Thermally conductive filler, thermally conductive composite material, wire harness, and method for manufacturing thermally conductive filler

Patent metadata

Field	Value
Publication number	US-2023047707-A1
Application number	US-202017788584-A
Country	US
Kind code	A1
Filing date	Dec 4, 2020
Priority date	Dec 23, 2019
Publication date	Feb 16, 2023
Grant date	—

Abstract

A thermally conductive filler capable of exhibiting high thermal conductive properties with its specific gravity being reduced, a thermally conductive composite material and a wire harness that contains such a thermally conductive filler, and a method for forming a thermally conductive filler that can be used to form such a thermally conductive filler. A thermally conductive filler includes a hollow particle having a polar group on its surface, and a thermally conductive layer containing an inorganic compound that covers the surface of the hollow particle. Also, a thermally conductive composite material contains the thermally conductive filler and a matrix material, the thermally conductive filler being dispersed in the matrix material. Furthermore, a wire harness contains the thermally conductive composite material.

First claim

1 . A thermally conductive filler comprising:
a hollow particle having a polar group on its surface; and a thermally conductive layer comprising an inorganic compound that covers the surface of the hollow particle, wherein the thermally conductive layer is in the form of a film of the inorganic compound that is attached to the surface of the hollow particle.

2 . The thermally conductive filler according to claim 1 ,
wherein the polar group is an acidic group.

3 . The thermally conductive filler according to claim 1 ,
wherein the polar group is bound to the surface of the hollow particle via a siloxane bond.

4 . The thermally conductive filler according to claim 1 ,
wherein the hollow particle is formed as a hollow body made of a material comprising an inorganic compound that is different from the inorganic compound contained in the thermally conductive layer, or a material containing an organic polymer.

5 . The thermally conductive filler according to claim 1 ,
wherein the hollow particle is formed as a hollow body made of glass surface-treated with a polar group.

6 . The thermally conductive filler according to claim 1 ,
wherein the thermally conductive layer includes a compound containing at least one of Al or Mg.

7 . The thermally conductive filler according to claim 1 , having a specific gravity of 1.5 or lower.

8 . A thermally conductive composite material comprising:
the thermally conductive filler according to claim 1 ; and a matrix material, wherein the thermally conductive filler is dispersed in the matrix material.

9 . The thermally conductive composite material according to claim 8 ,
wherein the matrix material contains an organic polymer.

10 . The thermally conductive composite material according to claim 8 , having a specific gravity of 1.5 or lower.

11 . The thermally conductive composite material according to claim 8 , having a thermal conductivity of 0.9 W/(m·K) or higher at room temperature.

12 . A wire harness comprising the thermally conductive composite material according to claim 8 .

13 . A method for manufacturing a thermally conductive filler capable of being used to manufacture the thermally conductive filler according to claim 1 ,
wherein the method uses a raw material for forming the thermally conductive layer as it is or through chemical reaction, and a raw particle formed as a hollow particle having a polar group on its surface, and the method comprises a step of binding the raw material onto the polar group on the surface of the raw particle.

14 . The method for manufacturing a thermally conductive filler according to claim 13 ,
wherein the raw material is at least one of a metal alkoxide or a metal carbonate.

15 . The method for manufacturing a thermally conductive filler according to claim 14 ,
wherein a metal hydrate or metal hydroxide is formed from the raw material in the state of a film, bound to the surface of the raw particle, and is oxidized with oxygen in the atmosphere to form the thermally conductive layer containing at least one of a metal hydroxide or metal oxide.

Assignees

• Autonetworks Technologies Ltd
• Sumitomo Wiring Systems
• Sumitomo Electric Industries
• Univ Kyushu Nat Univ Corp

Inventors

• Oshiumi Naoyuki
• Hosokawa Takehiro
• Nakashima Kazuo
• Kawakami Takashi
• Maeda Yusaku
• Mizoguchi Makoto

Classifications

• C08K2201/001

  Conductive additives · CPC title

• C08K2003/2227

  of aluminium · CPC title

• C08K9/02

  Ingredients treated with inorganic substances · CPC title

• C08K7/28

  Glass · CPC title

• C08K9/04

  Ingredients treated with organic substances {(treated with macromolecular compounds C08K9/08)} · CPC title