Connection terminal

US2023042851A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023042851-A1
Application numberUS-202117789716-A
CountryUS
Kind codeA1
Filing dateJan 12, 2021
Priority dateJan 14, 2020
Publication dateFeb 9, 2023
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A connection terminal having a copper alloy as a base material, the copper alloy comprising Zn in an amount of 21 mass % or more and 27 mass % or less, Sn in an amount of 0.6 mass % or more and 0.9 mass % or less, Ni in an amount of 2.5 mass % or more and 3.7 mass % or less, and P in an amount of 0.01 mass % or more and 0.03 mass % or less, and the balance being Cu and inevitable impurities, wherein the copper alloy has: a 0.2% proof stress of 620 MPa or higher and 700 MPa or lower, and an electrical conductivity of 15% IACS or higher and 20% IACS or lower.

First claim

Opening claim text (preview).

1 . A connection terminal comprising a copper alloy as a base material, the copper alloy comprising: Zn in an amount of 21 mass % or more and 27 mass % or less; Sn in an amount of 0.6 mass % or more and 0.9 mass % or less; Ni in an amount of 2.5 mass % or more and 3.7 mass % or less; and P in an amount of 0.01 mass % or more and 0.03 mass % or less, and the balance being Cu and inevitable impurities, wherein the copper alloy has: a 0.2% proof stress of 620 MPa or higher and 700 MPa or lower; and an electrical conductivity of 15% IACS or higher and 20% IACS or lower. 2 . The connection terminal according to claim 1 , wherein a solid solution strengthening index τ s calculated by a formula below satisfies 60≤τ s ≤75, τ s =(164[Zn] 2/3 +858[Sn] 2/3 +45.6[Ni] 2/3 )/(190−0.1[Zn]−0.9[Sn]+0.1[Ni]) 2/3 , where [Zn], [Sn], and [Ni] represent the amount of Zn, Sn, and Ni in the base material in mass %, respectively. 3 . The connection terminal according to claim 1 , wherein the copper alloy has an average grain size of 2.0 μm or larger and 5.0 μm or smaller. 4 . The connection terminal according to claim 1 , wherein the copper alloy further comprises Fe in an amount of 0.02 mass % or less. 5 . The connection terminal according to claim 1 , wherein the copper alloy further comprises at least one selected from the group consisting of Co, Cr, Zr, Ti, Mn, and V in a total amount of 0.1 mass % or less. 6 . The connection terminal according to claim 1 , wherein the copper alloy has the 0.2% proof stress of 620 MPa or higher and 700 MPa or lower in a direction perpendicular to a rolling direction. 7 . The connection terminal according to claim 1 , comprising: a spring portion where the copper alloy in the form of a place is bent in a direction perpendicular to a rolling direction of the copper alloy, in a region that includes a contact portion that makes electrical contact with a counterpart electrical contact portion. 8 . The connection terminal according to claim 7 , wherein the connection terminal is a female terminal. 9 . The connection terminal according to claim 1 , wherein a tab width, which is defined as the width of a tab of a mating counterpart male terminal if the connection terminal is a female terminal, and which is defined as the width of the tab of a male terminal if the connection terminal is the male terminal, is 0.5 mm or smaller. 10 . The connection terminal according to claim 1 , wherein the copper alloy constitutes the connection terminal in the form of a plate with a thickness of 0.20 mm or smaller.

Assignees

Inventors

Classifications

  • C22C9/04Primary

    with zinc as the next major constituent · CPC title

  • of copper or alloys based thereon · CPC title

  • co-operating with pins or blades having a rectangular transverse section · CPC title

  • H01R13/03Primary

    characterised by the material, e.g. plating, or coating materials · CPC title

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What does patent US2023042851A1 cover?
A connection terminal having a copper alloy as a base material, the copper alloy comprising Zn in an amount of 21 mass % or more and 27 mass % or less, Sn in an amount of 0.6 mass % or more and 0.9 mass % or less, Ni in an amount of 2.5 mass % or more and 3.7 mass % or less, and P in an amount of 0.01 mass % or more and 0.03 mass % or less, and the balance being Cu and inevitable impurities, wh…
Who is the assignee on this patent?
Autonetworks Technologies Ltd, Sumitomo Wiring Systems, Sumitomo Electric Industries, and 1 more
What technology area does this patent fall under?
Primary CPC classification C22C9/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Feb 09 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).