Radiation sensor with an integrated mechanical optical modulator and related manufacturing process

Patent metadata

Field	Value
Publication number	US-2022163383-A1
Application number	US-202117530785-A
Country	US
Kind code	A1
Filing date	Nov 19, 2021
Priority date	Nov 20, 2020
Publication date	May 26, 2022
Grant date	—

Abstract

Radiation sensor including a detection assembly and a chopper assembly, which are mechanically coupled to delimit a main cavity; and wherein the chopper assembly includes: a suspended movable structure, which extends in the main cavity; and an actuation structure, which is electrically controllable to cause a change of position of the suspended movable structure. The detection unit includes a detection structure, which faces the main cavity and includes a number of detection devices. The suspended movable structure includes a first shield of conductive material, which shields the detection devices from the radiation, the shielding of the detection devices being a function of the position of the suspended movable structure.

First claim

1 . A radiation sensor comprising:
a detection assembly and a chopper assembly, the detection assembly and the chopper assembly mechanically coupled to delimit a main cavity, wherein the chopper assembly comprises:
a suspended movable structure in the main cavity; and
an actuation structure configured to be electrically controlled to cause a change of position of the suspended movable structure,
wherein the detection assembly comprises a detection structure facing the main cavity and including a plurality of detection devices, and wherein the suspended movable structure comprises a first shield of conductive material, the first shield being configured to shield the plurality of detection devices from the radiation, the shielding of the plurality of detection devices being a function of a position of the suspended movable structure.

2 . The radiation sensor according to claim 1 , wherein the chopper assembly comprises a fixed body and a deformable structure, the suspended movable structure being coupled to the fixed body of the chopper assembly through interposition of the deformable structure, wherein the actuation structure is electrically controllable to cause a movement of the suspended movable structure with respect to the fixed body of the chopper assembly and a resulting deformation of the deformable structure.

3 . The radiation sensor according to claim 2 , wherein the plurality of detection devices have a planar arrangement; and wherein the actuation structure is configured to move the suspended movable structure in parallel with the planar arrangement.

4 . The radiation sensor according to claim 2 , wherein the detection assembly comprises a main semiconductor body laterally delimiting a detection cavity, and an outer body fixed to the main semiconductor body, wherein the detection structure is fixed to the main semiconductor body and is suspended at the detection cavity, the detection cavity being closed at the bottom by the outer body.

5 . The radiation sensor according to claim 2 , wherein the detection assembly comprises a main semiconductor body, and wherein the detection structure is integrated on the main semiconductor body.

6 . The radiation sensor according to claim 4 , wherein the chopper assembly further comprises a partially transmissive second shield fixed on the fixed body of the chopper assembly and has a shape such that shielding of the plurality of detection devices depends on the position of the suspended movable structure with respect to the detection structure and on the position of the suspended movable structure with respect to the second shield.

7 . The radiation sensor according to claim 2 , wherein the suspended movable structure extends below the fixed body of the chopper assembly, wherein the chopper assembly comprises a second shield arranged on top of the fixed body of the chopper assembly and is partially transmissive, wherein the detection structure is laterally offset with respect to the suspended movable structure, the suspended movable structure is configured in such a way to receive radiation after radiation has impinged on the second shield and has passed through the second shield and the fixed body of the chopper assembly, the suspended movable structure being configured to chromatically scatter the received radiation to direct towards each detection device radiation having a wavelength that depends on the lateral offset of the detection device with respect to the suspended movable structure; and wherein the first and the second shields are configured to attenuate the radiation that impinges on the second shield as a function of the position of the suspended movable structure with respect to the second shield.

8 . The radiation sensor according to claim 7 , wherein the detection assembly comprises a main semiconductor body, the main semiconductor body laterally delimits a part of the main cavity, wherein the main cavity is closed at the bottom by the detection structure, the detection structure being bonded under the main semiconductor body.

9 . The radiation sensor according to claim 7 , wherein the detection assembly comprises a main semiconductor body and a spacer, and wherein the spacer is interposed between the fixed body of the chopper assembly and the main semiconductor body of the detection assembly and laterally delimits part of the main cavity, the main cavity being closed at the bottom by the detection structure, the detection structure is integrated on the main semiconductor body of the detection assembly.

10 . A device, comprising:
a radiation sensor comprising:
a detection assembly coupled to a chopper assembly, the detection assembly and the chopper assembly delimiting a main cavity, wherein the chopper assembly comprises:
a suspended movable structure in the main cavity; and
an actuation structure configured to be electrically controlled to cause a change of position of the suspended movable structure,

wherein the detection assembly comprises a detection structure facing the main cavity and including a plurality of detection devices, and
wherein the suspended movable structure comprises a first shield of conductive material, the first shield being configured to shield the plurality of detection devices from the radiation, the shielding of the plurality of detection devices being a function of a position of the suspended movable structure,
a package comprising a packaging structure that is optically opaque and delimits an accommodation cavity overlaid by an opening; and a lens covering the opening, wherein the radiation sensor is arranged inside the accommodation cavity, the lens being positioned and configured to focus radiation to the radiation sensor.

11 . The device according to claim 10 , wherein the chopper assembly comprises a fixed body and a deformable structure, the suspended movable structure being coupled to the fixed body of the chopper assembly through interposition of the deformable structure.

12 . The device according to claim 11 , wherein the actuation structure is electrically controllable to cause a movement of the suspended movable structure with respect to the fixed body of the chopper assembly and a resulting deformation of the deformable structure.

13 . The device according to claim 12 , wherein the chopper assembly further comprises a partially transmissive second shield fixed on the fixed body of the chopper assembly and has a shape such that shielding of the plurality of detection devices depends on the position of the suspended movable structure with respect to the detection structure and on the position of the suspended movable structure with respect to the second shield.

14 . The device according to claim 10 , wherein the detection assembly comprises a main semiconductor body, the main semiconductor body laterally delimits a part of the main cavity, wherein the main cavity is closed at the bottom by the detection structure, the detection structure being bonded under the main semiconductor body.

15 . A process of manufacturing a radiation sensor comprising:
forming a detection assembly and a chopper assembly; and mechanically coupling the detection assembly and the chopper assembly so that the detection assembly and the chopper assembly delimit a main cavity, wherein the forming the chopper assembly comprises:
forming a suspended movable structure in the main cavity; and
forming an actuation structure that is electrically controllable to cause a change of position of the suspended movable structure,
wherein the forming the detection assembly comprises forming a detection structure including a plurality of

Assignees

• St Microelectronics Srl

Inventors

• Vaiana Michele
• Duqi Enri
• Castagna Maria Eloisa

Classifications

• G01J5/02 Primary

  Constructional details · CPC title

• H10H20/862

  Resonant cavity structures (formed by reflecting means in the bodies H10H20/8142) · CPC title

• G01J1/36 Primary

  using electric radiation detectors · CPC title

• G01J3/0232 Primary

  using shutters · CPC title

• G01J3/027

  Control of working procedures of a spectrometer; Failure detection; Bandwidth calculation · CPC title