Vibration sensors

Patent metadata

Field	Value
Publication number	US-2023046902-A1
Application number	US-202217814533-A
Country	US
Kind code	A1
Filing date	Jul 25, 2022
Priority date	Aug 11, 2021
Publication date	Feb 16, 2023
Grant date	—

Abstract

The embodiments of the present disclosure may disclose a vibration sensor, including: an acoustic transducer and a vibration assembly connected with the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and the mass blocks may be physically connected with the vibration diaphragms. The vibration assembly may be configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands.

First claim

1 . A vibration sensor, comprising:
an acoustic transducer; a vibration assembly connected with the acoustic transducer, the vibration assembly being configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly including one or more groups of vibration diaphragms and mass blocks, the mass blocks being physically connected with the vibration diaphragms; the vibration assembly being configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands, wherein the one or more groups of vibration diaphragms and mass blocks are arranged in order in a vibration direction of the vibration diaphragms; a distance between adjacent vibration diaphragms in the vibration assembly is no less than a maximum amplitude of the adjacent vibration diaphragms.

2 . (canceled)

3 . The vibration sensor of claim 1 , wherein a projection area of the mass blocks is located within a projection area of the vibration diaphragms in a vibration direction of the vibration diaphragms.

4 . The vibration sensor of claim 1 , wherein each group of the one or more groups of vibration diaphragms and mass blocks corresponds to one of the one or more different target frequency bands, so that the sensitivity degree of the vibration sensor is greater than the sensitivity degree of the acoustic transducer in the corresponding target band.

5 . The vibration sensor of claim 4 , wherein resonance frequencies of the one or more groups of vibration diaphragms and mass blocks are smaller than a resonance frequency of the vibration sensor, so that the sensitivity degree of the vibration sensor is greater than the sensitivity degree of the acoustic transducer in the one or more target frequency bands.

6 . The vibration sensor of claim 5 , wherein a difference between one of the resonance frequencies of the one or more groups of vibration diaphragms and mass blocks and the resonance frequency of the acoustic transducer is in 1 kHz˜10 kHz.

7 . The vibration sensor of claim 4 , wherein resonance frequencies of at least two groups of the one or more groups of vibration diaphragms and mass blocks are different.

8 . The vibration sensor of claim 7 , wherein among resonance frequencies of the groups of vibration diaphragms and mass blocks, a difference between two adjacent resonance frequencies is smaller than 2 kHz or is not greater than 1 kHz.

9 . (canceled)

10 . The vibration sensor of claim 4 , wherein resonance frequencies of the one and more groups of vibration diaphragms and mass blocks are within 1 kHz and 10 kHz or within 1 kHz and 5 kHz.

11 - 15 . (canceled)

16 . The vibration sensor of claim 1 , wherein the vibration assembly further includes a supporting structure configured to support the one or more groups of vibration diaphragms and mass blocks, the supporting structure is physically connected with the acoustic transducer, and the one or more groups of vibration diaphragms and mass blocks are connected with the supporting structure.

17 . The vibration sensor of claim 16 , wherein the supporting structure is made of an airtight material.

18 . The vibration sensor of claim 16 , wherein,
in a direction perpendicular to a surface of the vibration diaphragm connected with the mass block, a projected area of the mass block does not overlap with a projected area of the supporting structure.

19 . The vibration sensor of claim 1 , wherein
the mass blocks are concentric with the vibration diaphragms.

20 . The vibration sensor of claim 1 , wherein the vibration diaphragms are constructed to let air through.

21 . The vibration sensor of claim 20 , wherein the vibration diaphragms are provided with through holes or include a breathable diaphragm.

22 - 23 . (canceled)

24 . The vibration sensor of claim 20 , wherein among the vibration diaphragms, a vibration diaphragm furthest from the acoustic transducer is constructed so that no air can pass through.

25 . The vibration sensor of claim 2 , wherein the vibration assembly further includes a limit structure; the limit structure is configured to make a distance between adjacent vibration diaphragms in the vibration assembly not less than the maximum amplitude of the adjacent vibration diaphragms.

26 . The vibration sensor of claim 1 , wherein the acoustic transducer is an air conduction microphone;
resonance frequencies of the one or more groups of vibration diaphragms and mass blocks are configured to be 1 kHz˜10 kHz lower than the resonance frequency of the air conduction microphone.

27 . The vibration sensor of claim 26 , wherein the air conduction microphone includes a sound pickup hole, the one or more groups of vibration diaphragms and mass blocks are arranged in the sound pickup hole parallel to a radial section of the sound pickup hole; or
outside of the sound pickup hole.

28 . The vibration sensor of claim 27 , wherein the mass blocks do not contact an inner wall of the sound pickup hole.

29 . A sound input device, comprising a vibration sensor wherein the vibration sensor includes:
an acoustic transducer; a vibration assembly connected with the acoustic transducer, the vibration assembly being configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly including one or more groups of vibration diaphragms and mass blocks, the mass blocks being physically connected with the vibration diaphragms; the vibration assembly being configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands, wherein the one or more groups of vibration diaphragms and mass blocks are arranged in order in a vibration direction of the vibration diaphragms; a distance between adjacent vibration diaphragms in the vibration assembly is no less than a maximum amplitude of the adjacent vibration diaphragms.

Assignees

• Shenzhen Shokz Co Ltd

Inventors

• Yuan Yongshuai
• Deng Wenjun
• Zhou Wenbing
• Huang Yujia
• Liao Fengyun
• Qi Xin

Classifications

• H04R1/222

  for microphones (H04R1/24, H04R1/26 take precedence) · CPC title

• H04R19/005

  using semiconductor materials · CPC title

• H04R7/04

  Plane diaphragms · CPC title

• H04R17/10

  Resonant transducers, i.e. adapted to produce maximum output at a predetermined frequency · CPC title

• H04R2410/03

  Reduction of intrinsic noise in microphones · CPC title