Heat-flow sensor

Patent metadata

Field	Value
Publication number	US-2022326094-A1
Application number	US-201917641897-A
Country	US
Kind code	A1
Filing date	Sep 25, 2019
Priority date	Sep 25, 2019
Publication date	Oct 13, 2022
Grant date	—

Abstract

A heat-flow sensor that includes an insulating layer, a magnetic field application layer arranged on a first surface of the insulating layer and composed of a conductor, and a heat-flow detection layer arranged on a second surface of the insulating layer, the second surface facing the first surface, and the heat-flow detection layer composed of a conductive magnetic body. The heat-flow detection layer faces the magnetic field application layer via the insulating layer.

First claim

What is claimed is:

1 . A heat-flow sensor comprising:
an insulating layer; a magnetic field application layer arranged on a first surface of the insulating layer and composed of a conductor; and a heat-flow detection layer arranged on a second surface of the insulating layer, the second surface facing the first surface, and the heat-flow detection layer composed of a conductive magnetic body, wherein the heat-flow detection layer faces the magnetic field application layer via the insulating layer.

2 . The heat-flow sensor according to claim 1 , wherein
a pattern of the conductor comprising the magnetic field application layer and a pattern of the conductive magnetic body comprising the heat-flow detection layer face each other.

3 . The heat-flow sensor according to claim 2 , wherein
the pattern of the conductor comprising the magnetic field application layer and the pattern of the conductive magnetic body comprising the heat-flow detection layer have a same shape.

4 . The heat-flow sensor according to claim 2 , wherein
a line of the pattern of the conductive magnetic body comprising the heat-flow detection layer is arranged to extend along a line length of the pattern of the conductor comprising the magnetic field application layer in top view.

5 . A heat-flow sensor comprising:
a substrate; a first magnetic field application layer arranged on an upper surface of the substrate and composed of a conductor; a first insulating layer arranged on an upper surface of the first magnetic field application layer; a heat-flow detection layer arranged on an upper surface of the first insulating layer and composed of a conductive magnetic body; a second insulating layer arranged on an upper surface of the heat-flow detection layer; and a second magnetic field application layer arranged on an upper surface of the second insulating layer and composed of a conductor, wherein the first magnetic field application layer, the second magnetic field application layer, and the heat-flow detection layer are configured in patterns of a same shape overlapping in top view.

6 . The heat-flow sensor according to claim 5 , wherein
the patterns of the conductors comprising the first magnetic field application layer and the second magnetic field application layer and the pattern of the conductive magnetic body comprising the heat-flow detection layer face each other.

7 . The heat-flow sensor according to claim 6 , wherein
the patterns of the conductors comprising the first magnetic field application layer and the second magnetic field application layer and the pattern of the conductive magnetic body comprising the heat-flow detection layer have a same shape.

8 . The heat-flow sensor according to claim 6 , wherein
a line of the pattern of the conductive magnetic body comprising the heat-flow detection layer is arranged to extend along a line length of the pattern of the conductor included in each of the first magnetic field application layer and the second magnetic field application layer in top view.

9 . The heat-flow sensor according to claim 5 , wherein the heat-flow detection layer is composed of a soft conductive magnetic body.

10 . The heat-flow sensor according to claim 5 , wherein a distance between the first magnetic field application layer and the heat-flow detection layer and a distance between the second magnetic field application layer and the heat-flow detection layer are equal.

11 . The heat-flow sensor according to claim 5 , wherein the first magnetic field application layer, the second magnetic field application layer, and the heat-flow detection layer are configured in a meander pattern in which one wire is folded back.

12 . The heat-flow sensor according to claim 5 , wherein the first magnetic field application layer and the second magnetic field application layer are thicker in film thickness than the heat-flow detection layer.

13 . A heat-flow measurement system comprising:
the heat-flow sensor according to claim 5 ; and a heat-flow measurement device configured to control a current flowing through the first magnetic field application layer and the second magnetic field application layer, measure a voltage of the heat-flow detection layer, and convert a measured voltage value into a heat-flow value.

14 . The heat-flow measurement system according to claim 13 , wherein
each of the first magnetic field application layer, the second magnetic field application layer, and the heat-flow detection layer has a first end and a second end, the first ends of the first magnetic field application layer and the second magnetic field application layer are electrically connected to each other, the second ends of the first magnetic field application layer and the second magnetic field application layer are connected via a direct-current power supply, and the heat-flow measurement device is configured to perform control to cause a direct current to flow from the second end of either the first magnetic field application layer or the second magnetic field application layer, and measure a voltage between the first end and the second end of the heat-flow detection layer.

15 . The heat-flow measurement system according to claim 13 , wherein
each of the first magnetic field application layer, the second magnetic field application layer, and the heat-flow detection layer has a first end and a second end, the first ends of the first magnetic field application layer and the second magnetic field application layer are electrically connected to each other, the second ends of the first magnetic field application layer and the second magnetic field application layer are connected via an alternating-current power supply, and the heat-flow measurement device is configured to perform control to cause an alternating current to flow from the second end of each of the first magnetic field application layer and the second magnetic field application layer, and measure a voltage between the first end and the second end of the heat-flow detection layer.

16 . The heat-flow measurement system according to claim 15 , wherein
the heat-flow measurement device is configured to correct the heat-flow value with an average value of a maximum value and a minimum value of the voltage between the first end and the second end of the heat-flow detection layer as a baseline.

Assignees

• Nec Corp

Inventors

• Kirihara Akihiro
• Ishida Masahiko
• Iwasaki Yuma
• OMORI Yasutomo
• Someya Hiroko
• Hattori Sadanori

Classifications

• G01K17/00 Primary

  Measuring quantity of heat (measuring temperature by calorimetry G01K3/00 - G01K11/00; specially adapted for measuring thermal properties of materials, e.g. specific heat, heat of combustion G01N) · CPC title

• G01K17/06

  Measuring quantity of heat conveyed by flowing media, e.g. in heating systems (G01K17/02, G01K17/04 take precedence){e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device} · CPC title

• G01K7/36 Primary

  using magnetic elements, e.g. magnets, coils (magnetic elements per se H01F) · CPC title