Measurement system, substrate processing system, and device manufacturing method

Patent metadata

Field	Value
Publication number	US-2022155062-A1
Application number	US-202217665638-A
Country	US
Kind code	A1
Filing date	Feb 7, 2022
Priority date	Aug 24, 2016
Publication date	May 19, 2022
Grant date	—

Abstract

A measurement system to be used in a micro-device manufacturing line is equipped with: a plurality of measurement devices which performs measurement processing on each substrate; and a controller that can control the plurality of measurement devices, and the plurality of measurement devices includes at least one first measurement device which acquires position information of a plurality of marks formed on a substrate.

First claim

What is claimed is:

1 . A measurement system used in a manufacturing line for micro-devices, comprising:
a plurality of measurement devices, each of which performs measurement processing on a substrate; and a controller which can control the plurality of measurement devices, wherein the plurality of measurement devices includes at least one first measurement device which acquires position information of a plurality of marks formed on the substrate.

Assignees

• Nikon Corp

Inventors

• Ichinose Go
• Shibazaki Yuichi

Classifications

• G03F7/70775 Primary

  Position control, e.g. interferometers or encoders for determining the stage position · CPC title

• H10P72/50

  for positioning, orientation or alignment · CPC title

• H10P72/57

  Mask-wafer alignment · CPC title

• G01B2210/56

  Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth · CPC title

• G03F7/2041

  in the presence of a fluid, e.g. immersion; using fluid cooling means · CPC title