Electronic device housing, manufacturing method of same, and metal-resin composite

Patent metadata

Field	Value
Publication number	US-2022224001-A1
Application number	US-202017605218-A
Country	US
Kind code	A1
Filing date	Apr 21, 2020
Priority date	Apr 22, 2019
Publication date	Jul 14, 2022
Grant date	—

Abstract

Provided is an electronic device housing including a metal member and a plastic antenna cover that are joined and integrated by insert molding. In this electronic device housing, the plastic antenna cover is a molded product of a thermoplastic resin composition containing a thermoplastic polyester resin having a melting point Tm equal to or higher than 250° C.

First claim

1 . An electronic device housing comprising:
a metal member; and a plastic antenna cover, wherein the metal member and the plastic antenna cover are joined and integrated by insert molding, and the plastic antenna cover is a molded product of a thermoplastic resin composition containing a thermoplastic polyester resin having a melting point Tm equal to or higher than 250° C.

2 . The electronic device housing according to claim 1 ,
wherein a crystallinity of the plastic antenna cover determined by a wide-angle X-ray diffraction profile is equal to or less than 50%.

3 . The electronic device housing according to claim 1 ,
wherein the thermoplastic polyester resin contains a structural unit derived from an aromatic dicarboxylic acid-based monomer and a structural unit derived from a diol having an alicyclic skeleton.

4 . The electronic device housing according to claim 3 ,
wherein the aromatic dicarboxylic acid-based monomer is terephthalic acid.

5 . The electronic device housing according to claim 1 ,
wherein a content of the thermoplastic polyester resin (P) in the thermoplastic resin composition is 40% to 80% by mass.

6 . The electronic device housing according to claim 1 ,
wherein the thermoplastic resin composition contains other polymer components (Q) in addition to the thermoplastic polyester resin (P).

7 . The electronic device housing according to claim 6 ,
wherein a content of the other polymer components (Q) in the thermoplastic resin composition is 1% to 20% by mass.

8 . The electronic device housing according to claim 6 ,
wherein the other polymer components (Q) include a copolymer (D) having a structural unit derived from an olefin and a structural unit having a cyclic oxyhydrocarbon structure.

9 . The electronic device housing according to claim 8 ,
wherein the other polymer components (Q) further include one or more polymers (E) selected from the group consisting of an ethylene.α-olefin copolymer (E1), polybutylene terephthalate (E2), polycarbonate (E3), and isophthalic acid-modified polycyclohexylenedimethylene terephthalate (E4).

10 . The electronic device housing according to claim 9 ,
wherein a mass ratio of the copolymer (D):the polymer (E) is 1:0.1 to 1:0.5.

11 . The electronic device housing according to claim 9 ,
wherein a mass ratio of the copolymer (D):the polybutylene terephthalate (E2), the polycarbonate (E3) and the isophthalic acid-modified polycyclohexylenedimethylene terephthalate (E4) is 1:1 to 1:10.

12 . The electronic device housing according to claim 1 ,
wherein the metal member is one kind selected from the group consisting of magnesium or a magnesium alloy, aluminum or an aluminum alloy, titanium or a titanium alloy, and copper or a copper alloy.

13 . The electronic device housing according to claim 1 ,
wherein an anticorrosive surface modifying film is formed on at least a portion of a surface of the metal member, the portion to which the plastic antenna cover is not joined.

14 . A manufacturing method of an electronic device housing, comprising:
(step 1) preparing a metal member; (step 2) joining and integrating the metal member and a thermoplastic resin composition containing a thermoplastic polyester resin having a melting point Tm equal to or higher than 250° C. by insert molding so as to manufacture a dissimilar material joined body consisting of the metal member and a plastic antenna cover; (step 3) annealing the dissimilar material joined body at 180° C. to 350° C. for 1 to 30 minutes so as to convert the dissimilar material joined body into a heat-treated dissimilar material joined body; (step 4) performing an oxidation treatment on a surface of at least a portion of the metal member of the heat-treated dissimilar material joined body, the portion to which the plastic antenna cover is not joined, by at least one method selected from the group consisting of anodic oxidation, micro-arc oxidation, and a chemical conversion treatment so as to obtain a surface-modified dissimilar material joined body; and (step 5) forming a coating film layer in at least a region of the surface-modified dissimilar material joined body, the region including a junctional portion between the metal member and the plastic antenna cover, wherein the steps 1 to 5 are performed in this order.

15 . A metal-resin composite comprising:
a magnesium alloy member; and a resin member, wherein the magnesium alloy member and the resin member are joined and integrated, and the resin member is a molded product of a thermoplastic resin composition containing a thermoplastic polyester resin having a melting point Tm equal to or higher than 250° C.

Assignees

• Mitsui Chemicals Inc

Inventors

• Tominaga Takahiro
• Morimoto Kai
• Kimura Kazuki
• Makiguchi Wataru
• Ueda Kosuke

Classifications

• B29K2705/00

  Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts · CPC title

• C08L67/02

  Polyesters derived from dicarboxylic acids and dihydroxy compounds (C08L67/06 takes precedence) · CPC title

• C08G63/199

  Acids or hydroxy compounds containing cycloaliphatic rings · CPC title

• C08G63/183

  Terephthalic acids · CPC title

• B29C45/14639

  for obtaining an insulating effect, e.g. for electrical components · CPC title