Surface-treated copper foil and copper clad laminate

Patent metadata

Field	Value
Publication number	US-2023019067-A1
Application number	US-202117543645-A
Country	US
Kind code	A1
Filing date	Dec 6, 2021
Priority date	Jul 6, 2021
Publication date	Jan 19, 2023
Grant date	—

Abstract

A surface-treated copper foil includes a treated surface, where the peak extreme height (Sxp) of the treating surface is 0.4 to 3.0 μm. When the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of diffraction peak of (111) plane to the sum of the integrated intensities of diffraction peaks of (111) plane, (200) plane, and (220) plane of the treating surface is at least 60%.

First claim

What is claimed is:

1 . A surface-treated copper foil, comprising a treating surface, wherein a peak extreme height (Sxp) of the treating surface is in a range of 0.4 to 3.0 μm, and when the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of diffraction peak of ( 111 ) plane to the sum of the integrated intensities of diffraction peaks of ( 111 ) plane, ( 200 ) plane, and ( 220 ) plane of the treating surface is at least 60%.

2 . The surface-treated copper foil of claim 1 , wherein a texture aspect ratio (Str) of the treating surface is not greater than 0.68.

3 . The surface-treated copper foil of claim 1 , wherein a texture aspect ratio (Str) of the treating surface is in a range of 0.10 to 0.65.

4 . The surface-treated copper foil of claim 1 , wherein the ratio of the integrated intensity of diffraction peak of ( 111 ) plane to the sum of the integrated intensities of diffraction peaks of ( 111 ) plane, ( 200 ) plane, and ( 220 ) plane of the treating surface is in a range of 60% to 90%.

5 . The surface-treated copper foil of claim 1 , wherein the integrated intensities of diffraction peaks of ( 111 ) plane, ( 200 ) plane, and ( 220 ) plane of the treating surface are measured by grazing incidence X-ray diffraction with a grazing angle in a range of 0.5° to 1.0°.

6 . The surface-treated copper foil of claim 1 , wherein when the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of diffraction peak of ( 220 ) plane to the sum of the integrated intensities of diffraction peaks of ( 111 ) plane, ( 200 ) plane, and ( 220 ) plane of the treating surface is less than 16.50%, and an absolute value of a signal transmission loss of the surface-treated copper foil is less than or equal to 0.85 dB/in.

7 . The surface-treated copper foil of claim 1 , wherein the peel strength of the surface-treated copper foil is greater than 4.0 lb/in after a solder floating test is performed on the surface-treated copper foil at a temperature of 288° C. for 10 seconds and repeated 10 times.

8 . The surface-treated copper foil according to any one of claim 1 , wherein the surface-treated copper foil further comprises:
a bulk copper foil; and a surface treatment layer, disposed on at least one surface of the bulk copper foil, wherein the outer side of the surface treatment layer is the treating surface.

9 . The surface-treated copper foil of claim 8 , wherein the bulk copper foil is an electrodeposited copper foil, the surface treatment layer comprises a sub-layer, and the sub-layer is a roughening layer.

10 . The surface-treated copper foil of claim 9 , wherein the surface treatment layer further comprises at least one further sub-layer, the at least one further sub-layer is selected from the group consisting of a barrier layer, an anti-rust layer and a coupling layer.

11 . A copper-clad laminate, comprising:
a board; and a surface-treated copper foil, disposed on at least one surface of the board, wherein the surface-treated copper foil comprises:
a bulk copper foil; and
a surface treatment layer, disposed between the bulk copper foil and the board, wherein the surface treatment layer comprises a treating surface facing toward the board, and a peak extreme height (Sxp) of the treating surface is in a range of 0.4 to 3.0 μm, and the ratio of the integrated intensity of diffraction peak of ( 111 ) plane to the sum of the integrated intensities of diffraction peaks of ( 111 ) plane, ( 200 ) plane, and ( 220 ) plane of the treating surface is at least 60%.

12 . The copper-clad laminate of claim 11 , wherein the treating surface of the surface treatment layer is in direct contact with the board.

Assignees

• Chang Chun Petrochemical Co Ltd

Inventors

• Lai Chien-Ming
• Lai Yao-Sheng
• Chou Jui-Chang

Classifications

• B32B2255/06

  on metal layer · CPC title

• B32B15/14

  next to a fibrous or filamentary layer · CPC title

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title

• B32B2255/205

  Metallic coating · CPC title

• C25D7/0614

  Strips or foils · CPC title