Method for probe pin retrieval

Patent metadata

Field	Value
Publication number	US-2023034452-A1
Application number	US-202217687400-A
Country	US
Kind code	A1
Filing date	Mar 4, 2022
Priority date	Jul 30, 2021
Publication date	Feb 2, 2023
Grant date	—

Abstract

A method for retrieving a probe pin includes following operations. A probe head is received in a carrier. The probe head includes an upper die, a lower die, and at least a probe pin extending in a direction from the lower die to the upper die. A first bending delta between a probe tip of the probe pin and a pin tip of the probe pin is measured. The probe pin is bended by a bending fixture when the first bending delta is greater than a value to obtain a second bending delta between the pin tip and the pin head. The probe pin is pushed in the direction from the lower die tow the upper die by a plate. The probe pin is picked from the probe head by an arm.

First claim

What is claimed is:

1 . A method for retrieving a probe pin, comprising:
receiving a probe head in a carrier, wherein the probe head comprises an upper die, a lower die, and at least a probe pin extending in a direction from the lower die to the upper die; measuring a first bending delta between a pin tip of the probe pin and a pin head of the probe pin; bending the probe pin by a bending fixture when the first bending delta is greater than a value to obtain a second bending delta between the pin tip and the pin head; pushing the probe pin in the direction from the lower die to the upper die by a plate; and picking the probe pin from the probe head by an arm.

2 . The method of claim 1 , wherein the second bending delta is less than the value.

3 . The method of claim 1 , wherein the value is approximately 120 micrometers.

4 . The method of claim 1 , wherein a distance between the pin head of the probe pin and a surface of the upper die is greater than 200 micrometers after the pushing of the probe pin.

5 . The method of claim 1 , further comprising retrieving the probe pin and putting the probe pin into a pin box by the arm.

6 . The method of claim 5 , further comprising:
picking the probe pin from the pin box by the arm; and assembling the probe pin into another probe head by the arm, wherein a third bending delta between the pin tip of the probe pin and the pin head of the probe pin is equal to or less than the second bending delta.

7 . The method of claim 1 , wherein the measuring of the first bending delta is performed by a charge-coupled device (CCD).

8 . A method for retrieving a probe pin, comprising:
receiving a probe head, wherein the probe head comprises an upper die, a lower die, and at least a probe pin extending in a direction from the lower die to the upper die; and using a bending fixture to clamp the upper die and move the upper die so as to bend the probe pin in a direction parallel to a surface of the upper die, wherein the probe pin has a first bending delta prior to the moving of the upper die, and a second bending delta after the moving of the upper die, and the second bending delta is less than the first bending delta.

9 . The method of claim 8 , wherein the first bending delta is greater than approximately 120 micrometers.

10 . The method of claim 8 , wherein the second bending delta is less than approximately 120 micrometers.

11 . The method of claim 8 , wherein the upper die comprises a through hole allowing the probe pin through.

12 . The method of claim 8 , further comprising:
using a plate to push the probe pin in the direction from the lower die to the upper die; and using an arm to retrieve the probe pin from the probe head.

13 . The method of claim 12 , wherein a distance between a pin head of the probe pin and a surface of the upper die is greater than approximately 200 micrometers.

14 . The method of claim 8 , further comprising using a charge-coupled device (CCD) to measure the first bending delta and the second bending delta.

15 . A method for retrieving a probe pin, comprising:
receiving a probe head in a carrier, wherein the probe head comprises an upper die, a lower die, and at least a probe pin extending in a direction from the lower die to the upper die; using a charge-coupled device to measure a first bending delta between a pin tip of the probe pin and a pin head of the probe pin; performing a deformation correction when the first bending delta is greater than a value, wherein the deformation correction comprises:
using a bending fixture to clamp the upper die of the probe head; and
moving the bending fixture to bend the probe pin to obtain a second bending delta between the pin tip and the pin head;
pushing the probe pin in the direction from the lower die to the upper die by a plate after the performing of the deformation correction or when the first bending delta is less than the value; and picking the probe pin from the probe head by an arm.

16 . The method of claim 15 , wherein the second bending delta is less than the value.

15 . method of claim 15 , wherein a distance between the pin head of the probe pin and a surface of the upper die is greater than 200 micrometers after the pushing of the probe pin.

18 . The method of claim 15 , further comprising retrieving the probe pin and putting the probe pin into a pin box by the arm.

19 . The method of claim 18 , further comprising:
picking the probe pin from the pin box by the arm; and assembling the probe pin into another probe head by the arm, wherein a third bending delta between the pin tip of the probe pin and the pin head of the probe pin is equal to or less than the second bending delta.

20 . The method of claim 15 , wherein the value is approximately 120 micrometers.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Hsu Ming-Cheng
• Tu Wen-Chun

Classifications

• G01R1/07314 Primary

  the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support (on an elastic support, e.g. a film, G01R1/0735) · CPC title

• G01R1/06

  Measuring leads; Measuring probes (G01R19/145, G01R19/165 take precedence) · CPC title

• G01R3/00 Primary

  Apparatus or processes specially adapted for the manufacture {or maintenance} of measuring instruments {, e.g. of probe tips} · CPC title

• G01R1/07357

  with flexible bodies, e.g. buckling beams · CPC title

• G01R1/0675

  Needle-like · CPC title