; at least one electronic element embedded and packaged in the build-up circuit structure and electrically connected to the build-up circuit structure via fan-out conductive copper pillars; an insulator having a first side and a second side opposing the first side, wherein the insulator is stacked on the third side of the build-up circuit structure via the second side thereof; a plurality of layers of spiral inductor circuits embedded in the insulator in a form of layered interval stacking, wherein the spiral inductor circuits are electrically connected to the build-up circuit structure; at least one conductor embedded in the insulator and connected to any two of the adjacent spiral inductor circuits stacked at interval; and a plurality of shielding layers oppositely embedded in the first side and the second side of the insulator to shield the spiral inductor circuits without being electrically connected to the spiral inductor circuits, wherein the plurality of shielding layers comprise a plurality of line segments without connecting to each other.

13 . The electronic package of claim 12 , wherein a material for forming the insulator comprises Ajinomoto build-up film, polyimide, or molded epoxy resin.

14 . The electronic package of claim 12 , further comprising at least one copper pillar embedded in the insulator and electrically connected to at least one end of the spiral inductor circuits, and at least one electrical connecting pad formed on the first side or the second side of the insulator and electrically connected to pad formed on the first side or the second side of the insulator and electrically connected to the copper pillar, wherein the electrical connecting pad is exposed from the insulator, and a cross-sectional shape and an area of the copper pillar are correspondingly similar to those of the electrical connecting pad.

15 . The electronic package of claim 12 , wherein the conductor corresponds to a shape of each of the spiral inductor circuits to form an arc-shaped sheet body or an arc-shaped wall body.

16 . The electronic package of claim 12 , wherein the plurality of line segments without connecting to each other of the shielding layers are arranged in a pattern of a circular outline or a polygonal outline to present in a radial shape, a polycyclic shape, or a straight-parallel shape.

17 . The electronic package of claim 12 , wherein a composition of the shielding layers comprises a magnetic material or a non-magnetic metal, and the magnetic material is at least one of iron (Fe), nickel (Ni), cobalt (Co), manganese (Mn), zinc (Zn), or a combination thereof.

18 . The electronic package of claim 12 , wherein partial surfaces of the shielding layers are provided with a magnetic layer comprising a magnetic material, and the shielding layers are composed of a non-magnetic metal, and the magnetic material is at least one of iron (Fe), nickel (Ni), cobalt (Co), manganese (Mn), zinc (Zn), or a combination thereof.

19 . The electronic package of claim 12 , further comprising a core body embedded in the insulator and the core body comprising at least one annular conductive pillar or at least one solid conductive pillar, wherein the spiral inductor circuits surround the core body, and a composition of the core body comprise

Assignees

• Phoenix Pioneer Technology Co Ltd

Inventors

• Hsu Che-Wei

Classifications

• H10W70/6528

  of the portions that connect to chips, wafers or package parts · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title