Structured discrete beam formation for cutting transparent substrates

Patent metadata

Field	Value
Publication number	US-2022193821-A1
Application number	US-202117556655-A
Country	US
Kind code	A1
Filing date	Dec 20, 2021
Priority date	Dec 21, 2020
Publication date	Jun 23, 2022
Grant date	—

Abstract

A method includes emitting an ultra-short pulse laser beam from a laser source. The method also includes forming the laser beam into a plurality of discrete beams via an optical array, where intersecting discrete beams form a structured light pattern comprising a plurality of voxels. A first subset of the plurality of voxels defining a line and a second subset of the plurality of voxels lie outside the line. The method also includes forming a plurality of voids in a substrate by aligning the structured light pattern onto the substrate, each voxel of the plurality of voxels forming a discrete void in the substrate, each void separated by the substrate. The method includes, after forming the plurality of voids in the substrate at a plurality of different positions, forming an article by separating one portion of the substrate from a base portion of the substrate.

First claim

What is claimed is:

1 . A method comprising:
emitting an ultra-short pulse laser beam from a laser source; forming the laser beam into a plurality of discrete beams via an optical array, wherein intersecting discrete beams form a structured light pattern comprising a plurality of voxels, a first subset of the plurality of voxels defining a line and a second subset of the plurality of voxels lying outside the line; forming a plurality of voids in a substrate by aligning the structured light pattern onto the substrate, each voxel of the plurality of voxels forming a discrete void in the substrate, each void separated by the substrate; and after forming the plurality of voids in the substrate at a plurality of different positions, forming an article by separating one portion of the substrate from a base portion of the substrate.

2 . The method of claim 1 , wherein the article includes a vertical edge defined by the line.

3 . The method of claim 2 , wherein the article includes a top surface defining a horizontal plane, wherein the vertical edge is perpendicular to the horizontal plane, and wherein a chamfer surface connecting the top surface and the edge surface is defined by the second subset of voxels.

4 . The method of claim 3 , wherein the chamfer surface is a first chamfer surface, wherein the plurality of discrete beams form a third subset of voxels lying outside the line, and a second chamfer surface connecting a bottom surface of the article and the edge surface is defined by the third subset of voxels.

5 . The method of claim 1 , further comprising translating the optical array relative to the substrate.

6 . The method of claim 5 , further comprising rotating a polarization of the laser beam by rotating a polarization rotator of the optical array.

7 . The method of claim 1 , wherein the first and second subset of voxels are tube-shaped.

8 . The method of claim 1 , wherein the optics array includes a spatial light modulator or diffractive optics that is configured to form the plurality of discrete beams from the laser beam.

9 . The method of claim 1 , further comprising:
translating the optical array relative to the substrate in a circular path defined by a plurality of positions; and forming a respective plurality of voids at each position of the plurality of positions.

Assignees

• Seagate Technology Llc

Inventors

• Ahner Joachim
• Tung David

Classifications

• B23K26/0676

  into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations · CPC title

• B23K26/0648

  comprising lenses · CPC title

• B23K2103/54

  Glass · CPC title

• B23K26/53

  for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title

• B23K26/0624 Primary

  using ultrashort pulses, i.e. pulses of 1 ns or less · CPC title