Slag-containing polymer concrete and grouting mortar

Patent metadata

Field	Value
Publication number	US-2022227669-A1
Application number	US-202017614482-A
Country	US
Kind code	A1
Filing date	May 28, 2020
Priority date	May 28, 2019
Publication date	Jul 21, 2022
Grant date	—

Abstract

A curable binder composition includes: a) at least one organic binder selected from the group made of a1) epoxy resins and curing agents for epoxy resins and a2) polyisocyanates and polyols, and b) at least 50% by weight of slag based on 100% by weight of the binder composition.

First claim

1 . A curable binder composition comprising: a) at least one organic binder selected from the group consisting of a1) epoxy resins and curing agents for epoxy resins and a2) polyisocyanates and polyols, and b) at least 50% by weight of slag based on 100% by weight of the binder composition.

2 . The binder composition as claimed in claim 1 , wherein
the binder composition contains 50% to 80% by weight, of slag, based on 100% by weight of the binder composition.

3 . The binder composition as claimed in claim 1 , wherein
the slag is selected from the group consisting of blast furnace slags, steel slags, metallurgical slags, and slags from waste incineration.

4 . The binder composition as claimed in claim 1 , wherein
the slag is an iron-containing slag containing at least 8% by weight, of iron, calculated as FeO.

5 . The binder composition as claimed in claim 1 , wherein the slag has a bulk density of at least 2.9 kg/l.

6 . The binder composition as claimed in claim 1 , the slag has a particle size of 0.05 to 16 mm.

7 . The binder composition as claimed in claim 1 , wherein the slag particles are irregularly shaped and/or have a rough surface.

8 . The binder composition as claimed in claim 1 , wherein at least one further mineral filler selected from the group consisting of limestone powder, chalk, quartz powder, silica dust, titanium dioxide, baryte powder, and alumina is additionally present.

9 . The binder composition as claimed in claim 1 , wherein at least one wetting agent and/or dispersant, is present.

10 . The binder composition as claimed in claim 9 , wherein the slag and optionally also the at least one further filler, if present, are coated with the wetting agent and/or dispersant.

11 . A multicomponent system for producing a curable binder composition, comprising at least one resin component comprising at least one epoxy resin, and at least one curing agent component comprising at least one curing agent for epoxy resins, wherein slag and optionally further ingredients are present in the resin components, in the curing agent components and/or in any further components optionally present.

12 . A multicomponent system for producing a curable binder composition, comprising at least one polyisocyanate component comprising at least one polyisocyanate, and at least one polyol component comprising at least one polyol, wherein slag and optionally further ingredients are present in the polyisocyanate components, in the polyol components and/or in any further components optionally present.

13 . A method comprising
bonding, coating or sealing substrates
with the binder composition as claimed in claim 1 or
with a multicomponent system for producing a curable binder composition, comprising at least one resin component comprising at least one epoxy resin, and at least one curing agent component comprising at least one curing agent for epoxy resins, wherein slag and optionally further ingredients are present in the resin components, in the curing agent components and/or in any further components optionally present
for the filling of edges, holes or joints, as anchoring or injection resin, as a grouting or casting compound, as a floor covering and/or for production of moldings.

14 . A method comprising
producing materials having improved electrical conductivity at 20° C.
with the binder composition as claimed in claim 1 or
with a multicomponent system for producing a curable binder composition, comprising at least one resin component comprising at least one epoxy resin, and at least one curing agent component comprising at least one curing agent for epoxy resins, wherein slag and optionally further ingredients are present in the resin components, in the curing agent components and/or in any further components optionally present,
wherein the slag in the binder composition is an iron-containing slag comprising at least 8% by weight of iron, calculated as FeO, based on the total weight of the slag, and/or a slag having a bulk density of at least 3.1 kg/l.

15 . A cured binder composition obtained
by curing of the binder composition as claimed in claim 1 or by mixing of the components and curing of a multicomponent system for producing a curable binder composition, comprising at least one resin component comprising at least one epoxy resin, and at least one curing agent component comprising at least one curing agent for epoxy resins, wherein slag and optionally further ingredients are present in the resin components, in the curing agent components and/or in any further components optionally present.

16 . A method comprising
bonding, coating or sealing substrates
with the binder composition as claimed in claim 1 or
with a multicomponent system for producing a curable binder composition, comprising at least one polyisocyanate component comprising at least one polyisocyanate, and at least one polyol component comprising at least one polyol, wherein slag and optionally further ingredients are present in the polyisocyanate components, in the polyol components and/or in any further components optionally present,
for the filling of edges, holes or joints, as anchoring or injection resin, as a grouting or casting compound, as a floor covering and/or for production of moldings.

17 . A method comprising
producing materials having improved electrical conductivity at 20° C.
with the binder composition as claimed in claim 1 or
with a multicomponent system for producing a curable binder composition, comprising at least one polyisocyanate component comprising at least one polyisocyanate, and at least one polyol component comprising at least one polyol, wherein slag and optionally further ingredients are present in the polyisocyanate components, in the polyol components and/or in any further components optionally present,
wherein the slag in the binder composition is an iron-containing slag comprising at least 8% by weight of iron, calculated as FeO, based on the total weight of the slag, and/or a slag having a bulk density of at least 3.1 kg/l.

18 . A cured binder composition obtained
by curing of the binder composition as claimed in claim 1 or by mixing of the components and curing of a multicomponent system for producing a curable binder composition, comprising at least one polyisocyanate component comprising at least one polyisocyanate, and at least one polyol component comprising at least one polyol, wherein slag and optionally further ingredients are present in the polyisocyanate components, in the polyol components and/or in any further components optionally present.

Assignees

• Sika Tech Ag

Inventors

• Kelch Steffen
• Mamie Tim
• Moser Thomas
• Velten Ulf
• Würmli Fabio

Classifications

• C04B2111/00637

  as glue or binder for uniting building or structural materials · CPC title

• C04B26/16 Primary

  Polyurethanes · CPC title

• C04B2111/00482

  Coating or impregnation materials · CPC title

• C04B28/082 Primary

  Steelmaking slags; Converter slags · CPC title

• C04B20/1003

  Non-compositional aspects of the coating or impregnation · CPC title