Appearance inspection device and defect inspection method

Patent metadata

Field	Value
Publication number	US-2022360720-A1
Application number	US-202017765396-A
Country	US
Kind code	A1
Filing date	Mar 10, 2020
Priority date	Oct 23, 2019
Publication date	Nov 10, 2022
Grant date	—

Abstract

Provided is a technique capable of more accurately determining a solder protruding defect in an appearance inspection device that acquires an image of an inspection region of an inspection target and measures a height of a predetermined place in the inspection region with a height measurement device. The appearance inspection device includes: an imaging unit ( 3 ); a height measurement unit ( 20 ); a moving mechanism ( 5 ) that moves the imaging unit ( 3 ) and the height measurement unit ( 20 ). When a restricted region (M) in the inspection target is irradiated with the measurement light emitted from the height measurement unit ( 20 ), the determination unit restricts defect determination based on the information on the height of the predetermined place measured by the height measurement unit ( 20 ).

First claim

1 . An appearance inspection device comprising:
an imaging unit configured to capture an image of an inspection region on an inspection target; a height measurement unit configured to emit measurement light and receive reflected light of the measurement light to measure a height of a predetermined place in the inspection target; a moving mechanism configured to relatively move the imaging unit, the height measurement unit, and the inspection target to change the inspection region captured by the imaging unit and the predetermined place where the height is measured by the height measurement unit; a determination unit configured to determine whether the inspection target has a defect in the inspection region based on an image of the inspection region captured by the imaging unit and information on the height of the predetermined place measured by the height measurement unit; and a restriction unit configured to cause the determination unit to restrict determination of whether there is the defect based on the information on the height of the predetermined place measured by the height measurement unit when a predetermined restricted region in the inspection target is irradiated with the measurement light emitted from the height measurement unit.

2 . The appearance inspection device according to claim 1 , wherein
the inspection target is a circuit board equipped with a circuit component, and the restricted region comprises a fillet part in which solder forms a slope around a lead of the circuit component soldered to the circuit board.

3 . The appearance inspection device according to claim 1 , wherein
the inspection target is a circuit board equipped with a circuit component, and the restricted region comprises a region irradiated with the measurement light immediately before or immediately after a time point at which a lead of the circuit component soldered to the circuit board is irradiated with the measurement light when the height measurement unit and the circuit board are moved relative to each other.

4 . The appearance inspection device according to claim 2 , wherein
another lead and fillet part adjacent to the lead irradiated with the measurement light exist in a direction in which the height measurement unit is moved relative to the circuit board from the restricted region or in a direction opposite to the direction.

5 . The appearance inspection device according to claim 2 , further comprising
a setting unit configured to automatically set the restricted region based on a position of the lead in the circuit board.

6 . The appearance inspection device according to claim 3 , wherein
the defect is a solder protruding defect in which solder protrudes from a tip of the lead of the circuit component in soldering the lead to the circuit board.

7 . A defect inspection method using an appearance inspection device comprising:
an imaging unit configured to capture an image of an inspection region on an inspection target; a height measurement unit configured to emit measurement light and receive reflected light of the measurement light to measure a height of a predetermined place in the inspection target; and a moving mechanism configured to relatively move the imaging unit, the height measurement unit, and the inspection target to change the inspection region captured by the imaging unit and the predetermined place where the height is measured by the height measurement unit, the method comprising: determining whether the inspection target has a defect in the inspection region based on an image of the inspection region captured by the imaging unit and information on the height of the predetermined place measured by the height measurement unit; and restricting determination of whether there is the defect based on the information on the height of the predetermined place measured by the height measurement unit when a predetermined restricted region in the inspection target is irradiated with the measurement light.

8 . The defect inspection method according to claim 7 , wherein
the inspection target is a circuit board equipped with a circuit component, and the restricted region comprises a fillet part in which solder forms a slope around a lead of the circuit component soldered to the circuit board.

9 . The defect inspection method according to claim 7 , wherein
the inspection target is a circuit board equipped with a circuit component, and the restricted region comprises a region irradiated with the measurement light immediately before or immediately after a time point at which a lead of the circuit component soldered to the circuit board is irradiated with the measurement light when the height measurement unit and the circuit board are moved relative to each other.

10 . The defect inspection method according to claim 8 , wherein
another lead and fillet part adjacent to the lead irradiated with the measurement light exist in a direction in which the height measurement unit is moved relative to the circuit board from the restricted region or in a direction opposite to the direction.

11 . The defect inspection method according to claim 8 , wherein
the defect is a solder protruding defect in which solder protrudes from a tip of the lead of the circuit component in soldering the lead to the circuit board.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Hayashi Shingo
• Konishi Daisuke

Classifications

• H04N23/695 Primary

  Control of camera direction for changing a field of view, e.g. pan, tilt or based on tracking of objects · CPC title

• G01N2021/95646

  Soldering · CPC title

• G01N21/956 Primary

  Inspecting patterns on the surface of objects {(contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)} · CPC title

• G01N21/8851

  Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges (G01N21/8806 and G01N21/93 - G01N21/95692 take precedence; optical measurement of dimensions G01B11/00; optical scanning G02B26/10; image transformation G06T3/00; computerised image enhancement G06T5/00; image processing per se for flaw detection G06T7/0002) · CPC title

• G01B11/0608 Primary

  Height gauges · CPC title