Method for producing thermally conductive sheet
US-2022080718-A1 · Mar 17, 2022 · US
Thermal conductive composite silicone rubber sheet
US2022234335A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022234335-A1 |
| Application number | US-202017617772-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 15, 2020 |
| Priority date | Jun 19, 2019 |
| Publication date | Jul 28, 2022 |
| Grant date | — |
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Abstract
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A thermal conductive composite silicone rubber sheet includes a thermal conductive silicone rubber sheet and a thermosoftening silicone resin layer with a thickness of 0.5 to 10 μm on one side of the thermal conductive silicone rubber sheet, the thermosoftening silicone resin layer having an viscosity at 70° C. of 700 Pa·s or lower, where the thermosoftening silicone resin layer has adhesion of 0.5 N/25 mm or higher at a normal temperature and the thermal conductive composite silicone rubber sheet has a thermal resistance lower than a value obtained by adding 0.3 cm2·K/W per one layer of one side of the thermosoftening silicone resin layer to a thermal resistance of the thermal conductive silicone rubber sheet. A thermal conductive composite silicone rubber sheet provided with an adhesive layer on one side of a thermal conductive silicone rubber sheet, makes it possible to impart adhesion without sacrificing thermal conductivity.
First claim
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1 - 4 . (canceled) 5 . A thermal conductive composite silicone rubber sheet comprising a thermal conductive silicone rubber sheet and a thermosoftening silicone resin layer provided with a thickness of 0.5 to 10 μm on at least one side of the thermal conductive silicone rubber sheet, the thermosoftening silicone resin layer having an absolute viscosity at 70° C. of 700 Pa·s or lower, wherein the thermosoftening silicone resin layer has adhesion of 0.5 N/25 mm or higher at a normal temperature and the thermal conductive composite silicone rubber sheet has a thermal resistance that is lower than a value obtained by adding 0.3 cm 2 ·K/W per one layer of one side of the thermosoftening silicone resin layer provided on at least one side of the thermal conductive silicone rubber sheet to a thermal resistance of the thermal conductive silicone rubber sheet. 6 . The thermal conductive composite silicone rubber sheet according to claim 5 , wherein after keeping the thermal conductive composite silicone rubber sheet in storage in an environment of 60° C. for two months, the thermosoftening silicone resin layer has adhesion of 70% or more of the adhesion before the storage. 7 . The thermal conductive composite silicone rubber sheet according to claim 5 , wherein the thermal conductive silicone rubber sheet has a silicone rubber component comprising a dimethylsiloxane unit, and the thermosoftening silicone resin layer has a phenyl modification rate or 20 mol % or higher. 8 . The thermal conductive composite silicone rubber sheet according to claim 6 , wherein the thermal conductive silicone rubber sheet has a silicone rubber component comprising a dimethylsiloxane unit, and the thermosoftening silicone resin layer has a phenyl modification rate or 20 mol % or higher. 9 . The thermal conductive composite silicone rubber sheet according to claim 5 , wherein the thermal conductive silicone rubber sheet comprises a glass cloth and/or a plastic film. 10 . The thermal conductive composite silicone rubber sheet according to claim 6 , wherein the thermal conductive silicone rubber sheet comprises a glass cloth and/or a plastic film. 11 . The thermal conductive composite silicone rubber sheet according to claim 7 , wherein the thermal conductive silicone rubber sheet comprises a glass cloth and/or a plastic film. 12 . The thermal conductive composite silicone rubber sheet according to claim 8 , wherein the thermal conductive silicone rubber sheet comprises a glass cloth and/or a plastic film.
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- What does patent US2022234335A1 cover?
- A thermal conductive composite silicone rubber sheet includes a thermal conductive silicone rubber sheet and a thermosoftening silicone resin layer with a thickness of 0.5 to 10 μm on one side of the thermal conductive silicone rubber sheet, the thermosoftening silicone resin layer having an viscosity at 70° C. of 700 Pa·s or lower, where the thermosoftening silicone resin layer has adhesion of…
- Who is the assignee on this patent?
- Shinetsu Chemical Co
- What technology area does this patent fall under?
- Primary CPC classification B32B25/08. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Jul 28 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).