Filter device comprising two connected filter circuits

Patent metadata

Field	Value
Publication number	US-2022255529-A1
Application number	US-202017628201-A
Country	US
Kind code	A1
Filing date	Jul 9, 2020
Priority date	Jul 26, 2019
Publication date	Aug 11, 2022
Grant date	—

Abstract

A filter device having a reduced sensitivity to production tolerances comprises a multilayer panel with integrated wiring, a piezoelectric substrate mounted to the panel. A first filter circuit (FC1) and a signal path (SP) comprising a second filter circuit are realized on the substrate and connected to a common antenna terminal (AT) as well as to a common node (CN) located on top of the piezoelectric substrate. A first matching circuit (MC1) and further matching circuits (MC2) are realized by the wiring in the multilayer panel.

First claim

1 . A filter device comprising:
a multilayer panel with integrated wiring; a piezoelectric substrate mounted to the panel; a first filter circuit and a signal path comprising a second filter circuit, both filter circuits being realized on the substrate and connected to a common antenna terminal; a first matching circuit located between the antenna terminal and the signal path with the second filter circuit, first matching circuit being realized by the wiring in the multilayer panel; and a common node to which the first filter circuit, the signal path and the antenna terminal are connected to, the common node being a pad located on top of the piezoelectric substrate.

2 . The filter device of claim 1 ,
wherein a first matching circuit realized by the wiring in the multilayer panel is circuited in a series line between the signal path and the common node; wherein a first series line section arranged on the substrate connects the common node and a first pad; wherein a second series line section arranged on the substrate connects a second pad and the signal path comprising the second filter circuit; wherein a first interconnecting means connects the first pad to a first end of the first matching circuit; and wherein a second interconnecting means connects the second pad to a second end of the first matching circuit.

3 . The filter device of claim 1 , wherein a second matching circuit is circuited between the antenna and the common node.

4 . The filter device of claim 1 , wherein at least one of the filter circuits comprises SAW resonators.

5 . The filter device of claim 1 , the filter device being one of a Duplexer, a multiplexer or an extractor.

6 . The filter device of claim 1 , wherein the first filter circuit is a band pass filter for GPS and/or GNSS signals.

7 . The filter device of claim 6 , wherein the first matching circuit is circuited in a series line between the signal path and the common node and comprises a band stop for GPS/GNSS frequencies.

8 . The filter device of claim 7 , wherein the signal path has a VW SR of less than 2 between 617 MHz and 4.2 GHz with the exception of the region around the GPS/GNSS frequencies.

9 . The filter device of claim 1 ,
wherein a second matching circuit is circuited between the antenna terminal and the common node wherein the second matching circuit comprises a series coil to match the antenna to the first filter circuit and to the signal path.

10 . The filter device of claim 1 ,
wherein every interconnect between any pad on the substrate and a respective contact area on the surface of the panel comprises a bump each wherein an interconnect between the antenna terminal and a respective pad on the substrate is located near the corner of the substrate.

11 . The filter device of claim 1 , wherein the multilayer panel comprises one of a laminate, a HTCC and a LTCC.

Assignees

• RF360 Europe GmbH

Inventors

• Sevskiy Georgiy
• Freisleben Stefan
• Heide Patric
• Ruban Oleksandr
• Ielegechev Igor

Classifications

• H03H9/0538 Primary

  Constructional combinations of supports or holders with electromechanical or other electronic elements · CPC title

• H03H2001/0085

  Multilayer, e.g. LTCC, HTCC, green sheets · CPC title

• H03H9/0561

  consisting of a multilayered structure · CPC title

• H03H9/725

  Duplexers · CPC title

• H03H9/0576 Primary

  including surface acoustic wave [SAW] devices · CPC title