Thermally conductive composite and a method for preparing the same

Patent metadata

Field	Value
Publication number	US-2022220311-A1
Application number	US-202017604871-A
Country	US
Kind code	A1
Filing date	Apr 20, 2020
Priority date	Apr 24, 2019
Publication date	Jul 14, 2022
Grant date	—

Abstract

The purpose of the present invention is therefore to provide a thermally conductive composite tape which is in a form of sheet and, therefore, easy to handle, excellent in strength and electrical insulation, easily stick to an element or heat release-member, and shows strong adhesion to the heat-release member. The present invention provides a thermally conductive composite comprising a first thermally conductive adhesive layer, a reinforcing layer (A) layered on one surface of the first thermally conductive adhesive layer, and a second thermally conductive adhesive layer layered on a free surface of the reinforcing layer (A), wherein the first and second thermally conductive adhesive layers comprise, independently of each other, a silicone composition comprising the following components (a) to (e): 100 parts by mass of (a) linear or branched organopolysiloxane, 1,000 to 3,000 parts by mass of (b) thermally conductive filler, 100 to 500 parts by mass of (c) silicone resin, 1 to 10 parts by mass of (d) organohydrogenpolysiloxane, and 0.5 to 5 parts by mass of (e) organic peroxide.

First claim

1 . A thermally conductive composite comprising a first thermally conductive adhesive layer, a reinforcing layer (A) layered on one surface of the first thermally conductive adhesive layer, and a second thermally conductive adhesive layer layered on a free surface of the reinforcing layer (A),
wherein the first and second thermally conductive adhesive layers comprise, independently of each other, a silicone composition comprising the following components (a) to (e): 100 parts by mass of (a) linear or branched organopolysiloxane, 1,000 to 3,000 parts by mass of (b) thermally conductive filler, 100 to 500 parts by mass of (c) silicone resin, 1 to 10 parts by mass of (d) organohydrogenpolysiloxane, and 0.5 to 5 parts by mass of (e) organic peroxide.

2 . The thermally conductive composite according to claim 1 , wherein (c) silicone resin comprises R3SiO1/2 units and SiO4/2 units with a molar ratio of R3SiO1/2 units to SiO4/2 units of 0.1 to 3.0, wherein R is an unsubstituted or substituted monovalent hydrocarbon group having no aliphatic unsaturated bond.

3 . The thermally conductive composite according to claim 1 or 2 , further comprising (0 at least one selected from the following components (f-1) and (f-2) in an amount of 1 to 20 parts by mass;
(f-1) alkoxysilane compound represented by the following general formula (1):
R2aR3bSi(OR4)4-a-b   (1)

wherein R2 is, independently of each other, an alkyl group having 6 to 15 carbon atoms, R3 is, independently of each other, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, R4 is, independently of each other, an alkyl group having 1 to 6 carbon atoms, “a” is an integer of 1 to 3, and b is an integer of 0 to 2, provided that a total of a and b is an integer of 1 to 3,
(f-2) dimethylpolysiloxane represented by the following general formula (2):

wherein R5 is, independently of each other, an alkyl group having 1 to 6 carbon atoms and c is an integer of 5 to 100.

4 . The thermally conductive composite according to claim 1 , wherein the reinforcing layer (A) is a synthetic resin layer or a glass cloth.

5 . The thermally conductive composite according to claim 4 , wherein the synthetic resin is selected from aromatic polyimides, polyamides, polyamide-imides, polyesters and fluorinated polymers.

6 . The thermally conductive composite according to claim 1 , having a thickness of 150 to 500 μm.

7 . The thermally conductive composite according to claim 1 , wherein the thermally conductive filler (b) is at least one selected from the group consisting of metals, metal oxides and metal nitrides.

8 . The thermally conductive composite according to claim 1 , wherein the thermally conductive composite further comprises a substrate surface-treated with a release agent with the treated surface of the substrate being in contact with the free surface of at least one of the first and second thermally conductive adhesive layers.

9 . The thermally conductive composite according to claim 8 , wherein the release agent is a fluorine-modified silicone having a fluorine substituent bonding to a main chain of the silicone.

10 . A method for preparing the thermally conductive composite according to claim 1 , the method comprises steps of layering the first and second thermally conductive adhesive layers, respectively, on surfaces of the reinforcing layer (A), and bonding each conductive adhesive layer to each surface of the reinforcing layer under pressure at room temperature or under heating and pressure to obtain the thermally conductive composite.

11 . The thermally conductive composite according to claim 2 , further comprising (f) at least one selected from the following components (f-1) and (f-2) in an amount of 1 to 20 parts by mass;
(f-1) alkoxysilane compound represented by the following general formula (1):
R2aR3bSi(OR4)4-a-b   (1)

wherein R2 is, independently of each other, an alkyl group having 6 to 15 carbon atoms, R3 is, independently of each other, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, R4 is, independently of each other, an alkyl group having 1 to 6 carbon atoms, “a” is an integer of 1 to 3, and b is an integer of 0 to 2, provided that a total of a and b is an integer of 1 to 3,
(f-2) dimethylpolysiloxane represented by the following general formula (2):

wherein R5 is, independently of each other, an alkyl group having 1 to 6 carbon atoms and c is an integer of 5 to 100.

12 . The thermally conductive composite according to 11, wherein the reinforcing layer (A) is a synthetic resin layer or a glass cloth.

13 . The thermally conductive composite according to claim 2 , wherein the reinforcing layer (A) is a synthetic resin layer or a glass cloth.

14 . The thermally conductive composite according to claim 3 , wherein the reinforcing layer (A) is a synthetic resin layer or a glass cloth.

15 . The thermally conductive composite according to claim 2 , having a thickness of 150 to 500 μm.

16 . The thermally conductive composite according to claim 3 , having a thickness of 150 to 500 μm.

17 . The thermally conductive composite according to claim 4 , having a thickness of 150 to 500 μm.

18 . The thermally conductive composite according to claim 5 , having a thickness of 150 to 500 μm.

19 . The thermally conductive composite according to claim 2 , wherein the thermally conductive filler (b) is at least one selected from the group consisting of metals, metal oxides and metal nitrides.

20 . The thermally conductive composite according to claim 3 , wherein the thermally conductive filler (b) is at least one selected from the group consisting of metals, metal oxides and metal nitrides.

Assignees

• Shinetsu Chemical Co

Inventors

• Ito Takanori
• Endo Akihiro

Classifications

• C08K3/22

  of metals · CPC title

• C09J7/30 Primary

  characterised by the adhesive composition · CPC title

• C09J7/38 Primary

  Pressure-sensitive adhesives [PSA] · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C09J183/04

  Polysiloxanes · CPC title