Temperature stabilization of an on-chip temperature-sensitive element
US-2016380637-A1 · Dec 29, 2016 · US
Sensor device
US2022381617A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022381617-A1 |
| Application number | US-202017784289-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 21, 2020 |
| Priority date | Dec 27, 2019 |
| Publication date | Dec 1, 2022 |
| Grant date | — |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A sensor device according to the present disclosure includes a Peltier element, a sensor element thermally connected to a cooling surface of the Peltier element, and a window member that faces a light receiving surface of the sensor element and is made of borosilicate glass.
First claim
Opening claim text (preview).
What is claimed is: 1 . A sensor device comprising: a Peltier element; a sensor element thermally connected to a cooling surface of the Peltier element; and a window member that faces a light receiving surface of the sensor element and is made of borosilicate glass. 2 . The sensor device according to claim 1 , wherein an effective pixel region that receives incident light from the window member is arranged on the light receiving surface of the sensor element. 3 . The sensor device according to claim 2 , further comprising a support member arranged between the sensor element and the window member, wherein the support member has an opening that allows passage of the incident light and a frame that supports the window member. 4 . The sensor device according to claim 3 , wherein the frame is arranged outside the effective pixel region in a plan view. 5 . The sensor device according to claim 3 , wherein an area of the opening is larger than an area of the effective pixel region. 6 . The sensor device according to claim 3 , wherein the window member is arranged to cover the opening. 7 . The sensor device according to claim 1 , wherein the cooling surface of the Peltier element is larger than a surface of the sensor element opposite to the light receiving surface. 8 . The sensor device according to claim 1 , further comprising a package substrate that is thermally connected to a heat dissipation surface of the Peltier element, and accommodates the Peltier element and the sensor element. 9 . The sensor device according to claim 8 , further comprising a relay substrate that is arranged between the cooling surface of the Peltier element and the sensor element, and relays electrical connection between the package substrate and the sensor element. 10 . The sensor device according to claim 1 , wherein the sensor element is a short wave infrared (SWIR) image sensor.
Assignees
Inventors
Classifications
comprising Peltier coolers · CPC title
Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title
Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors · CPC title
Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements · CPC title
Imaging · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2022381617A1 cover?
- A sensor device according to the present disclosure includes a Peltier element, a sensor element thermally connected to a cooling surface of the Peltier element, and a window member that faces a light receiving surface of the sensor element and is made of borosilicate glass.
- Who is the assignee on this patent?
- Sony Semiconductor Solutions Corp
- What technology area does this patent fall under?
- Primary CPC classification G01J5/061. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Thu Dec 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).