Light emitting device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2023006109-A1
Application number	US-202217848408-A
Country	US
Kind code	A1
Filing date	Jun 24, 2022
Priority date	May 14, 2014
Publication date	Jan 5, 2023
Grant date	—

Abstract

A light emitting device and a manufacturing method thereof are provided. The light emitting device includes a light emitting unit, a fluorescent layer, a reflective layer, and a light-absorbing layer. The light emitting unit has a top surface, a bottom surface opposite to the top surface, and a side surface located between the top surface and the bottom surface. The light emitting unit includes an electrode disposed at the bottom surface. The fluorescent layer is disposed on the top surface of the light emitting unit. The reflective layer covers the side surface of the light emitting unit. The light-absorbing layer covers the reflective layer, so that the reflective layer is located between the side surface of the light emitting unit and the light-absorbing layer.

First claim

What is claimed is:

1 . A light emitting device, comprising:
a light emitting unit having a top surface, a bottom surface opposite to the top surface, and a side surface located between the top surface and the bottom surface, and the light emitting unit comprises an electrode disposed at the bottom surface; a fluorescent layer disposed on the top surface of the light emitting unit; a reflective layer covering the side surface of the light emitting unit; and a light-absorbing layer covering the reflective layer, so that the reflective layer is located between the side surface of the light emitting unit and the light-absorbing layer.

2 . The light emitting device of claim 1 , wherein a bottom end of the light-absorbing layer is aligned with a bottom end of the electrode of the light emitting unit.

3 . The light emitting device of claim 1 , wherein a bottom of the light-absorbing layer has an inwardly concave curved surface, and the inwardly concave curved surface is concave toward the light-absorbing layer along a direction away from the light emitting unit.

4 . The light emitting device of claim 1 , wherein in a thickness direction of the light emitting device, a distance between the light-absorbing layer and the fluorescent layer is gradually decreased along a direction away from the light emitting unit.

5 . The light emitting device of claim 1 , further comprising:
a circuit board, wherein the bottom surface of the light emitting unit faces the circuit board, and the electrode is electrically connected to the circuit board.

6 . The light emitting device of claim 5 , wherein in a thickness direction of the light emitting device, a distance between the light-absorbing layer and the circuit board is gradually increased along a direction away from the light emitting unit.

7 . The light emitting device of claim 1 , further comprising:
an adhesive layer covering the side surface of the light emitting unit, and the adhesive layer is located between the side surface of the light emitting unit and the reflective layer.

8 . The light emitting device of claim 1 , wherein a bottom of the reflective layer has an inwardly concave curved surface, and the inwardly concave curved surface is concave toward the light-absorbing layer along a direction away from the light emitting unit.

9 . The light emitting device of claim 8 , wherein in a thickness direction of the light emitting device, a thickness of a portion of the reflective layer located between the adhesive layer and the light-absorbing layer is gradually increased along the direction away from the light emitting unit.

10 . The light emitting device of claim 1 , wherein the fluorescent layer further comprises a low-concentration fluorescent layer and a high-concentration fluorescent layer stacked on each other, and the high-concentration fluorescent layer is located between the light emitting unit and the low-concentration fluorescent layer.

11 . A manufacturing method of a light emitting device, comprising:
providing a light emitting unit having a top surface, a bottom surface opposite to the top surface, and a side surface located between the top surface and the bottom surface, and the light emitting unit comprises an electrode disposed at the bottom surface; disposing the light emitting unit on a fluorescent material, so that the top surface of the light emitting unit faces the fluorescent material; forming a reflective layer covering the side surface of the light emitting unit; and forming a light-absorbing layer to cover the reflective layer, so that the reflective layer is located between the side surface of the light emitting unit and the light-absorbing layer.

12 . The manufacturing method of the light emitting device of claim 11 , wherein the step of disposing the light emitting unit on the fluorescent material and the step of forming the reflective layer comprise:
disposing a plurality of the light emitting units on the fluorescent material; forming a reflective material on the fluorescent material to cover a plurality of the light emitting units; and removing a portion of the reflective material to form a plurality of the reflective layer corresponding to and covering each of the light emitting units.

13 . The manufacturing method of the light emitting device of claim 12 , wherein the reflective material has an inwardly concave outer surface inwardly concave toward a direction of the fluorescent material.

14 . The manufacturing method of the light emitting device of claim 13 , wherein the removed portion of the reflective material corresponds to at least the inwardly concave outer surface.

15 . The manufacturing method of the light emitting device of claim 12 , wherein the step of forming the light-absorbing layer comprises:
forming a light-absorbing material between a plurality of the reflective layer; and removing a portion of the light-absorbing material to form a plurality of the light-absorbing layer corresponding to each of the light emitting units and covering each of the reflective layers, and the manufacturing method of the light emitting device further comprises:
removing a portion of the fluorescent material after the light-absorbing material is formed to form a plurality of fluorescent layers corresponding to each of the light emitting units.

16 . The manufacturing method of the light emitting device of claim 15 , wherein the light-absorbing material has an inwardly concave outer surface inwardly concave toward a direction of the fluorescent material.

17 . The manufacturing method of the light emitting device of claim 16 , wherein the removed portion of the light-absorbing material corresponds to at least the inwardly concave outer surface.

18 . The manufacturing method of the light emitting device of claim 11 , further comprising:
forming an adhesive layer, so that the light emitting unit and the fluorescent material are combined at least via the adhesive layer.

Assignees

• Genesis Photonics Inc

Inventors

• Wang yun-han
• Hung Chin-Hua
• Liu chuan-yu
• Shih Tsai-Chieh
• Chang Jui-Fu
• Wu Yu-Jung
• Lin Yu-Feng

Classifications

• H10P72/7418

  of passive members, e.g. a chip mounting substrate · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title