Multiple cryogenic systems sectioned within a common vacuum space

Patent metadata

Field	Value
Publication number	US-2022221108-A1
Application number	US-202117144964-A
Country	US
Kind code	A1
Filing date	Jan 8, 2021
Priority date	Jan 8, 2021
Publication date	Jul 14, 2022
Grant date	—

Abstract

Techniques facilitating multiple cryogenic systems sectioned within a common vacuum space are provided. In one example, a cryostat can comprise a plurality of thermal stages and a thermal switch. The plurality of thermal stages can intervene between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that can be directly coupled mechanically to the Still stage via a support rod. The thermal switch can be coupled to the intermediate thermal stage and an adjacent thermal stage. The thermal switch can facilitate modifying a thermal profile of the cryostat by providing a switchable thermal path between the intermediate thermal stage and the adjacent thermal stage.

First claim

What is claimed is:

1 . A cryostat, comprising:
a plurality of thermal stages intervening between a 4-Kelvin (K) stage and a Cold Plate stage, the plurality of thermal stages including a Still stage and an intermediate thermal stage that is directly coupled mechanically to the Still stage via a support rod; and a thermal switch coupled to the intermediate thermal stage and an adjacent thermal stage, wherein the thermal switch facilitates modifying a thermal profile of the cryostat by providing a switchable thermal path between the intermediate thermal stage and the adjacent thermal stage.

2 . The cryostat of claim 1 , wherein the plurality of thermal stages is enclosed in an outer vacuum chamber defining a common vacuum space.

3 . The cryostat of claim 1 , wherein the intermediate thermal stage operates at a temperature of about 300 millikelvin (mK) or about 1 kelvin (K).

4 . The cryostat of claim 1 , wherein the thermal switch is a magnetically actuated superfluid leak tight valve.

5 . The cryostat of claim 1 , wherein the adjacent thermal stage is the Still stage or the 4-K stage.

6 . The cryostat of claim 1 , further comprising:
an additional thermal switch coupled to the 4-K stage that facilitates modifying the thermal profile of the cryostat by providing an additional switchable thermal path between the 4-K stage and the intermediate thermal stage, wherein the thermal switch and the additional thermal switch are coupled to opposing sides of the intermediate thermal stage.

7 . The cryostat of claim 1 , wherein the thermal switch comprises a superconducting material positioned within a magnetic field.

8 . The cryostat of claim 1 , wherein the thermal switch comprises a capillary that receives a helium medium.

9 . The cryostat of claim 8 , wherein the helium medium is helium-3 or helium-4.

10 . The cryostat of claim 8 , wherein the helium medium thermally shorts the intermediate thermal stage to the adjacent thermal stage.

11 . The cryostat of claim 1 , wherein the intermediate thermal stage provides passage to a pumping line that couples a pump and a sealed pot of an additional intermediate thermal stage that facilitates evaporation of helium-3.

12 . A cryostat comprising:
a Still stage directly coupled mechanically to an intermediate thermal stage via a support rod, wherein the Still stage and the intermediate thermal stage are included among a plurality of thermal stages intervening between a 4-Kelvin (K) stage and a Cold Plate stage; and a thermal switch coupled to the intermediate thermal stage and an adjacent thermal stage, wherein the thermal switch facilitates modifying a thermal profile of the cryostat by providing a switchable thermal path between the intermediate thermal stage and the adjacent thermal stage.

13 . The cryostat of claim 12 , further comprising:
a thermal shield coupled to the intermediate thermal stage that forms an enclosed thermal volume.

14 . The cryostat of claim 13 , wherein the Still stage is positioned within the enclosed thermal volume.

15 . The cryostat of claim 13 , wherein the Still stage is positioned external to the enclosed thermal volume.

16 . The cryostat of claim 13 , wherein the Cold Plate stage is positioned within the enclosed thermal volume.

17 . The cryostat of claim 13 , further comprising:
an additional enclosed thermal volume nested within the enclosed thermal volume, wherein the additional enclosed thermal volume is formed by an additional intermediate thermal stage coupled to an additional thermal shield, and wherein the additional intermediate thermal stage is included among the plurality of thermal stages.

18 . A cryostat comprising:
an enclosed thermal volume formed by an intermediate thermal stage coupled to a thermal shield, wherein the intermediate thermal stage is directly coupled mechanically to a Still stage via a support rod, and wherein the Still stage and the intermediate thermal stage are included among a plurality of thermal stages intervening between a 4-Kelvin (K) stage and a Cold Plate stage; and a thermal switch coupled to the intermediate thermal stage and an adjacent thermal stage, wherein the thermal switch facilitates modifying a thermal profile of the cryostat by providing a switchable thermal path between the intermediate thermal stage and the adjacent thermal stage.

19 . The cryostat of claim 18 , wherein the enclosed thermal volume is nested within an additional enclosed thermal volume formed by an additional intermediate thermal stage coupled to an additional thermal shield, and wherein the additional intermediate thermal stage is included among the plurality of thermal stages.

20 . The cryostat of claim 19 , wherein the additional enclosed thermal volume is enclosed within a common vacuum space defined by an outer vacuum chamber of the cryostat.

21 . The cryostat of claim 18 , wherein the adjacent thermal stage is the Still stage or the 4-K stage.

22 . The cryostat of claim 18 , wherein a Mixing Chamber stage of the cryostat is positioned within the enclosed thermal volume.

Assignees

• IBM

Inventors

• Corcoles-Gonzalez Antonio
• Gumann Patryk
• Chow Jerry M

Classifications

• F17C3/085 Primary

  Cryostats · CPC title

• F25B9/10 Primary

  with several cooling stages · CPC title

• F25B9/12

  using 3He-4He dilution · CPC title

• F25D19/006

  Thermal coupling structure or interface · CPC title

• F17C2203/0391

  by vacuum · CPC title