Cured material of thermal conductive silicone composition

Patent metadata

Field	Value
Publication number	US-2022220354-A1
Application number	US-201917296291-A
Country	US
Kind code	A1
Filing date	Oct 30, 2019
Priority date	Dec 4, 2018
Publication date	Jul 14, 2022
Grant date	—

Abstract

The present invention is a cured material of a thermal conductive silicone composition, the composition containing: 6 to 40 volume % of an organopolysiloxane as a component (A), and 60 to 94 volume % of a heat conductive filler as a component (B), the heat conductive filler containing; (B-i) unsintered crushed aluminum nitride having an average particle size of 40 μm or more and having 1 mass % or less of a fine powder with a particle size of 5 μm or less, and (B-ii) a heat conductive material other than the unsintered crushed aluminum nitride having an average particle size of 1 μm or more, where the component (B-ii) content is 30 to 65 volume %. This provides a cured material of a thermal conductive silicone composition excellent in handling properties and having a high thermal conductivity.

First claim

1 . A cured material of a thermal conductive silicone composition, wherein
the thermal conductive silicone composition comprises: 6 to 40 volume % of an organopolysiloxane as a component (A), and 60 to 94 volume % of a heat conductive filler as a component (B), the heat conductive filler comprising; (B-i) unsintered crushed aluminum nitride having an average particle size of 40 μm or more and having 1 mass % or less of a fine powder with a particle size of 5 μm or less, and (B-ii) a heat conductive material other than the unsintered crushed aluminum nitride having an average particle size of 1 μm or more, wherein the component (B-ii) content is 30 to 65 volume %.

2 . The cured material of the thermal conductive silicone composition according to claim 1 , wherein the crushed aluminum nitride contains, relative to one part by mass thereof,
0.6 to 0.9 parts by mass of crushed aluminum nitride having an average particle size of 70 μm or more and less than 90 μm, and 0.1 to 0.4 parts by mass of crushed aluminum nitride having an average particle size of 40 μm or more and less than 70 μm.

3 . The cured material of the thermal conductive silicone composition according to claim 1 or 2 , wherein the component (A) contains an organopolysiloxane having two or more alkenyl groups in a molecule thereof, and the component (B) contains;
16 to 19 volume % of (B-1) unsintered crushed aluminum nitride having an average particle size of 70 to 90 μm,
4 to 9 volume % of (B-2) unsintered crushed aluminum nitride having an average particle size of 40 to 60 μm,
5 to 9 volume % of (B-3) spherical alumina having an average particle size of 60 to 80 μm,
2 to 4 volume % of (B-4) spherical alumina having an average particle size of 35 to 55 μm,
16 to 20 volume % of (B-5) spherical alumina having an average particle size of 5 to 15 μm, and
21 to 29 volume % of (B-6) crushed alumina having an average particle size of 1 to 4 μm.

4 . The cured material of the thermal conductive silicone composition according to any one of claims 1 to 3 , further comprising 50 to 200 parts by mass of a component (C) relative to 100 parts by mass of the component (A), the component (C) being one or both of a component (C-1) and a component (C-2),
the component (C-1) being an alkoxysilane compound represented by the following general formula (1) and the component (C-2) being dimethylpolysiloxane represented by the following general formula (2) with one terminal of a molecular chain blocked with a trialkoxy group,
R 2 a R 3 b Si(OR 4 ) 4-a-b   (1)

wherein R 2 independently represents an alkyl group having 6 to 15 carbon atoms, R 3 independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms, R 4 represents an independent alkyl group having 1 to 6 carbon atoms, “a” represents an integer of 1 to 3, and “b” represents an integer of 0 to 2, where a+b is an integer of 1 to 3,

wherein R 5 independently represents an alkyl group having 1 to 6 carbon atoms, and “c” represents an integer of 5 to 100.

5 . The cured material of the thermal conductive silicone composition according to any one of claims 1 to 4 , having a thermal conductivity of 5 W/m·K or more.

6 . The cured material of the thermal conductive silicone composition according to any one of claims 1 to 5 , having an Asker C hardness of 50 or less.

Assignees

• Shinetsu Chemical Co

Inventors

• Ishihara Yasuhisa
• Endo Akihiro
• Tanaka Katsuyuki

Classifications

• C08K3/22 Primary

  of metals · CPC title

• C08G77/20

  containing silicon bound to unsaturated aliphatic groups · CPC title

• C08G77/12

  containing silicon bound to hydrogen · CPC title

• C08G77/18

  to alkoxy or aryloxy groups · CPC title

• C08K2201/014

  Additives containing two or more different additives of the same subgroup in C08K · CPC title