Display device using micro-led, and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-2022246593-A1
Application number	US-201917616125-A
Country	US
Kind code	A1
Filing date	Jun 11, 2019
Priority date	Jun 11, 2019
Publication date	Aug 4, 2022
Grant date	—

Abstract

A method for manufacturing a display device can include forming an assembly electrode on a substrate; applying an insulating layer on the assembly electrode; disposing a partition wall on the insulating layer; defining an assembly groove in the partition wall; providing an light emitting diode (LED) having an assembly face corresponding to a shape of the assembly groove in the partition wall; and assembling the assembly face of the LED into the assembly groove in the partition wall, in which the LED includes a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer, and a second electrode stacked in a first direction to form a stacked structure.

First claim

1 . A method for manufacturing a display device, the method comprising:
forming an assembly electrode on a substrate; applying an insulating layer on the assembly electrode; disposing a partition wall on the insulating layer; defining an assembly groove in the partition wall; providing a light emitting diode (LED) having an assembly face corresponding to a shape of the assembly groove in the partition wall; and assembling the assembly face of the LED into the assembly groove in the partition wall, wherein the LED includes a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer, and a second electrode stacked in a first direction to form a stacked structure.

2 . The method of claim 1 , wherein the assembly face of the LED is formed in a second direction corresponding to the first direction of the stacked structure, and
wherein the second direction is horizontal to the first direction of the stacked structure.

3 . The method of claim 1 , wherein the assembling the assembly face of the LED into the assembly groove includes:
contacting the assembly face of the LED to the assembly groove using an assembly device having a magnetic body; and assembling the assembly face of the LED into the assembly groove based on an electric field applied through the assembly electrode formed on the substrate.

4 . The method of claim 3 , wherein the LED has a longitudinal length X in a first vertical direction along the first direction of the stacked structure, where X is a positive value,
wherein the LED has a transverse length Y in a second vertical direction along the first direction of the stacked structure, where Y is a positive value, and wherein the longitudinal length X has at least two different values, and the transverse length Y has one fixed value.

5 . The method of claim 1 , wherein the forming the assembly electrode on the substrate includes:
forming a plurality of assembly electrode portions spaced apart from each other to respectively overlap portions of the partition wall that are disposed on opposite sides of the assembly groove, or forming a single assembly electrode portion to overlap a bottom face of the assembly groove.

6 . The method of claim 1 , wherein the first semiconductor layer is an N-type GaN layer, and the second semiconductor layer is a P-type GaN layer.

7 . The method of claim 1 , wherein the LED includes a magnetic layer.

8 . The method of claim 1 , wherein the substrate contains at least one of glass, a conductor, or flexible polymer materials.

9 . The method of claim 1 , wherein the defining the assembly groove includes:
forming a polymer adhesive layer on at least a portion of a bottom face of the assembly groove for seating the assembly face of the LED on the polymer adhesive layer.

10 . The method of claim 1 , wherein the defining the assembly groove includes:
forming a metal reflective film on at least a portion of a bottom face of the assembly groove for seating the active layer of the LED on the metal reflective film.

11 . The method of claim 1 , further comprising:
simultaneously forming wiring electrodes electrically connected to the first electrode and the second electrode of the LED, respectively.

12 . The method of claim 1 , wherein the LED is a micro-LED having a micrometer size.

13 . The method of claim 1 , wherein the substrate is equipped with a transistor for active matrix driving.

14 . A display device comprising:
an assembly electrode disposed on a substrate; an insulating layer disposed on the assembly electrode; a partition wall disposed on the insulating layer; an assembly groove in the partition wall; and a light emitting diode (LED) assembled in the assembly groove in the partition wall, wherein the LED includes a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer, and a second electrode stacked in a first direction to form a stacked structure, and wherein the LED includes an assembly face corresponding to a shape of the assembly groove.

15 . The display device of claim 14 , wherein the assembly face is formed a second direction corresponding to the first direction of the stacked structure, and
wherein the second direction is horizontal to the first direction of the stacked structure.

16 . The display device of claim 15 , wherein the LED has a longitudinal length X in a first vertical direction along the first direction of the stacked structure, where X is a positive value,
wherein the LED has a transverse length Y in a second vertical direction along the first direction of the stacked structure, where Y is a positive value, and wherein the longitudinal length X has at least two different values, and the transverse length Y has one fixed value.

17 . The display device of claim 14 , wherein layers of the stacked structure of the LED are perpendicular to a bottom surface of the assembly groove.

18 . The display device of claim 14 , wherein the assembly face is a side surface of the LED.

19 . The display device of claim 16 , wherein the assembly face includes a surface corresponding to the longitudinal length X having at least two different values.

20 . The display device of claim 14 , wherein the assembly face has a shape substantially identical to a shape of the assembly groove.

Assignees

• Lg Electronics Inc

Inventors

• Shim Bongchu
• Kim Dohee
• Shin Yongil
• Yang Dohwan

Classifications

• H10W90/732

  between stacked chips · CPC title

• H10W90/22

  the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07353

  changes in shapes · CPC title

• H10W72/07352

  changes in structures or sizes · CPC title