Application of displacement maps to 3d mesh models

US2022343582A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2022343582-A1
Application numberUS-202117236905-A
CountryUS
Kind codeA1
Filing dateApr 21, 2021
Priority dateApr 21, 2021
Publication dateOct 27, 2022
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

According to examples, machine-readable instructions may cause a processor to obtain a 3D mesh model of a part and to obtain a displacement map that defines amounts of displacements to be applied to various points in the 3D mesh model, in which the displacement map is at a first resolution. The processor may also generate a lower resolution version of the displacement map, in which the lower resolution is lower than the first resolution. The processor may further apply the lower resolution version of the displacement map on the 3D mesh model to generate an updated 3D mesh model.

First claim

Opening claim text (preview).

1 . A non-transitory computer-readable medium storing machine-readable instructions that when executed by a processor, cause the processor to: obtain a three-dimensional (3D) mesh model of a 3D part; obtain a displacement map that defines amounts of displacements to be applied to the 3D mesh model to add texture to a surface of the 3D mesh model, wherein the displacement map has a first resolution that is higher than a resolution corresponding to a system resolution at which a 3D fabrication system is to fabricate the 3 part; generate a lower resolution version of the displacement map, wherein the lower resolution version has a predefined resolution that is lower than the first resolution of the displacement map and corresponds to a resolution that matches the system resolution at which the 3D fabrication system is to fabricate the 3D part, and wherein, at the predefined resolution of the lower resolution version, a size of a texel of the lower resolution version matches a size of an area unit corresponding to a voxel of the 3D mesh model for the 3D fabrication system; and apply the lower resolution version of the displacement map on the 3D mesh model to generate an updated 3D mesh model, wherein the 3D fabrication system is to use the updated 3D mesh model to fabricate the 3D part. 2 . The non-transitory computer-readable medium of claim 1 , wherein, to generate the lower resolution version of the displacement map, the instructions further cause the processor to: generate a plurality of lower resolution versions of the displacement map; and select one of the plurality of lower resolution versions of the displacement map to be the lower resolution version that has the predefined resolution corresponding to a resolution that matches the system resolution. 3 . The non-transitory computer-readable medium of claim 1 , wherein the instructions further cause the processor to: generate the lower resolution version of the displacement map by mipmapping the displacement map. 4 . The non-transitory computer-readable medium of claim 1 , wherein the instructions further cause the processor to: generate the lower resolution version of the displacement map by iteratively mipmapping the displacement map until the lower resolution version reaches the predefined resolution. 5 . The non-transitory computer-readable medium of claim 1 , wherein the instructions further cause the processor to: generate the lower resolution version of the displacement map by anisotropically mipmapping the displacement map to cause the lower resolution version of the displacement map to reach the predefined resolution. 6 . (canceled) 7 . The non-transitory computer-readable medium of claim 1 , wherein the 3D mesh model comprises a 3D triangle mesh model and wherein the instructions further cause the processor to: apply the lower resolution version of the displacement map on the 3D triangle mesh model to add triangles corresponding to the displacements defined in the lower resolution version of the displacement map to a surface of the 3D triangle mesh model. 8 . The non-transitory computer-readable medium of claim 1 , wherein the instructions further cause the processor to: voxelize the updated 3D mesh model, wherein the 3D fabrication system is to fabricate the 3D part based on the voxelized updated 3D mesh model. 9 . A method comprising: obtaining, by a processor, a three-dimensional (3D) mesh model of a 3D part; obtaining, by the processor, a displacement map that defines amounts of displacements to the 3D mesh model to add texture to a surface of the 3D mesh model, wherein the displacement map has a first resolution that is higher than a resolution corresponding to a system resolution at which a 3D fabrication system is to fabricate the 3 part; generating, by the processor, a lower resolution version of the displacement map, wherein the lower resolution version has a predefined resolution that is lower than the first resolution of the displacement map and corresponds to a resolution that matches the system resolution at which the 3D fabrication system is to fabricate the 3D part, and wherein, at the predefined resolution of the lower resolution version, a size of a texel of the lower resolution version matches a size of an area unit corresponding to a voxel of the 3D mesh model for the 3D fabrication system; and applying, by the processor, the lower resolution version of the displacement map on the 3D mesh model to generate an updated 3D mesh model, wherein the 3D fabrication system is to use the updated 3D mesh model to fabricate the 3D part. 10 . The method of claim 9 , wherein generating the lower resolution version of the displacement map comprises: generating a plurality of lower resolution versions of the displacement map; and selecting one of the plurality of lower resolution versions of the displacement map to be the lower resolution version that has the predefined resolution corresponding to a resolution that matches the system resolution. 11 . The method of claim 9 , wherein generating the lower resolution version of the displacement map further comprises: generating the lower resolution version of the displacement map by anisotropically mipmapping the displacement map to cause the lower resolution version of the displacement map to reach the predefined resolution. 12 . The method of claim 9 , wherein the 3D mesh model comprises a 3D triangle mesh model and wherein the method further comprises: applying the lower resolution version of the displacement map on the 3D triangle mesh model to add triangles corresponding to the displacements defined in the lower resolution version of the displacement map to a surface of the 3D triangle mesh model. 13 . (canceled) 14 . An apparatus comprising: a processor, and a memory storing instructions that when executed by the processor, cause the processor to: obtain a three-dimensional (3D) mesh model of a 3D part; obtain a displacement map that defines amounts of displacements to be applied to the 3D mesh model to add texture to a surface of the 3D mesh model, wherein the displacement map has a first resolution that is higher than a resolution corresponding to a system resolution at which a 3D fabrication system is to fabricate the 3D part; generate a lower resolution version of the displacement map, wherein the lower resolution version has a predefined resolution that is lower than the first resolution of the displacement map and corresponds to a resolution that matches the system resolution at which the 3D fabrication system is to fabricate the 3D part, and wherein, at the predefined resolution of the lower resolution version, a size of a texel of the lower resolution version matches a size of an area unit corresponding to a voxel of the 3D mesh model for the 3D fabrication system; and apply the lower resolution version of the displacement map on the 3D mesh model to generate an updated 3D mesh model, wherein the 3D fabrication system is to use the updated 3D mesh model to fabricate the 3D part. 15 . The apparatus of claim 14 , wherein to generate the lower resolution version of the displacement map, the instructions cause the processor to: generate the lower resolution version of the displacement map by anisotropically mipmapping the displacement map to cause the lower resolution version of the displacement map to reach the predefined resolution.

Assignees

Inventors

Classifications

  • Finite element generation, e.g. wire-frame surface description, {tesselation} · CPC title

  • Level of detail · CPC title

  • B33Y50/00Primary

    Data acquisition or data processing for additive manufacturing · CPC title

  • G06T15/04Primary

    Texture mapping · CPC title

  • using finite element methods [FEM] or finite difference methods [FDM] · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2022343582A1 cover?
According to examples, machine-readable instructions may cause a processor to obtain a 3D mesh model of a part and to obtain a displacement map that defines amounts of displacements to be applied to various points in the 3D mesh model, in which the displacement map is at a first resolution. The processor may also generate a lower resolution version of the displacement map, in which the lower re…
Who is the assignee on this patent?
Hewlett Packard Development Co
What technology area does this patent fall under?
Primary CPC classification B33Y50/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Oct 27 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).