Tool-Less Installation Structure For Dual Slot PCIE Card

Patent metadata

Field	Value
Publication number	US-2022225526-A1
Application number	US-202117145265-A
Country	US
Kind code	A1
Filing date	Jan 8, 2021
Priority date	Jan 8, 2021
Publication date	Jul 14, 2022
Grant date	—

Abstract

A bracket for holding an electronic device in a carrier in a computing system is described. The bracket includes an outer plate and an inner compressible sleeve. The outer plate includes a front side and a back side. The inner compressible sleeve including a front section, a back section, and an aperture. The front section of the inner compressible sleeve is coupled to the back side of the outer plate. When the electronic device is inserted in the aperture, the electronic device compresses the inner compressible sleeve within the aperture. The bracket may also include a hole, on the outer plate, configured to mate with a fastener on the electronic device. The bracket also includes a protrusion on the outer plate. The protrusion prevents the electronic device from moving through the front side of the outer plate. The inner compressible sleeve of the bracket is a shock dampener.

First claim

1 . A bracket for holding an electronic device in a carrier in a computing system, the bracket comprising:
an outer plate including a front side and a back side; and an inner compressible sleeve including a front section, a back section, and an aperture, wherein the front section of the inner compressible sleeve is coupled to the back side of the outer plate, and wherein when the electronic device is inserted in the aperture, the electronic device compresses the inner compressible sleeve within the aperture, the aperture having an outline with a first sleeve size prior to insertion of the electronic device into the aperture, the outline having a second sleeve size after insertion of the electronic device into the aperture, the second sleeve size being greater than the first sleeve size, the second sleeve size resulting from elasticity of the inner compressible sleeve and being caused by a shape mismatch with the electronic device.

2 . The bracket of claim 1 , further comprising a hole on the outer plate, wherein the hole is configured to mate with a fastener on a riser configured to hold the electronic device.

3 . The bracket of claim 1 , further comprising a protrusion on the outer plate, wherein the protrusion prevents the electronic device from moving through the front side of the outer plate.

4 . The bracket of claim 1 , wherein the inner compressible sleeve of the bracket is a shock dampener.

5 . The bracket of claim 1 , wherein the outer plate is coupled to the inner compressible sleeve of the bracket via an adhesive.

6 . The bracket of claim 1 , wherein the inner compressible sleeve of the bracket is configured to insulate the electronic device in the carrier from heat produced by the system.

7 . The bracket of claim 1 , wherein the outer plate of the bracket is metal.

8 . The bracket of claim 1 , wherein the inner compressible sleeve of the bracket is rubber.

9 . An electronic device assembly comprising:
an electronic device; a riser for holding the electronic device; a bracket having an outer plate and an inner compressible sleeve, wherein:
the outer plate includes a front side and a back side; and
the inner compressible sleeve includes a front section, a back section, and an aperture, wherein the front section of the inner compressible sleeve is coupled to the back side of the outer plate, and wherein when the electronic device is inserted in the aperture, the electronic device compresses the inner compressible sleeve within the aperture, the aperture having an outline with a first sleeve size prior to insertion of the electronic device into the aperture, the outline having a second sleeve size after insertion of the electronic device into the aperture, the second sleeve size being greater than the first sleeve size, the second sleeve size resulting from elasticity of the inner compressible sleeve and being caused by a shape mismatch with the electronic device; and
a carrier for holding the electronic device and the bracket.

10 . The assembly of claim 9 , further comprising a hole on the outer plate, wherein the hole is configured to mate with a fastener on the riser.

11 . The assembly of claim 9 , further comprising a protrusion on the outer plate, wherein the protrusion prevents the electronic device from moving through the front side of the outer plate.

12 . The assembly of claim 9 , wherein the inner compressible sleeve of the bracket is a shock dampener.

13 . The assembly of claim 9 , wherein the outer plate is coupled to the inner compressible sleeve of the bracket via an adhesive.

14 . The assembly of claim 9 , wherein the inner compressible sleeve of the bracket is configured to insulate the electronic device in the carrier from heat produced by the system.

15 . The assembly of claim 9 , wherein the outer plate of the bracket is metal.

16 . The assembly of claim 9 , wherein the inner compressible sleeve of the bracket is rubber.

17 . A computing system having a riser for holding an electronic component in a carrier, the system comprising:
a riser for holding an electronic device, the riser including:
a top wall,
a bottom wall, and
two side walls, wherein the top wall and the bottom wall are perpendicularly coupled to the two side walls, and wherein the top wall is approximately parallel to the bottom wall;
an electronic device; a bracket having an outer plate and an inner compressible sleeve, wherein:
the outer plate includes a front side, a back side, and a hole; and
the inner compressible sleeve includes a front section, a back section, and an aperture, wherein the front section of the inner compressible sleeve is coupled to the back side of the outer plate, and wherein when the electronic device is inserted in the aperture, the electronic device compresses the inner compressible sleeve within the aperture, the aperture having an outline with a first sleeve size prior to insertion of the electronic device into the aperture, the outline having a second sleeve size after insertion of the electronic device into the aperture, the second sleeve size being greater than the first sleeve size, the second sleeve size resulting from elasticity of the inner compressible sleeve and being caused by a shape mismatch with the electronic device; and
a carrier for holding the electronic device and the bracket, wherein the carrier is configured to be removably coupled to one of the side walls of the riser and the other side wall of the riser is configured to be removably coupled to the electronic device.

18 . The system of claim 17 , further comprising a protrusion on the outer plate, wherein the protrusion prevents the electronic device from moving through the front side of the outer plate.

19 . The system of claim 17 , wherein the inner compressible sleeve of the bracket is a shock dampener.

20 . The system of claim 17 , wherein the outer plate is coupled to the inner compressible sleeve of the bracket via an adhesive.

Assignees

• Quanta Comp Inc

Inventors

• Tsorng Yaw-Tzorng
• Wang Ming-Lung
• Chen Hung-Wei
• Yang Tung-Shiun

Classifications

• H05K7/1487 Primary

  Blade assemblies, e.g. blade cases or inner arrangements within a blade · CPC title

• H05K7/1489 Primary

  characterized by the mounting of blades therein, e.g. brackets, rails, trays (H05K7/1491 takes precedence) · CPC title