Semiconductor device and method for operating the same

Patent metadata

Field	Value
Publication number	US-2023057157-A1
Application number	US-202117599718-A
Country	US
Kind code	A1
Filing date	May 21, 2021
Priority date	Jun 5, 2020
Publication date	Feb 23, 2023
Grant date	—

Abstract

The present disclosure relates to a semiconductor device, including: at least two processing units; a processing liquid spraying arm, which is located above the processing units; a fixed baffle, located between the adjacent processing units, the fixed baffle being provided with an opening by which the adjacent processing units are communicated, the processing liquid spraying arm moving between the adjacent processing units through the opening; a movable baffle, located at least on one side of the fixed baffle or located in the fixed baffle; a first driving apparatus, connected to the movable baffle and configured to drive the movable baffle to move to completely block the opening when the processing liquid spraying arm stops in the processing unit, so as to isolate the adjacent processing units, and drive the movable baffle to move to unblock the opening when the processing liquid spraying arm moves between the adjacent processing units.

First claim

1 . A semiconductor device, comprising:
at least two processing units, each of the processing units is provided with a carrier for placing a wafer to be processed; a processing liquid spraying arm, the processing liquid spraying arm is located above the processing units and is able to move between the adjacent processing units to spray processing liquid on a surface of the wafer to be processed in each of the processing units; a fixed baffle, located between the adjacent processing units, the fixed baffle being provided with an opening, by the opening the adjacent processing units are communicated, the processing liquid spraying arm moving between the adjacent processing units through the opening; a movable baffle, located at least on one side of the fixed baffle; a first driving apparatus, connected to the movable baffle and configured to drive the movable baffle to move to completely block the opening when the processing liquid spraying arm stops in the processing unit, so as to isolate the adjacent processing units, and drive the movable baffle to move to unblock the opening when the processing liquid spraying arm moves between the adjacent processing units.

2 . The semiconductor device according to claim 1 , wherein the first driving apparatus comprises:
a cylinder, comprising a cylinder body and a driving rod, the cylinder body being provided with an accommodating cavity, one end of the driving rod being located in the accommodating cavity and the other end of the driving rod being connected to the movable baffle; a gas pipeline, one end of the gas pipeline is connected to the accommodating cavity and the other end of the gas pipeline is connected to a gas source; and a solenoid valve, located on the gas pipeline and configured to control an on-off of the gas pipeline.

3 . The semiconductor device according to claim 1 , wherein the semiconductor device further comprises a second driving apparatus, connected to the processing liquid spraying arm and configured to drive the processing liquid spraying arm to move.

4 . The semiconductor device according to claim 3 , wherein the semiconductor device further comprises a control apparatus, connected to the processing liquid spraying arm and the movable baffle and configured to control the first driving apparatus to drive the movable baffle to move so as to unblock the opening when controlling the second driving apparatus to drive the processing liquid spraying arm to move between the adjacent processing units, and control the first driving apparatus to drive the movable baffle to move to completely block the opening after the processing liquid spraying arm moves to a target processing unit.

5 . The semiconductor device according to claim 1 , wherein the fixed baffle and the movable baffle are both metal baffles.

6 . The semiconductor device according to claim 1 , wherein, when the movable baffle is located at least on one side of the fixed baffle, there is a distance between the movable baffle and the fixed baffle.

7 . The semiconductor device according to claim 6 , wherein the distance between the movable baffle and the fixed baffle is 0.5 mm to 2 mm.

8 . The semiconductor device according to claim 1 , wherein the semiconductor device further comprises an equipment chamber, the processing unit, the processing liquid spraying arm, the fixed baffle and the movable baffle are all located in the equipment chamber, and the fixed baffle and the equipment chamber are fixedly connected by a fixed screw.

9 . A method for operating the semiconductor device according to claim 1 , comprising:
driving the movable baffle to move to unblock the opening when the processing liquid spraying arm moves from one processing unit to another adjacent processing unit where the wafer to be processed is placed; and driving the movable baffle to move to completely block the opening after the processing liquid spraying arm moves to the processing unit where the wafer to be processed is placed.

10 . The operating method according to claim 9 , before the processing liquid spraying arm moves from one processing unit to another adjacent processing unit where the wafer to be processed is placed, the operating method further comprises spraying, by the processing liquid spraying arm, the processing liquid on the surface of the wafer to be processed below the processing liquid spraying arm;
after driving the movable baffle to move to completely block the opening, the operating method further comprises spraying, by the processing liquid spraying arm, the processing liquid on the surface of the wafer to be processed below the processing liquid spraying arm; and after driving the movable baffle to move to completely block the opening and after spraying, by the processing liquid spraying arm, the processing liquid on the surface of the wafer to be processed below the processing liquid spraying arm, the operating method further comprises repeating the above steps at least one time.

Assignees

• Changxin Memory Tech Inc

Inventors

• Jiang Ping

Classifications

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• G03F7/3021 Primary

  from a wafer supported on a rotating chuck · CPC title

• G03F7/30 Primary

  Imagewise removal using liquid means · CPC title