Control device for a motor vehicle

Patent metadata

Field	Value
Publication number	US-2022201868-A1
Application number	US-202217654189-A
Country	US
Kind code	A1
Filing date	Mar 9, 2022
Priority date	Sep 11, 2019
Publication date	Jun 23, 2022
Grant date	—

Abstract

A control device for a motor vehicle is provided. The control device includes a printed circuit board having a first side and an edge. The first side of the printed circuit board is delimited by the edge. The control device includes at least one electronic component arranged on the first side of the printed circuit board and electrically conductively connected to the printed circuit board). The control device also includes a first conductor loop formed as a resistor and arranged on the first side of the printed circuit board. The first conductor loop is arranged between the edge and the electronic component. The control device also includes an encapsulation of the printed circuit board. The encapsulation surrounds at least the first side, the at least one electronic component and the first conductor loop.

First claim

What is claimed is:

1 . A control device for a motor vehicle, the control device comprising:
a printed circuit board having a first side and an edge, the first side of the printed circuit board is delimited by the edge; at least one electronic component arranged on the first side of the printed circuit board and is electrically conductively connected to the printed circuit board; a first conductor loop arranged on the first side of the printed circuit board, the first conductor loop arranged between the edge and the electronic component; and an encapsulation of the printed circuit board, the encapsulation surrounding at least the first side, the at least one electronic component and the first conductor loop.

2 . The control device of claim 1 , wherein the first conductor loop is open and is wired by a through-plating for a four-point resistance measurement.

3 . The control device of claim 1 , wherein the printed circuit board includes:
a second side arranged at a distance from the first side and is delimited by the edge; and a second conductor loop arranged at a distance from the edge on the second side.

4 . The control device of claim 3 , wherein the printed circuit board is arranged on a base plate via an intermediate layer, the intermediate layer arranged between the second side and the base plate.

5 . The control device of claim 3 , wherein a plurality of first conductor loops arranged at a distance from one another are arranged on the first side, and/or a plurality of second conductor loops arranged at a distance from one another are arranged on the second side.

6 . The control device of claim 1 , wherein the first conductor loop and/or the second conductor loop contain/contains silver, brass, copper and/or a silver alloy.

7 . The control device of claim 1 , wherein a width and/or thickness of the first conductor loop and/or the second conductor loop are/is less than 500 μm.

8 . The control device of claim 1 , wherein the control device is formed without a housing.

9 . The control device of claim 1 , wherein the first conductor loop and/or second conductor loop include contact point having an electrical voltage applied to them via a plug-in connector and/or a plug of the printed circuit board to detect and/or to determine the respective line resistance of the first conductor loop and/or the second conductor loop.

10 . A motor vehicle comprising a control device as claimed in claim 1 .

11 . The motor vehicle of claim 10 , wherein a warning signal is outputted when there is a change in a resistance of the first conductor loop and/or a second conductor loop.

Assignees

• Vitesco Technologies Germany Gmbh

Inventors

• Bock Johannes
• Brunner Johannes
• Walda Christian
• Beart Karin
• Heinrich Jens

Classifications

• H05K1/0268 Primary

  for electrical inspection or testing · CPC title

• H05K1/0209

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• H05K2203/1316

  Moulded encapsulation of mounted components · CPC title

• H05K2203/1327

  Moulding over PCB locally or completely · CPC title

• H05K5/0034

  having an overmolded housing covering the PCB · CPC title