Solid State Relay Module Heating System and Methods

Patent metadata

Field	Value
Publication number	US-2022310338-A1
Application number	US-202217706427-A
Country	US
Kind code	A1
Filing date	Mar 28, 2022
Priority date	Mar 26, 2021
Publication date	Sep 29, 2022
Grant date	—

Abstract

A solid state relay module configured to be coupled to an electronics enclosure. The solid state relay module includes a body with a first side and an opposite second side and two cable channels extending from the first side of the body. Each of the two cable channels is sized to receive a heating cable. The solid state module also includes a solid state relay platform defined between the two cable channels, where the solid state relay platform is sized to receive a solid state relay. The solid state relay module further includes a heat sink extending from the second side of the body.

First claim

1 . A solid state relay module configured to be coupled to an electronics enclosure, the solid state relay module comprising:
a body including a first side and an opposite second side; two cable channels extending from the first side of the body, each of the two cable channels sized to receive a heating cable; a solid state relay platform defined between the two cable channels, the solid state relay platform sized to receive a solid state relay; and a heat sink extending from the second side of the body.

2 . The solid state relay module of claim 1 , further comprising a cover coupled to the body around the heat sink.

3 . The solid state relay module of claim 2 , wherein the cover includes a vented opening.

4 . The solid state relay module of claim 2 , wherein the cover is coupled to the body via fasteners and insulated spacers.

5 . The solid state relay module of claim 2 , wherein the cover includes a front and two ends extending perpendicular from the front.

6 . The solid state relay module of claim 5 , wherein the cover includes an open top and an open bottom.

7 . The solid state relay module of claim 1 , wherein the heat sink comprises a plurality of fins extending from the second side of the body.

8 . The solid state relay module of claim 1 , wherein a single heating cable is routed through both of the two cable channels.

9 . The solid state relay module of claim 1 , wherein the body is coupled to a wall of the electronics enclosure so that the two cable channels extend into the electronics enclosure and the heat sink extends out of the electronics enclosure.

10 . The solid state relay module of claim 9 , further comprising a gasket positioned between the body and the wall.

11 . The solid state relay module of claim 1 , wherein the heating cable is configured to heat the solid state relay to a baseline operating temperature.

12 . A solid state relay module configured to be coupled to an electronics enclosure, the solid state relay module comprising:
a body including a first side and an opposite second side; a cable channel extending from the first side of the body, the cable channel sized to receive a heating cable; a solid state relay platform positioned adjacent to the cable channel, the solid state relay platform sized to receive a solid state relay; and a heat sink extending from the second side of the body.

13 . The solid state relay module of claim 12 , wherein the body is coupled to a wall of the electronics enclosure so that the two cable channels extend into the electronics enclosure and the heat sink extends out of the electronics enclosure.

14 . The solid state relay module of claim 13 , further comprising a gasket positioned between the body and the wall.

15 . The solid state relay module of claim 12 , wherein the solid state relay platform and the heat sink are formed integrally as a single base.

16 . A system comprising:
an electronics enclosure; a solid state relay module configured to be coupled to the electronics enclosure, the solid state relay module including a solid state relay and a heating cable; and a control system configured to:
receive a first signal representing a temperature within the electronics enclosure,
operate the solid state relay when the temperature within the electronics enclosure is at or above a first temperature, and
operate the heating cable when the temperature within the electronics enclosure is below a second temperature.

17 . The system of claim 16 , wherein the control system includes a controller and a mechanical thermostat, wherein the solid state relay is coupled to a power source via the mechanical thermostat.

18 . The system of claim 17 , wherein the mechanical thermostat connects power from the power source to the solid state relay when the first temperature is reached.

19 . The system of claim 16 , wherein the control system is located within the electronics enclosure.

20 . The system of claim 16 , wherein the first temperature and the second temperature are equal.

Assignees

• Nvent Services Gmbh

Inventors

• Cichocki Arkadiusz
• Koziol Artur
• Tuchorski Wojciech

Classifications

• H05K7/207

  Thermal management, e.g. cabinet temperature control · CPC title

• H01H50/12 Primary

  Ventilating; Cooling; Heating (for operating electrothermal relays H01H61/013) · CPC title

• H01H50/02

  Bases; Casings; Covers (frames for mounting two or more relays or for mounting a relay and another electric component H02B1/01, H04Q1/08, H05K) · CPC title

• H05K7/20545

  Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards · CPC title

• H05B1/023 Primary

  Industrial applications · CPC title