Method for manufacturing circuit wiring by three-dimensional additive manufacturing

Patent metadata

Field	Value
Publication number	US-2022279658-A1
Application number	US-201917630831-A
Country	US
Kind code	A1
Filing date	Jul 31, 2019
Priority date	Jul 31, 2019
Publication date	Sep 1, 2022
Grant date	—

Abstract

In a case where a circuit wiring is formed on a resin member by three-dimensional additive manufacturing, a method for manufacturing the circuit wiring by three-dimensional additive manufacturing capable of suppressing swelling or cracking of the circuit wiring is provided. A method for manufacturing a circuit wiring by three-dimensional additive manufacturing includes a discharging step of discharging a fluid containing a metal particle onto a resin member formed of a resin material; and a circuit wiring forming step of forming a circuit wiring by heating the fluid containing the metal particle discharged onto the resin member at a heating temperature to be cured, and the heating being performed at the heating temperature based on a glass transition point of the resin material, a linear expansion coefficient of the resin material, and a room temperature.

First claim

1 . A method for manufacturing a circuit wiring by three-dimensional additive manufacturing comprising:
a discharging step of discharging a fluid containing a metal particle onto a resin member formed of a resin material; and a circuit wiring forming step of forming a circuit wiring by heating the fluid containing the metal particle discharged onto the resin member at a heating temperature to be cured, and the heating being performed at the heating temperature based on a glass transition point of the resin material, a linear expansion coefficient of the resin material, and a room temperature.

2 . The method for manufacturing a circuit wiring by three-dimensional additive manufacturing according to claim 1 , wherein
the resin material is a material having the glass transition point higher than the heating temperature, and in the circuit wiring forming step, the heating is performed at the heating temperature satisfying the following expression
(heating temperature−room temperature)×first linear expansion coefficient<upper limit value

where the first linear expansion coefficient is the linear expansion coefficient at the glass transition point or lower, and the upper limit value indicates an upper limit of expansion of the resin member by the heating in the circuit wiring forming step.

3 . The method for manufacturing a circuit wiring by three-dimensional additive manufacturing according to claim 1 , wherein
the resin material is a material having the glass transition point lower than the heating temperature, and in the circuit wiring forming step, the heating is performed at the heating temperature satisfying the following expression
(glass transition point−room temperature)×first linear expansion coefficient+(heating temperature−glass transition point)×second linear expansion coefficient<upper limit value

where the first linear expansion coefficient is the linear expansion coefficient at the glass transition point or lower, the second linear expansion coefficient is the linear expansion coefficient at the glass transition point or higher, and the upper limit value indicates an upper limit of expansion of the resin member by the heating in the circuit wiring forming step.

4 . The method for manufacturing a circuit wiring by three-dimensional additive manufacturing according to claim 1 , further comprising:
a second discharging step of discharging the resin material onto a base material; a curing step of curing the resin material discharged onto the base material; and an insulating layer forming step of repeatedly executing the second discharging step and the curing step to form an insulating layer as the resin member; wherein in the circuit wiring forming step, when heating the fluid containing the metal particle discharged onto the resin member, the base material is cooled.

5 . The method for manufacturing a circuit wiring by three-dimensional additive manufacturing according to claim 2 , wherein
the upper limit value indicating the upper limit of expansion of the resin member by the heating in the circuit wiring forming step is an amount of expansion by which the resin member expands by the heating in the circuit wiring forming step, and an amount of expansion indicating an upper limit of a range where no swelling or cracking occurs in the circuit wiring.

Assignees

• Fuji Corp

Inventors

• Tominaga Ryojiro
• Sakakibara Ryo
• Takeuchi Tasuku
• Hashimoto Yoshitaka
• Tsukada Kenji

Classifications

• H05K2203/1131

  Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity · CPC title

• H05K3/4673

  Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer (similar methods for protective coatings H05K3/28) · CPC title

• H05K3/1283

  After-treatment of the printed patterns, e.g. sintering or curing methods · CPC title

• H05K3/125

  by ink-jet printing · CPC title

• H05K2201/068

  wherein the coefficient of thermal expansion is important · CPC title