Coated metal alloy substrate and process for production thereof

Patent metadata

Field	Value
Publication number	US-2022403528-A1
Application number	US-201917777745-A
Country	US
Kind code	A1
Filing date	Dec 9, 2019
Priority date	Dec 9, 2019
Publication date	Dec 22, 2022
Grant date	—

Abstract

A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy CA substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).

First claim

1 . A coated metal alloy substrate for an electronic device, wherein the coated metal alloy substrate comprises at least one chamfered edge and comprises:
a passivation layer deposited on the at least one chamfered edge; an electrophoretic deposition layer deposited on the passivation layer; and a hydrophobic layer deposited on the electrophoretic deposition layer.

2 . The coated metal alloy substrate according to claim 1 , wherein the passivation layer is a transparent passivation layer comprising a chelating agent and a metal ion or chelated metal complex thereof.

3 . The coated metal alloy substrate according to claim 2 , wherein the chelating agent is selected from ethylenediaminetetraacetic acid, ethylenediamine, nitrilotriacetic acid, diethylenetriaminepenta(methylenephosphonic acid), nitrilotris(methylenephosphonic acid), 1-hydroxyethane-1,1-diphosphonic acid and phosphoric acid, and the metal ion is selected from an aluminium ion, a nickel ion, a chromium ion, a tin ion, an indium ion, and a zinc ion.

4 . The coated metal alloy substrate according to claim 1 , wherein the electrophoretic deposition layer comprises an electrophoretic polymer selected from polyacrylic polymer, polyacrylamide-acrylic copolymer and epoxy-containing polymer.

5 . The coated metal alloy substrate according to claim 1 , wherein the electrophoretic deposition layer comprises a colorant.

6 . The coated metal alloy substrate according to claim 1 , wherein the hydrophobic layer comprises a fluoropolymer selected from fluorinated olefin-based polymers, fluoroacrylates, fluorosilicone acrylates, fluorourethanes, perfluoropolyethers, perfluoropolyoxetanes, C1 to C6 fluorotelomers, polytetrafluoroethylene, polyvinylidenefluoride, fluorosiloxane, dodecyltrimethoxysilane, mecaptoundecyltrimethoxysilane, triethoxysilylundecanal, 11-aminoundecyltriethoxysilane and N-(2-aminoethyl)-11-undecyltrimethoxysilane.

7 . The coated metal alloy substrate according to claim 1 , further comprising a sealing layer deposited between the passivation layer and the electrophoretic deposition layer.

8 . The coated metal alloy substrate according to claim 1 , wherein the metal alloy substrate comprises a metal selected from aluminium, magnesium, lithium, titanium, niobium, zinc and alloys thereof.

9 . The coated metal alloy substrate according to claim 1 , wherein the metal alloy substrate is an insert moulded metal substrate comprising a plastic insert.

10 . The coated metal alloy substrate according to claim 9 , wherein the plastic insert comprises a plastic selected from polybutylene terephthalate, polyphenylene sufide, polyamide, polyphthalamide, acrylonitrile butadiene styrene, polyetheretherketone, polycarbonate and acrylonitrile butadiene styrene with polycarbonate.

11 . A process for producing a coated metal alloy substrate for an electronic device comprising:
engraving the metal alloy substrate to form at least one chamfered edge; applying a passivation layer to the at least one chamfered edge; applying an electrophoretic deposition layer to the passivation layer; and applying a hydrophobic layer to the electrophoretic deposition layer.

12 . The process according to claim 11 , wherein engraving the metal alloy substrate is carried out using a CNC diamond cutter or a laser engraver.

13 . The process according to claim 11 , wherein a first electrophoretic deposition layer comprising a first colorant is applied to part of the passivation layer, and a second electrophoretic deposition layer comprising a second colorant is applied to a further part of the passivation layer.

14 . The process according to claim 11 , wherein the metal alloy substrate is treated with micro-arc oxidation or preliminary passivated before engraving the metal alloy substrate to form at least one chamfered edge.

15 . An electronic device having a housing, wherein the housing comprises:
a metal alloy substrate with at least one chamfered edge; a passivation layer deposited on the at least one chamfered edge; an electrophoretic deposition layer deposited on the passivation layer; and a hydrophobic layer deposited on the electrophoretic deposition layer.

Assignees

• Hewlett Packard Development Co

Inventors

• Wu Kuan-Ting
• Chang Chi Hao
• Guo Qingyong

Classifications

• C09D7/20

  Diluents or solvents · CPC title

• C23C28/345

  with at least one oxide layer · CPC title

• C23C22/57

  Treatment of magnesium or alloys based thereon · CPC title

• C23C22/78

  Pretreatment of the material to be coated · CPC title

• C25D11/30

  of magnesium or alloys based thereon · CPC title