Methods of producing bonded magnet and compound for bonded magnets

Patent metadata

Field	Value
Publication number	US-2022362843-A1
Application number	US-202217815792-A
Country	US
Kind code	A1
Filing date	Jul 28, 2022
Priority date	Jan 22, 2018
Publication date	Nov 17, 2022
Grant date	—

Abstract

Included is a method of preparing a compound for bonded magnets, the method including: coating a magnetic material having an average particle size of 10 μm or less with a thermosetting resin and a curing agent at a ratio of the equivalent weight of the curing agent to the equivalent weight of the thermosetting resin of 2 or higher and 10 or lower to obtain a coated material; granulating the coated material by compression to obtain a granulated product; milling the granulated product to obtain a milled product; and surface treating the milled product with a silane coupling agent to obtain a compound for bonded magnets, the method either including, between the granulation and the milling, heat curing the granulated product to obtain a cured product, or including, between the milling and the surface treatment, heat curing the milled product to obtain a cured product.

First claim

What is claimed is:

1 . A compound for bonded magnets, comprises:
a magnetic material having an average particle size of 10 μm or less, a cured product formed from a thermosetting resin and a curing agent coated on the magnetic material, and a Si element.

2 . The compound for bonded magnets according to claim 1 ,
wherein the ratio of the equivalent weight of the curing agent to the equivalent weight of the thermosetting resin in the coating step is 2 or higher and 11 or lower.

3 . The compound for bonded magnets according to claim 1 ,
wherein the ratio of the equivalent weight of the curing agent to the equivalent weight of the thermosetting resin in the coating step is 2.2 or higher and 10 or lower.

4 . The compound for bonded magnets according to claim 1 ,
wherein the ratio of the equivalent weight of the curing agent to the equivalent weight of the thermosetting resin in the coating step is 5.59 or higher and 10 or lower.

5 . The compound for bonded magnets according to claim 1 ,
wherein the ratio of the equivalent weight of the curing agent to the equivalent weight of the thermosetting resin in the coating step is 2.2 or higher and 11.09 or lower.

6 . A bonded magnet, comprising:
a cured product formed from a thermosetting resin and a curing agent, a magnetic material having an average particle size of 10 μm or less, a Si element, and a thermoplastic resin, wherein there are gaps between the resin and the magnetic material.

7 . The bonded magnet according to claim 6 , wherein the amount of the thermoplastic resin with respect to 100 parts by weight of the magnetic material is in the range of 4.4 parts by weight or more and 7.00 parts by weight or lower.

8 . The bonded magnet according to claim 6 , wherein the bonded magnet comprises the magnetic material at a filling ratio of 93% by weight or higher.

9 . The bonded magnet according to claim 6 ,
wherein the bonded magnet has a magnetization rate of 98.5% or higher.

10 . The bonded magnet according to claim 6 ,
wherein the magnetic material has a monodisperse particle size distribution.

11 . The bonded magnet according to claim 6 ,
wherein the magnetic material contains Sm, Fe, and N.

12 . The bonded magnet according to claim 6 ,
wherein the bonded magnet has a remanence of 0.83 Tesla or more.

Assignees

• Nichia Corp

Inventors

• Yamanaka Satoshi
• Yano Takayuki

Classifications

• B22F1/148

  Agglomerating · CPC title

• B22F1/102 Primary

  Metallic powder coated with organic material · CPC title

• B22F1/052

  characterised by a mixture of particles of different sizes or by the particle size distribution · CPC title

• B29B9/12

  characterised by structure or composition · CPC title

• B22F2998/10

  Processes characterised by the sequence of their steps · CPC title