Liquid-cooling heat dissipation structure

Patent metadata

Field	Value
Publication number	US-2022316817-A1
Application number	US-202117216712-A
Country	US
Kind code	A1
Filing date	Mar 30, 2021
Priority date	Mar 30, 2021
Publication date	Oct 6, 2022
Grant date	—

Abstract

A liquid-cooling heat dissipation structure includes a substrate and a cover body mated with the substrate to define a heat exchange chamber therebetween. A radiating fin unit and a stop section are disposed in the heat exchange chamber. The stop section serves to first divide a cooling liquid entering the heat exchange chamber, whereby the cooling liquid first flows through the periphery of the radiating fin unit and then flow into the middle of the radiating fin unit so that the cooling liquid is prevented from straightly passing through the radiating fin unit. Multiple cooperative flow-stopping protrusions are disposed in the periphery of the radiating fin unit to help the cooling liquid to uniformly flow through the radiating fin unit. By means of the structural design of the liquid-cooling heat dissipation structure, the heat exchange efficiency is greatly enhanced.

First claim

1 . A liquid-cooling heat dissipation structure comprising:
a substrate having a heat exchange face and a heat contact face; a radiating fin unit including multiple radiating fin assemblies disposed on the heat exchange face, the radiating fin unit having a top face and two flow-in sides; a cover body connected and mated with the substrate above the radiating fin unit, a heat exchange chamber being defined between the substrate and the cover body to receive the radiating fin unit, the cover body having an inner face and a sidewall, the inner face having a guide channel corresponding to the top face of the radiating fin unit, a peripheral flow way set being defined between the radiating fin unit and the sidewall, an inlet and an outlet being respectively disposed on the cover body, the inlet being in communication with the heat exchange chamber, the outlet being in communication with the guide channel; and a stop section disposed in the heat exchange chamber and positioned between the inlet and the radiating fin unit, the stop section being positioned behind the inlet, whereby a cooling liquid entering the heat exchange chamber from the inlet is divided to flow along the peripheral flow way to the middle of the radiating fin unit so that the cooling liquid is prevented from straightly passing through the radiating fin unit.

2 . The liquid-cooling heat dissipation structure as claimed in claim 1 , wherein multiple flow-stopping protrusions are disposed in the peripheral flow way set corresponding to the two flow-in sides of each radiating fin assembly.

3 . The liquid-cooling heat dissipation structure as claimed in claim 1 , wherein the peripheral flow way set includes a first peripheral flow way, a second peripheral flow way and a third peripheral flow way, the first and second peripheral flow ways being respectively defined between the flow-in sides and the sidewall, the third peripheral flow way being defined between the stop section and the sidewall corresponding to the inlet, whereby the cooling liquid in the peripheral flow ways flows from the flow-in sides to the middle of the radiating fin unit and then passes through the guide channel to flow out from the outlet.

4 . The liquid-cooling heat dissipation structure as claimed in claim 3 , wherein another radiating fin unit is selectively disposed in the third peripheral flow way.

5 . The liquid-cooling heat dissipation structure as claimed in claim 3 , wherein the flow-stopping protrusions are distributed over the first and second peripheral flow ways and disposed on the sidewall of the cover body or the heat exchange face of the substrate.

6 . The liquid-cooling heat dissipation structure as claimed in claim 1 , wherein the stop section is disposed on the heat exchange face of the substrate or the inner face of the cover body.

Assignees

• Asia Vital Components Co Ltd

Inventors

• Lee Sung-Wei
• Huang Kuan-Lin
• Yang Ming-Tsung

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• F28F2210/10

  Particular layout, e.g. for uniform temperature distribution · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• F28F3/06

  the means being attachable to the element · CPC title