Combination of carrier-magnetic-separation and a further separation for mineral processing
US-2021316316-A1 · Oct 14, 2021 · US
Method for processing electronic/electrical device component scraps
US2022176415A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022176415-A1 |
| Application number | US-202017599226-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 27, 2020 |
| Priority date | Mar 29, 2019 |
| Publication date | Jun 9, 2022 |
| Grant date | — |
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- Title
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Abstract
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Provided is a method for processing electronic and electrical device component scrap, which can improve an efficiency of sorting of raw materials fed to the smelting step from electronic and electrical device component scrap, and reduce losses of valuable metals. A method for processing electronic and electrical device component scrap which includes removing powdery objects contained in electronic and electrical device component scrap prior to a step of separating non-metal objects or metal objects from the electronic and electrical device component scrap containing the metal objects and the non-metal objects, using a metal sorter including: a metal sensor, a color camera, an air valve, and a conveyor.
First claim
Opening claim text (preview).
1 . A method for processing electronic and electrical device component scrap, comprising removing powdery objects contained in electronic and electrical device component scrap prior to a step of separating non-metal objects or metal objects from the electronic and electrical device component scrap containing the metal objects and the non-metal objects, using a metal sorter comprising: a metal sensor, a color camera, an air valve, and a conveyor. 2 . The method for processing electronic and electrical device component scrap according to claim 1 , wherein the powdery objects have a particle size of 5 mm or less. 3 . The method for processing electronic and electrical device component scrap according to claim 1 , wherein an amount of the powdery objects after the step of removing the powdery objects contained in the electronic and electrical device component scrap is 1% or less by mass with respect to the total amount of the electronic and electrical device component scrap before the step of removing the powdery objects. 4 . The method for processing electronic and electrical device component scrap according to claim 1 , wherein the removing of the powdery objects comprises using either wind power sorting or sieving sorting. 5 . The method for processing electronic and electrical device component scrap according to claim 4 , wherein the wind power sorting is carried out at a wind velocity of from 5 to 8 m/s. 6 . The method for processing electronic and electrical device component scrap according to claim 4 , wherein the sieve sorting is carried out at a mesh opening of from 2 to 5 mm. 7 . The method for processing electronic and electrical device component scrap according to claim 1 , wherein the method comprises removing the powdery objects contained in the electronic and electrical device component scrap immediately after at least one of crushing, sieving, magnetic sorting, or color sorting.
Assignees
Inventors
Classifications
Separation by a physical processing technique only, e.g. by mechanical breaking · CPC title
Dry processes · CPC title
Shredding, crushing or cutting · CPC title
- B03B9/00Primary
General arrangement of separating plant, e.g. flow sheets · CPC title
Preliminary treatment of scrap (C22B1/02 - C22B1/26 take precedence) · CPC title
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Frequently asked questions
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- What does patent US2022176415A1 cover?
- Provided is a method for processing electronic and electrical device component scrap, which can improve an efficiency of sorting of raw materials fed to the smelting step from electronic and electrical device component scrap, and reduce losses of valuable metals. A method for processing electronic and electrical device component scrap which includes removing powdery objects contained in electro…
- Who is the assignee on this patent?
- Jx Nippon Mining & Metals Corp
- What technology area does this patent fall under?
- Primary CPC classification B03B9/00. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Jun 09 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).