Semiconductor device packaging warpage control

Patent metadata

Field	Value
Publication number	US-2022392777-A1
Application number	US-202117337583-A
Country	US
Kind code	A1
Filing date	Jun 3, 2021
Priority date	Jun 3, 2021
Publication date	Dec 8, 2022
Grant date	—

Abstract

A method of manufacturing a packaged semiconductor device is provided. The method includes placing a plurality of semiconductor die on a carrier substrate. The plurality of semiconductor die and an exposed portion of the carrier substrate are encapsulated with an encapsulant. A cooling fixture includes a plurality of nozzles and is placed over the encapsulant. The encapsulant is cooled by way of air exiting the plurality of nozzles. A property of air exiting a first nozzle of the plurality of nozzles is different from that of a second nozzle of the plurality of nozzles.

First claim

What is claimed is:

1 . A method of manufacturing a packaged semiconductor device, the method comprising:
placing a plurality of semiconductor die on a first side of a carrier substrate; encapsulating with an encapsulant the plurality of semiconductor die and an exposed portion of the first side of the carrier substrate; placing a cooling fixture over the encapsulant, the cooling fixture including a plurality of nozzles; and cooling the encapsulant by way of air exiting the plurality of nozzles, wherein an air flow rate, air temperature, or duration of air exiting a first nozzle of the plurality of nozzles is different from that of a second nozzle of the plurality of nozzles.

2 . The method of claim 1 , wherein the first nozzle of the plurality of nozzles is configured for cooling a first region of the encapsulant and the second nozzle of the plurality of nozzles is configured for cooling a second region of the encapsulant different from the first region.

3 . The method of claim 1 , wherein the air exiting the first nozzle of the plurality of nozzles occurs during a first step of a predetermined sequence and the air exiting the second nozzle of the plurality of nozzles occurs during a second step of the predetermined sequence, the second step different from the first step.

4 . The method of claim 1 , further comprising controlling by way of a controller unit the air flow rate, air temperature, or duration of the air exiting the first and the second nozzles of the plurality of nozzles.

5 . The method of claim 1 , wherein placing the cooling fixture over the encapsulant includes clamping the cooling fixture onto the encapsulant such that the encapsulant is substantially flattened during the cooling the encapsulant step.

6 . The method of claim 1 , further comprising after cooling the encapsulant, removing the carrier substrate and forming a planar-sensitive layer over an active side of the plurality of semiconductor die.

7 . The method of claim 1 , wherein the carrier substrate includes a sensor coupled to an external monitor unit, the monitor unit configured to provide an output signal.

8 . The method of claim 7 , further comprising adjusting the air flow rate, air temperature, or duration of air exiting the first or the second nozzles of the plurality of nozzles based on the output signal.

9 . The method of claim 7 , wherein the sensor is characterized as a strain gauge sensor or a temperature sensor.

10 . A method of manufacturing a packaged semiconductor device, the method comprising:
placing a plurality of semiconductor die on a first side of a carrier substrate; encapsulating with an encapsulant the plurality of semiconductor die and an exposed portion of the first side of the carrier substrate; placing a cooling fixture over the encapsulant, the cooling fixture including a plurality of nozzles; cooling a first region of the encapsulant by way of air exiting a first nozzle of the plurality of nozzles; and cooling a second region of the encapsulant by way of air exiting a second nozzle of the plurality of nozzles, wherein a property of the air exiting the first nozzle is different from that of the second nozzle.

11 . The method of claim 10 , further comprising controlling by way of a controller unit the property of the air exiting the first nozzle and the second nozzle.

12 . The method of claim 10 , further comprising adjusting the property of the air exiting the first nozzle or the second nozzle based on an output signal of a sensor integrated with the carrier substrate.

13 . The method of claim 10 , wherein placing the cooling fixture over the encapsulant includes clamping the cooling fixture onto the encapsulant such that the encapsulant is substantially flattened during the steps of cooling the first region of the encapsulant and cooling the second region of the encapsulant.

14 . The method of claim 10 , further comprising after cooling the first region and the second region of the encapsulant, removing the carrier substrate and forming a planar-sensitive layer over an active side of the plurality of semiconductor die.

15 . The method of claim 10 , wherein the air exiting the first nozzle occurs during a first step of a predetermined sequence and the air exiting the second nozzle occurs during a second step of the predetermined sequence, the second step different from the first step.

16 . The method of claim 10 , wherein the property is characterized as air flow rate, air temperature, or duration of the air exiting the first nozzle and the second nozzle.

17 . An apparatus for manufacturing a packaged semiconductor device, the apparatus comprising:
a cooling fixture comprising a plurality of nozzles, the cooling fixture configured to:
cool a first region of an encapsulant by way of a fluid exiting a first nozzle of the plurality of nozzles, the encapsulant encapsulating a plurality of semiconductor die placed on a carrier substrate; and
cool a second region of the encapsulant by way of the fluid exiting a second nozzle of the plurality of nozzles, wherein a property of the fluid exiting the first nozzle is different from that of the second nozzle.

18 . The apparatus of claim 17 , further comprising a controller unit coupled to the cooling fixture, the controller unit configured to control the property of the fluid exiting the first nozzle and the second nozzle.

19 . The apparatus of claim 18 , wherein the controller unit is further configured to adjust the property of the fluid exiting the first nozzle or the second nozzle based on an output signal of a sensor integrated with the carrier substrate.

20 . The apparatus of claim 17 , wherein the fluid is characterized as air and wherein the property is characterized as air flow rate, air temperature, or duration of the air exiting the first nozzle and the second nozzle.

Assignees

• Nxp Usa Inc

Inventors

• Gong Zhiwei
• Hayes Scott M
• Vincent Michael B
• Gupta Vivek
• Gan Richard Te

Classifications

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10W74/019 Primary

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W74/131

  the semiconductor body being only partially enclosed · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title