Plated substrate

Patent metadata

Field	Value
Publication number	US-2022403524-A1
Application number	US-202217820367-A
Country	US
Kind code	A1
Filing date	Aug 17, 2022
Priority date	Feb 19, 2020
Publication date	Dec 22, 2022
Grant date	—

Abstract

A modified resin base material that includes a resin material having a base at a surface thereof, and a plating catalytic metal on the surface of the resin material, wherein a combination of the plating catalytic metal and the base is at least one of the following Lewis acid-base combinations according to a HSAB principle: a hard acid and a hard base or an intermediate base, an intermediate acid and a hard base, an intermediate base or a soft base, or a soft acid and an intermediate base or a soft base.

First claim

1 . A modified resin base material comprising:
a resin material having a base at a surface thereof; and a plating catalytic metal on the surface of the resin material, wherein a combination of the plating catalytic metal and the base is at least one of the following Lewis acid-base combinations according to a HSAB principle: a hard acid and a hard base or an intermediate base, an intermediate acid and a hard base, an intermediate base or a soft base, or a soft acid and an intermediate base or a soft base.

2 . The modified resin base material according to claim 1 , wherein the base is a hard base, and the plating catalytic metal is an intermediate acid.

3 . The modified resin base material according to claim 1 , wherein the base is —NH 2 , and the plating catalytic metal is Cu 2+ .

4 . The modified resin base material according to claim 1 , wherein the resin material is a fluororesin.

5 . A plated substrate comprising:
a modified resin base material comprising a resin material having a base at a surface thereof, and a plating catalytic metal on the surface of the resin material, wherein a combination of the plating catalytic metal and the base is at least one of the following Lewis acid-base combinations according to a HSAB principle:
a hard acid and a hard base or an intermediate base,
an intermediate acid and a hard base,
an intermediate base or a soft base, or
a soft acid and an intermediate base or a soft base; and
a plating layer on the modified resin base material.

6 . The plated substrate according to claim 5 , wherein the base is a hard base, and an acid of the plating catalytic metal is an intermediate acid.

7 . The plated substrate according to claim 5 , wherein the base is —NH 2 , and the plating catalytic metal is Cu 2+ .

8 . The plated substrate according to claim 5 , wherein the plating layer is a copper plating layer.

9 . The plated substrate according to claim 5 , wherein the resin material is a fluororesin.

10 . A method for forming a plated substrate, the method comprising:
introducing a base to a surface of a resin base material; bringing a metal ion into contact with the surface to which the base has been introduced to introduce a plating catalytic metal thereto; and forming a plating layer by electroless plating on the resin base material to which the base and the plating catalytic metal have been introduced, wherein a combination of the metal ion and the base is at least one of the following Lewis acid-base combinations according to a HSAB principle:
a hard acid and a hard base or an intermediate base,
an intermediate acid and a hard base,
an intermediate base or a soft base, or
a soft acid and an intermediate base or a soft base.

11 . The method for forming a plated substrate according to claim 10 , wherein the base is a hard base, and an acid of the plating catalytic metal is an intermediate acid.

12 . The method for forming a plated substrate according to claim 10 , wherein the introduction of the base to the surface of the resin base material is performed by irradiating the resin base material with energy under a basic atmosphere.

13 . The method for forming a plated substrate according to claim 12 , wherein the basic atmosphere is an ammonia atmosphere.

14 . The method for forming a plated substrate according to claim 10 , wherein the introduction of the plating catalytic metal to the surface to which the base has been introduced is performed by immersing the resin base material to which the base has been introduced in a solution containing the metal ion.

15 . The method for forming a plated substrate according to claim 14 , wherein the metal ion is Cu 2+ .

16 . The method for forming a plated substrate according to claim 10 , wherein the electroless plating is copper plating.

17 . The plated substrate according to claim 10 , wherein the resin material is a fluororesin.

Assignees

• Shibaura Inst Tech
• Murata Manufacturing Co

Inventors

• Ohishi Tomoji
• Yoshida Yasushi
• Hirayama Katsuro

Classifications

• C23C18/22

  Roughening, e.g. by etching · CPC title

• C23C18/38

  Coating with copper · CPC title

• C23C18/1682

  Control of atmosphere · CPC title

• C23C18/2086 Primary

  with use of organic or inorganic compounds other than metals, first · CPC title

• C23C18/28

  Sensitising or activating · CPC title